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Method and connection arrangement for producing a smart card

  • US 6,190,942 B1
  • Filed: 06/09/1999
  • Issued: 02/20/2001
  • Est. Priority Date: 10/09/1996
  • Status: Expired due to Term
First Claim
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1. A connecting arrangement for producing a chip card comprising a module having a semiconductor chip and a card carrier with an opening for receiving the module, characterized in that formed with the module is a first coil which is electrically connected to terminals of the semiconductor chip and that formed with the card carrier is a second coil, wherein after insertion of the module into the opening an inductive coupling results and that in addition there is an electrical connection to a third coil provided in the card carrier for wireless interconnecting with the surroundings.

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