Electronic component having gaps between conductive thin films

• US 6,195,249 B1
• Filed: 07/15/1999
• Issued: 02/27/2001
• Est. Priority Date: 03/17/1997
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Odagiri, Masaru, Honda, Kazuyoshi, Echigo, Noriyasu, Sunagare, Nobuki
• Primary Examiner(s): Dinkins, Anthony
• Application Number:
  US09/341,737
• Time in Patent Office: 593 Days
• Field of Search: 361/301.4, 361/303, 361/306.3, 361/312-313, 361/321--32, 361/329, 29/254.1, 29/254.2, 338/22.R
• US Class Current: 361/306.3
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence

Abstract

An electronic component provided with a dielectric thin film (4), normal electrodes (1a, 1b) formed on the thin film (4), dummy electrodes (2a,2b) formed on the dielectric thin film (4) with an insulating region (20) therebetween, and auxiliary electrodes (3) provided on both side faces of the component, wherein the width of the insulating region (20) is not less than 500 times the thickness of the dielectric thin film (4) so as to improve the characteristics such as the equivalent series resistance. Thus, the deterioration of the frequency characteristics caused by the dummy electrodes can be remedied and the component can be used for a capacitor or the like.

Claims

1. An electronic component comprising a first conductive thin film, a dielectric thin film formed on the first conductive thin film, and a second conductive thin film formed on the dielectric thin film,

wherein a third conductive thin film having an electric potential approximately equal to that of the second conductive thin film is formed approximately in a same surface on which the first conductive thin film is formed, an insulating region being interposed between the first conductive thin film and the third conductive thin film, and a fourth conductive thin film having an electric potential approximately equal to that of the first conductive thin film is formed approximately in the same surface on which the second conductive thin film is formed, an insulating region being interposed between the second conductive thin film and the fourth conductive thin film, and

a gap between the first conductive thin film and the third conductive thin film and a gap between the second conductive thin film and the fourth conductive thin film are not less than 500 times a thickness of the dielectric thin film.

2. The electronic component according to claim 1, wherein the dielectric thin film is formed of a resin thin film.

3. The electronic component according to claim 2, wherein the resin thin film comprises at least acrylate as a main component.

4. The electronic component according to claim 1, wherein the conductive thin films are formed of a metal thin film.

5. The electronic component according to claim 1, having an alternate and repeated laminated structure, wherein

the laminated structure comprises at least two layers of the conductive thin films and at least two layers of the dielectric thin films, and

the conductive thin films and the dielectric thin films are laminated alternately.

6. The electronic component according to claim 1, wherein the first conductive thin film and the fourth conductive thin film are connected by an auxiliary electrode, and the second conductive thin film and the third conductive thin film are connected by an auxiliary electrode.

7. The electronic component according to claim 1, wherein a part of or an entire laminate of the conductive thin films and the dielectric thin films functions as a capacitor.

8. The electronic component according to claim 1, wherein a gap between the insulating regions in a film surface direction is not more than 17500 times a thickness of the dielectric thin film.