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Printed circuit board with a multilayer integral thin-film metal resistor and method therefor

  • US 6,194,990 B1
  • Filed: 03/16/1999
  • Issued: 02/27/2001
  • Est. Priority Date: 03/16/1999
  • Status: Expired due to Fees
First Claim
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1. A printed circuit board comprising:

  • a substrate;

    a first electrically-resistive strip on the substrate, the first electrically-resistive strip having an input end, a perimeter and an output end;

    a dielectric layer overlying the first electrically-resistive strip, said dielectric layer being formed of a positive-acting photodielectric material and having a perimeter;

    a second electrically-resistive strip on the dielectric layer, the second electrically-resistive strip having an input end, a perimeter, and an output end, the perimeter of the first electrically-resistive strip being superimposed by the perimeter of the second electrically-resistive strip and the perimeter of dielectric layer, and the input end of the first electrically-resistive strip being superimposed by the output end of the second electrically-resistive strip and the output end of the first electrically-resistive strip being superimposed by the input end of the second electrically-resistive strip; and

    means for electrically interconnecting the output end of the first electrically-resistive strip and the input end of the second electrically-resistive strip so as to define a resistor path that starts at the input end of the first electrically-resistive strip, follows the first electrically-resistive strip to the output end thereof, continues to the input end of the second electrically-resistive strip through the interconnecting means, and then follows the second electrically-resistive strip to the output end thereof.

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