Microstrip antenna and method of forming same

• US 6,195,051 B1
• Filed: 04/13/2000
• Issued: 02/27/2001
• Est. Priority Date: 04/08/1999
• Status: Active Grant

• Current Assignee: Motorola Solutions, Inc.
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Faraone, Antonio, McCoy, Danny O.
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): VANNUCCI, JAMES
• Application Number:
  US09/548,486
• Time in Patent Office: 320 Days
• Field of Search: 343/700 MS, 343/846, 343/848
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 1/084 Pivotable antennas
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 9/0421 with a shorting wall or a shorting pin at one end of the element H01Q9/0414 takes precedence

Abstract

A microstrip antenna (300) includes a substrate (302) having an inner ground plane layer (322) around which a radiator element is folded so as to form first and second radiator patches (310, 312) on either side of the ground plane.

Claims

1. A microstrip antenna, comprising:

a substrate having top, bottom, and edge surfaces and an inner ground plane layer; and

a radiator element folded about the edge of the substrate so as to form first and second patches on either side of the ground plane on the top and bottom surfaces of the substrate.

2. A microstrip antenna, comprising:

a substrate having top, bottom, and edge surfaces and an inner ground plane layer; and

a radiator element folded about the edge of the substrate so as to form first and second quarter wavelength patches on the top and bottom surfaces of the substrate on either side of the ground plane, the radiator element providing the characteristics of a loop antenna and a dipole antenna so as to generate a substantially spherical radiation pattern.

3. A communication device, comprising:

a housing;

a microstrip antenna coupled to the housing, the microstrip antenna comprising;

a substrate having top bottom and edge surfaces and an inner ground plane layer; and

first and second radiator patches disposed on the top and bottom surfaces of the substrate over opposed surfaces of the ground plane layer, the first radiator patch coupled to the second radiator patch along one edge of the substrate.

4. A communication device as described in claim 3, wherein the first and second radiator patches comprise first and second quarter wavelength patches respectively.

5. A communication device as described in claim 3, wherein the first and second radiator patches are coupled through capacitive coupling.

6. A communication device as described in claim 3, wherein the first and second radiator patches are coupled through conductive paint.

7. A communication device as described in claim 3, wherein the first and second radiator patches are coupled through vias.

8. A communication device as described in claim 3,

wherein the first and second radiator patches are coupled through conductive pins.

9. A communication device as described in claim 3, wherein the first and second radiator patches are formed from a single half wavelength patch folded about the edge surface.

10. A communication device as described in claim 3, wherein the housing comprises a radio.

11. A communication device as described in claim 3, wherein the housing comprises a computer.