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Low-profile microelectronic package

  • US 6,194,250 B1
  • Filed: 09/14/1998
  • Issued: 02/27/2001
  • Est. Priority Date: 09/14/1998
  • Status: Expired due to Term
First Claim
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1. A method for forming a microelectronic package, the method comprising:

  • placing a lead frame onto a molding support, the lead frame comprising a plurality of metallic leads, each said metallic lead comprising an end;

    positioning an integrated circuit die onto the molding support proximate to the ends of the metallic leads, the integrated circuit die comprising a non-active face resting against the molding support and an active face facing away from the molding support, the active face comprising die bond pads;

    connecting the die bond pads to the metallic leads with a plurality of wire leads;

    attaching a plurality of metallic bumps onto the metallic leads; and

    molding a polymeric material against the molding support to form a polymeric body and to concurrently embed the active face, the plurality of wire leads, and the metallic bumps except for a bonding surface of the metallic bumps within the polymeric body, whereby the microelectronic package comprises the metallic leads, the integrated circuit die, the wire leads, the metallic bumps, and the polymeric body.

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