Proportional integral cooling device controller for electronic device

• US 6,191,546 B1
• Filed: 10/01/1999
• Issued: 02/20/2001
• Est. Priority Date: 10/22/1997
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Van Brocklin, Andrew L, Stryker, Chadwick W, Bausch, James F.
• Primary Examiner(s): Ro, Bentsu
• Application Number:
  US09/411,361
• Time in Patent Office: 508 Days
• Field of Search: 318/268, 318/272, 318/456, 318/461, 318/471, 318/621, 318/620, 318/445, 318/449, 318/452, 318/484, 318/473, 318/53, 318/59, 318/66, 318/112, 388/907.5, 388/934, 388/921
• US Class Current: 318/471
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: G06F 11/3024 where the computing system component is a central processing unit [CPU]
• CPC Class Codes: G06F 11/3058 Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations thermal management in cooling arrangements of a computing system G06F1/206
• CPC Class Codes: G06F 11/3093 Configuration details thereof, e.g. installation, enabling, spatial arrangement of the probes
• CPC Class Codes: H05K 7/20209 Thermal management, e.g. fan control
• CPC Class Codes: Y10S 388/921 Timer or time delay means
• CPC Class Codes: Y10S 388/934 Thermal condition

Abstract

An electronic device has a heat producing component thermally coupled to a heat dissipation structure. The electronic device further has control circuitry connected to a temperature sensor that senses the component temperature of the heat producing component. The control circuit is further connected to a cooling device also thermally coupled to the heat dissipation structure. The control circuit varies the cooling rate in a manner that cancels out a lag time which occurs during a change from a steady state condition of the component temperature. The cooling rate of the cooling device is varied by the control circuit in proportion to variation in sensed component temperature from the temperature sensor.

Claims

1. An electronic device, comprising:

a heat producing component having a component temperature;

a cooling device having a cooling rate and a rate of change of the cooling rate;

a temperature sensor for sensing the component temperature of said heat producing component;

a heat dissipation structure thermally coupled to said heat producing component and to said cooling device, wherein said component temperature exhibits a lag time from said rate of change of the cooling rate of said cooling device; and

control circuitry connected to said temperature sensor and said cooling device, said control circuitry varying the cooling rate in a manner which cancels out the lag time during a change from a steady state condition of the component temperature, wherein during the steady state condition of the component temperature, the cooling rate of said cooling device varies in proportion to variation in sensed component temperature.

2. The electronic device of claim 1, further comprising:

a case having a local environment temperature substantially affected by thermal radiation from said heat dissipation structure and said cooling device;

an additional temperature sensor for sensing the local environment temperature, said additional temperature sensor connected to said control circuitry; and

wherein said control circuitry incorporates said additional temperature sensor into varying the cooling rate.

3. The electronic device of claim 1, wherein said temperature sensor comprises a digital output.

4. The electronic device of claim 1, wherein said control circuitry comprises a microprocessor.

5. The electronic device of claim 1, wherein said heat producing component is an integrated circuit having a die surface and wherein said component temperature is measured on the die surface.

6. The electronic device of claim 1, wherein said control circuitry comprises a digital to analog converter.

7. The electronic device of claim 6, wherein said digital to analog converter comprises a quantization error filter.

8. The electronic device of claim 1, wherein said control circuitry comprises means for detecting said lag time and thereafter incorporating the detected lag time in said control circuitry.

9. A method for controlling the component temperature of a heat producing component with a cooling device, the component temperature exhibiting a lag time in response from a rate of change of a cooling rate of the cooling device, the method comprising the steps of:

detecting the difference between the temperature of the heat producing component and a reference temperature, thereby creating a difference temperature;

filtering the difference temperature to compensate for said lag time thereby creating a compensated signal; and

controlling the cooling device with said compensated signal wherein during a steady state condition of the component temperature, the rate of change of the cooling rate of the cooling device varies in proportion to sensed component temperature.

10. The method of claim 9, wherein the step of detecting further comprises the steps of:

sampling the heat producing component with a digital thermistor thereby creating a digital reading, and

subtracting the reference temperature from said digital reading thereby creating said difference temperature.

11. The method of claim 9, wherein the step of filtering further comprises the step of digitally filtering said difference temperature with a microprocessor.

12. The method of claim 11, wherein the step of digitally filtering further comprises the steps of:

detecting the lag time in response from the rate of change of the cooling rate of the cooling device thereby creating a detected lag time; and

incorporating said detected lag time into said step of digitally filtering.

13. The method of claim 11, wherein the step of digitally filtering further comprises the step of filtering quantization noise from said compensated signal.

14. The method of claim 13, wherein the step of filtering quantization noise further comprises the step of delta-sigma modulating said compensated signal.

15. The method of claim 9, wherein the heat producing component includes a heat dissipation structure thermally coupled to the heat producing component, the method further comprising the steps of:

reading the temperature of the heat dissipation structure thereby creating a structure temperature; and

incorporating the structure temperature into the step of controlling the cooling device.

16. The method of claim 15, wherein the step of incorporating the structure temperature further comprises using the structure temperature for the reference temperature.

17. The method of claim 16, wherein the step of incorporating the structure temperature further comprises the steps of:

determining if the structure temperature has exceed a predetermined limit; and

if so alerting that the structure temperature has exceeded the predetermined limit.

18. The method of claim 17, wherein the step of alerting further comprises the step of enabling a second cooling device, the second cooling device thermally coupled to said heat producing component.

19. An electronic device having a control circuit using the method of claim 9, the electronic device further comprising:

at least one heat producing component having a temperature sensor coupled to the control circuit; and

at least one cooling device thermally coupled to said heat producing component and electrically coupled to the control circuit.

20. An apparatus for cooling a heat producing component with a cooling device using the method of claim 9.