Microelectronic assemblies with multiple leads

• US 6,194,291 B1
• Filed: 08/09/1999
• Issued: 02/27/2001
• Est. Priority Date: 07/07/1994
• Status: Expired due to Fees

• Current Assignee: Tessera, Inc. (Adeia Inc.)
• Original Assignee: Tessera, Inc. (Adeia Inc.)
• Inventors: Smith, John W., DiStefano, Thomas H.
• Primary Examiner(s): Smith, Matthew
• Assistant Examiner(s): KESHAVAN, BELUR V
• Application Number:
  US09/372,021
• Time in Patent Office: 568 Days
• Field of Search: 438/455, 438/458, 438/113, 438/125, 438/126, 438/127, 438/121, 438/123, 438/106, 257/666, 257/674, 257/676, 257/678, 257/687, 257/688, 257/689, 257/696, 257/693, 257/690, 257/692, 228/223, 357/79
• US Class Current: 438/455
• CPC Class Codes: H01L 21/4839 Assembly of a flat lead with an insulating support, e.g. for TAB
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/22 liquid at the normal operating temperature of the device
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 24/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01066 : Dysprosium [Dy]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15174 : in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H05K 1/118 : specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 2201/0133 : Elastomeric or compliant polymer
• CPC Class Codes: H05K 2201/0394 : Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2201/0397 : Tab
• CPC Class Codes: H05K 2201/09081 : Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
• CPC Class Codes: H05K 2201/091 : Locally and permanently deformed areas including dielectric material
• CPC Class Codes: H05K 2203/063 : of preperforated insulating layer
• CPC Class Codes: H05K 3/361 : Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 3/4084 : by deforming at least one of the conductive layers
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49158 : with molding of insulated base

Abstract

A microelectronic connection component includes a support such as a dielectric sheet having elongated leads extending along a surface. The leads have terminal ends permanently connected to the support and tip ends releasably connected to the support. The support is juxtaposed with a further element such as a semiconductor chip or wafer, and tip ends of the leads are bonded to contacts on the wafer using a bonding tool advanced through holes in the support. After bonding, the support and the further element are moved away from one another so as to deform the leads.

Claims

1. A method of making a microelectronic assembly comprising:

(a) juxtaposing a first element having a plurality of leads extending along a surface with a second element so that contacts on said second element are aligned with tip ends of the leads, said leads having terminal ends attached to the first element;

(b) bonding the tip ends of the leads to the contacts on the second element by advancing a bonding tool through holes in a support to engage the tip ends of the leads with the contacts;

(c) after said bonding step, moving the first and second elements through a preselected displacement so as to bend said tip ends away from said first element.

2. A method as claimed in claim 1 wherein said first element includes a dielectric support having top and bottom surfaces, said leads extending along said bottom surface of said support, said juxtaposing step including juxtaposing said bottom surface of said support with said second element.

3. A method as claimed in claim 2 wherein said second element includes one or more semiconductor chips.

4. A method as claimed in claim 3 wherein said second element includes a plurality of semiconductor chips.

5. A method as claimed in claim 4 further comprising severing said support and separating said chips from one another to form a plurality of individual units.

6. A method as claimed in claim 5 or claim 4 wherein said second element is a unitary wafer including a plurality of semiconductor chips.

7. A method as claimed in claim 2 further comprising introducing a flowable dielectric material between said elements and around the leads after the moving step and then curing the flowable material so as to form a dielectric support layer around the leads.

8. A method as claimed in claim 7 wherein said support layer in compliant.

9. A method as claimed in claim 7 further comprising applying a sealing sheet on the top surface of said support so as to close said holes before introduction of said flowable material.

10. A method as claimed in claim 9 wherein said step of applying a sealing sheet is performed before said moving step.

11. A method as claimed in claim 10 wherein said flowable material is injected between said support and said second element under pressure.

12. A method as claimed in claim 2 wherein said tip ends of said leads are initially secured to said first element and said tip ends of said leads are detached from said first element in said moving step.

13. A method as claimed in claim 12 wherein said tip ends of said leads are connected to said support by frangible elements, said frangible elements being broken during said moving step.

14. A method as claimed in claim 13 wherein the said frangible elements include frangible connections between the tip end of one lead and the terminal end of another lead.