High aspect ratio, microstructure-covered, macroscopic surfaces

• US 6,197,180 B1
• Filed: 06/23/1998
• Issued: 03/06/2001
• Est. Priority Date: 02/09/1996
• Status: Expired due to Fees

• Current Assignee: Board of Supervisors of Louisiana State University Agricultural & Mechanical College (Louisiana State University System)
• Original Assignee: Board of Supervisors of Louisiana State University Agricultural & Mechanical College (Louisiana State University System)
• Inventors: Kelly, Kevin W.
• Primary Examiner(s): Wong, Edna
• Application Number:
  US09/091,698
• Time in Patent Office: 987 Days
• Field of Search: 205/118, 205/135, 205/136, 428/156, 428/172, 428/134, 428/137
• US Class Current: 205/118
• CPC Class Codes: B01J 19/0093 Microreactors, e.g. miniaturised or microfabricated reactors laboratory containers with capillary fluid transport in microfabricated channels or chambers B01L3/5027
• CPC Class Codes: B01J 2219/00783 Laminate assemblies, i.e. the reactor comprising a stack of plates
• CPC Class Codes: B01J 2219/00822 Metal
• CPC Class Codes: B01J 2219/00828 Silicon wafers or plates
• CPC Class Codes: B01J 2219/00833 Plastic
• CPC Class Codes: B01J 2219/00873 Heat exchange
• CPC Class Codes: B01J 2219/00995 Mathematical modeling
• CPC Class Codes: B81C 1/00619 Forming high aspect ratio structures having deep steep walls
• CPC Class Codes: B81C 99/0085 using moulds and master templates, e.g. for hot-embossing
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: F28F 13/185 Heat-exchange surfaces provided with microstructures or with porous coatings
• CPC Class Codes: F28F 2260/02 having microchannels

Abstract

The performance of many macroscopic structures (those whose dimensions are on the order of centimeters, meters, or even larger) can be greatly improved by covering their surfaces with microstructures. There are several applications in which “large,” microstructure-covered sheets are useful. An apparatus and method are disclosed for forming high aspect ratio microstructures (“HARMs”) on planar and non-planar surfaces, using a modification of the LIGA microfabrication process. A free-standing polymer sheet is lithographically patterned with through-holes. The polymer sheet is then pressed against, clamped to, or otherwise attached to a conductive substrate in such a way that the patterned holes in the sheet are not blocked. Subsequent electroplating produces well-defined HARM structures on the planar or non-planar surface, in shapes that are complementary to the lithographically patterned through-holes in the polymer. The polymer may then be removed (e.g., by melting, dissolution, or burning). Various planar and non-planar surfaces have been covered with microstructures. Where the metal surface is non-planar, the polymer sheet may be heated or otherwise made sufficiently flexible to conform to the metal surface, preferably by heat-shrinking to assure firm contact. The process may be used to electroplate microstructures directly onto metal surfaces generally—not just onto metal surfaces that have been specially prepared for LIGA processes, as has previously been the case.

Claims

1. A process for producing microstructures on a metal surface, comprising the steps of:

(a) heat-shrinking a non-conductive polymer sheet onto the metal surface;

wherein there is no gap or there is a negligible gap between the metal surface and the non-conductive sheet;

wherein the non-conductive sheet contains a plurality of holes;

wherein the holes are formed in the non-conductive sheet at a time when the non-conductive sheet is not in contact with the metal surface; and

wherein the non-conductive sheet is not chemically bonded to the metal surface; and

(b) electroplating metal onto the metal surface with the holes of the non-conductive sheet;

whereby metal microstructures are produced on the metal surface.

2. The process of claim 1, wherein the metal surface is substantially non-planar.

3. The process of claim 1, wherein the polymer sheet comprises poly (methyl methacrylate).

4. The process of claim 1, wherein at least some of the holes in the nonconductive sheet have an aspect ratio greater than about 5.

5. The process of claim 1, additionally comprising the step of removing the non conductive sheet from the metal surface after said electroplating step.

6. The process of claim 1, wherein the non-conductive sheet is a ceramic.

7. A process for producing microstructures on a metal surface, comprising the steps of:

(a) bonding a polymer sheet to the metal surface with a chemical bonding agent;

wherein there is no gap or there is a negligible gap between the metal surface and the polymer sheet;

wherein the polymer sheet contains an exposed, developable, but undeveloped latent image of a plurality of holes or structures;

wherein the latent image is formed in the polymer sheet at a time when the polymer sheet is not in contact with the metal surface;

(b) developing the latent image to produce a plurality of holes or structures in the polymer sheet, without substantially affecting the chemical bonding between the metal surface and the polymer sheet;

(c) removing the chemical bonding agent from the metal surface within the holes in the polymer sheet, without substantially affecting the chemical bonding between the metal surface and the portions of the polymer sheet that do not correspond to the developed holes or structures; and

(d) electroplating metal onto the metal surface within the holes of the polymer sheet;

whereby metal microstructures are produced on the metal surface.

8. The process of claim 7, wherein the metal surface is substantially non-planar.

9. The process of claim 8, additionally comprising the step of heat-shrinking the polymer sheet onto the metal surface.

10. The process of claim 7, wherein the polymer sheet comprises poly (methyl methacrylate), and wherein the latent image is formed by selective x-ray irradiation of the polymer sheet.

11. The process of claim 7, wherein at least some of the holes or structures in the developed image are holes having an aspect ratio greater than about 5.

12. The process of claim 7, additionally comprising the step of removing the polymer sheet from the metal surface.

13. A process for producing microstructures on a metal surface, comprising the steps of:

(a) bonding a non-conductive sheet to the metal surface with a chemical bonding agent;

wherein there is no gap or there is a negligible gap between the metal surface and the non-conductive sheet;

wherein portions of the non-conductive sheet are substantially thinner in areas corresponding to a plurality of holes or structures;

(b) etching the non-conductive sheet to produce the plurality of holes or structures in the sheet in the substantially thinner areas, without substantially affecting the chemical bonding between the metal surface and the portions of the sheet that do not correspond to the substantially thinner areas;

(c) removing the chemical bonding agent from the metal surface within the etched holes in the sheet, without substantially affecting the chemical bonding between the metal surface and the portions of the sheet that do not correspond to the holes; and

(d) electroplating metal onto the metal surface within the holes in the sheet;

whereby metal microstructures are produced on the metal surface.

14. The process of claim 13, wherein the metal surface is substantially non-planar.

15. The process of claim 13, wherein the non-conductive sheet comprises a polymer.

16. The process of claim 15, wherein the polymer sheet comprises poly (methyl methacrylate).

17. The process of claim 13, wherein at least some of the holes in the non-conductive sheet have an aspect ratio greater than about 5.

18. The process of claim 13, additionally comprising the step of removing the non-conductive sheet from the metal surface after said electroplating step.

19. The process of claim 13, wherein the nonconductive sheet is a ceramic.

20. The process of claim 13, wherein the non-conductive sheet is formed by molding.