Monolithic micromechanical apparatus with suspended microstructure

• US 6,192,757 B1
• Filed: 12/06/1999
• Issued: 02/27/2001
• Est. Priority Date: 08/17/1990
• Status: Expired due to Fees

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Brokaw, A. Paul, Sherman, Steven J., Tsang, Robert W. K., Core, Theresa A.
• Primary Examiner(s): CHAPMAN JR, JOHN E
• Application Number:
  US09/457,200
• Time in Patent Office: 449 Days
• Field of Search: 735/141.8, 735/142.4, 735/143.2, 735/143.8, 361/280, 361/283.1, 361/283.3
• US Class Current: 73/514.32
• CPC Class Codes: B81B 3/001 Structures having a reduced contact area, e.g. with bumps or with a textured surface
• CPC Class Codes: B81C 1/00214 Processes for the simultaneaous manufacturing of a network or an array of similar microstructural devices
• CPC Class Codes: B81C 1/00246 Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
• CPC Class Codes: B81C 1/0092 For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
• CPC Class Codes: B81C 2201/112 Depositing an anti-stiction or passivation coating, e.g. on the elastic or moving parts
• CPC Class Codes: B81C 2203/0735 Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit
• CPC Class Codes: B81C 2203/0742 Interleave, i.e. simultaneously forming the micromechanical structure and the CMOS circuit
• CPC Class Codes: B81C 99/0035 Testing
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/131 with electrostatic counterbalancing means
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type

Abstract

A monolithic capacitance-type microstructure includes a semiconductor substrate, a plurality of posts extending from the surface of the substrate, a bridge suspended from the posts, and an electrically-conductive, substantially stationary element anchored to the substrate. The bridge includes an element that is laterally movable with respect to the surface of the substrate. The substantially stationary element is positioned relative to the laterally movable element such that the laterally movable element and the substantially stationary element form a capacitor. Circuitry is disposed on the substrate and operationally coupled to the movable element and the substantially stationary element for processing a signal based on a relative positioning of the movable element and the substantially stationary element. A method for fabricating the microstructure and the circuitry is disclosed.

Claims

1. A monolithic capacitance-type acceleration sensor comprising first and second capacitors, each having first and second electrodes, in each of the capacitors, a first one of the electrodes being movable relative to a second one of the electrodes in response to applied acceleration, characterized by;

said first electrode of said first capacitor being connected electrically to said first electrode of said second capacitor, forming a differential capacitor arrangement,

the electrodes all being formed of polysilicon members suspended above a silicon substrate, and

resolving circuitry on said substrate and coupled to said electrodes for generating in response to movement of said movable first electrodes, a signal indicative of acceleration.

2. An acceleration sensor according to claim 1, wherein all of the capacitor electrodes are physically oriented in parallel, the first electrodes being movable responsive to force applied between the first electrodes and the substrate along an axis normal to that defined by the electrodes.

3. An acceleration sensor according to claim 1, wherein each of the capacitor electrodes is formed of a multiplicity of sections.

4. An acceleration sensor as set forth in claim 1, further comprising means for applying, to said first and second capacitors of the sensor, first and second carrier signals, respectively, 180 degrees out of phase with each other.

5. An acceleration sensor as set forth in claim 4, wherein the means for resolving includes means for operating the sensor in a force-balanced mode.

6. An acceleration sensor as set forth in claim 1, including a polysilicon bridge, said bridge comprising;

a plurality of posts extending from a surface of said substrate and suspending said polysilicon bridge above said substrate, said bridge further comprising a plurality of movable first fingers generally parallel to one another and extending transversely from a central beam, said first fingers comprising said first electrode of each said first and second capacitors, and wherein

said second electrode of each of said first and second capacitors comprises a plurality of generally parallel electrically conductive second fingers relative to which the first fingers are movable, each of said second fingers corresponding to one of said first fingers and positioned relative to said corresponding first finger such that said first finger and corresponding second finger form opposite plates of a capacitor,

whereby movement of said bridge under an accelerative force causes said first fingers to move relative to said second fingers and alter the capacitance between each of said first fingers and said corresponding second fingers.

7. An acceleration sensor as set forth in claim 6, wherein said substrate comprises an n+doped region beneath said bridge for reducing parasitic capacitance between the bridge and the substrate.

8. An acceleration sensor as set forth in claim 6, wherein;

said resolving circuitry is in an open loop configuration comprising;

means for generating first and second sinusoidal signals of equivalent amplitude and frequency and 180 degrees out of phase with each other,

means for supplying said first sinusoidal signal to said first capacitor,

means for supplying said second sinusoidal signal to said second capacitor,

a buffer amplifier having an input coupled to said first and second capacitors and an output, and

a demodulator having an input coupled to said output of said buffer amplifier and an output, whereby said output of said demodulator is a voltage representative of acceleration of said acceleration sensor.

9. An acceleration sensor as set forth in claim 8, wherein said output of said buffer amplifier is further coupled to an n+doped region beneath the bridge.

10. An acceleration sensor as set forth in claim 9, wherein said first and second sinusoidal voltages are coupled to said second fingers of said first and second collective capacitors, respectively, and wherein said first fingers of said first and second capacitors are coupled to said buffer amplifier.

11. An acceleration sensor as set forth in claim 6, wherein said resolving circuitry is in a closed loop configuration comprising;

means for generating first and second sinusoidal signals of equivalent amplitude and frequency and 180 degrees of phase with each other,

means for supplying said first sinusoidal signal to said first capacitor;

means for supplying said second sinusoidal signal to said second capacitor;

a buffer amplifier having an input coupled to said first and second capacitors and an output, and

a demodulator having an input coupled to said output of said buffer amplifier and an output coupled to said input of the buffer amplifier, whereby said output of said demodulator is fed back to said input of said buffer amplifier.

12. An acceleration sensor as set forth in claim 11, wherein said first and second sinusoidal signals are coupled to said first and second capacitors through third and fourth capacitors, respectively.

13. An acceleration sensor as set forth in claim 12, wherein the output of said buffer amplifier is further coupled to an n+doped region beneath the bridge.

14. An acceleration sensor as set forth in claim 13, wherein said sinusoidal voltages are coupled, through said third and fourth capacitors, respectively, to the second electrodes of said first and second capacitors, and wherein said first electrodes of said first and second capacitors are coupled to said buffer amplifier.

15. An acceleration sensor as set forth in claim 11, wherein said first capacitor is further coupled to a positive offset voltage (V_R) and said second capacitor is further coupled to a negative offset voltage (—

V_R).

16. An acceleration sensor as set forth in claim 11 further comprising a resistor coupled between the input of the buffer amplifier and a D.C. reference voltage, whereby a D.C. operating point is established for the acceleration sensor.

17. An acceleration sensor as set forth in claim 11, wherein said first capacitor is further coupled to a first terminal of a switch and a second terminal of said switch is coupled to ground, said switch normally being in an open position, wherein closure of said switch causes an unbalancing of said first and second capacitors, whereby the operation of said acceleration sensor can be tested.

18. An acceleration sensor as set forth in claim 11, further comprising a first trim resistor having a first terminal coupled to said output of said demodulator and a second terminal coupled to said input of said buffer amplifier, and a second trim resistor having a first terminal coupled to the second terminal of said first trim resistor and a second terminal coupled to ground, said first and second trim resistors providing means to set a DC operating point of said acceleration sensor.