Multi-function chamber for a substrate processing system

• US 6,193,507 B1
• Filed: 02/10/2000
• Issued: 02/27/2001
• Est. Priority Date: 05/20/1998
• Status: Expired due to Term

• Current Assignee: Applied Komatsu Technology, Inc. (Applied Materials Incorporated)
• Original Assignee: Applied Komatsu Technology, Inc. (Applied Materials Incorporated)
• Inventors: White, John M., Blonigan, Wendell T., Richter, Michael W.
• Primary Examiner(s): Ferensic, Denise L.
• Assistant Examiner(s): Wilson, Gregory A.
• Application Number:
  US09/502,117
• Time in Patent Office: 383 Days
• Field of Search: 432/4, 432/18, 432/129, 432/184, 432/243, 432/247, 414/217, 414/222, 414/225, 118/719, 118/724, 118/725, 118/728, 219/209, 219/390
• US Class Current: 432/247
• CPC Class Codes: H01L 21/67098 Apparatus for thermal treatment
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/67173 in-line arrangement
• CPC Class Codes: H01L 21/67201 characterized by the construction of the load-lock chamber
• CPC Class Codes: H01L 21/67236 the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
• CPC Class Codes: H01L 21/67248 Temperature monitoring
• CPC Class Codes: H01L 21/67748 horizontal transfer of a single workpiece

Abstract

A load lock chamber includes a chamber body having an aperture to allow a substrate to be transferred into or out of the chamber. The load lock chamber is configurable in several configurations, including a base configuration for providing a transition between two different pressures, a heating configuration for heating the substrate and providing a transition between two different pressures, and a cooling configuration for cooling the substrate and providing a transition between two different pressures. Various features of the chamber configurations help increase the throughput of the system by enabling rapid heating and cooling of substrates and simultaneous evacuation and venting of the chamber, and help compensate for thermal losses near the substrate edges, thereby providing a more uniform temperature across the substrate.

Claims

1. An evacuable chamber, comprising:

a chamber body having an aperture to allow a substrate to be transferred into or out of the chamber;

wherein the chamber is configurable using removable components in at least two of the following configurations;

a base configuration for providing a transition between two different pressures, a heating configuration for heating the substrate and providing a transition between two different pressures, and a cooling configuration for cooling the substrate and providing a transition between two different pressures; and

wherein when configured in the base configuration, the chamber further includes at least one removable volume reducing element disposed therein, when configured in the heating configuration, the chamber further includes an upper heating assembly and a heating platen, and when configured in the cooling configuration, the chamber further includes an upper cooling assembly and a cooling platen.

2. The chamber of claim 1 wherein the chamber is configurable in the base configuration, the heating configuration and the cooling configuration.

3. The chamber of claim 1 wherein the chamber can be re-configured from a first one of the configurations to a second one of the configurations.

4. The chamber of claim 1, wherein when configured in the base configuration, the chamber further includes upper and lower volume reducing elements, wherein the substrate support mechanism is disposed between the upper and lower volume reducing elements.

5. The chamber of claim 4 wherein the chamber is configured in the base configuration as an input chamber to provide a transition from atmospheric pressure to a process pressure.

6. The chamber of claim 4 wherein the chamber is configured in the base configuration as an output load lock chamber to provide a transition from a process pressure to atmospheric pressure.

7. The chamber of claim 1 further comprising:

a substrate support mechanism disposed within the chamber; and

a lid attached to the chamber body;

wherein, when in the heating configuration, the upper heating assembly is disposed between the lid and the substrate support mechanism; and

the heating platen is movable to lift a substrate positioned on the support mechanism to a heating position below the upper heating assembly, and to lower the substrate from the heating position onto the support mechanism.

8. The chamber of claim 7 wherein the chamber is configured as an input load lock chamber in the heating configuration to provide a transition from atmospheric pressure to a process pressure.

9. The chamber of claim 7 wherein the chamber is configurable as an ashing chamber.

10. The chamber of claim 9 wherein the chamber is configured as an output load lock chamber in the ashing configuration to provide a transition from a process pressure to atmospheric pressure.

11. The chamber of claim 1 further comprising:

a substrate support mechanism disposed within the chamber; and

a lid attached to the chamber body,

wherein, when in the cooling configuration, the upper cooling assembly is disposed between the lid and the substrate support mechanism; and

the cooling platen is movable to lift a substrate positioned on the support mechanism to a cooling position below the upper cooling assembly, and to lower the substrate from the cooling position onto the support mechanism.

12. The chamber of claim 11 wherein the chamber is configured as an output load lock chamber in the cooling configuration to provide a transition from a process pressure to atmospheric pressure.