×

Molding thermosetting polymers onto substrates

  • US 6,193,914 B1
  • Filed: 08/25/1997
  • Issued: 02/27/2001
  • Est. Priority Date: 11/30/1995
  • Status: Expired due to Fees
First Claim
Patent Images

1. A method of molding three dimensional bodies of thermosetting polymers onto substrates, comprising:

  • providing at least one supply of said polymer;

    positioning a substrate having a top surface and a bottom surface onto a heated surface;

    positioning a heated mold having at least one cavity onto said substrate in opposing relation to said heated surface;

    injecting a controlled amount of one of said at least one supply of said polymer into each said cavity of said heated mold to form at least one three dimensional body of said polymer;

    impregnating said substrate with said at least one supply of said polymer; and

    curing said at least one three dimensional body of said polymer prior to complete penetration of said polymer to form an attachment of said polymer between said top and bottom surfaces of said substrate.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×