High aspect ratio, microstructure-covered, macroscopic surfaces
First Claim
1. A process for producing microstructures on a metal surface, comprising the steps of:
- (a) heat-shrinking a non-conductive polymer sheet onto the metal surface;
wherein there is no gap or there is a negligible gap between the metal surface and the non-conductive sheet;
wherein the non-conductive sheet contains a plurality of holes;
wherein the holes are formed in the non-conductive sheet at a time when the non-conductive sheet is not in contact with the metal surface; and
wherein the non-conductive sheet is not chemically bonded to the metal surface; and
(b) electroplating metal onto the metal surface with the holes of the non-conductive sheet;
whereby metal microstructures are produced on the metal surface.
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Accused Products
Abstract
The performance of many macroscopic structures (those whose dimensions are on the order of centimeters, meters, or even larger) can be greatly improved by covering their surfaces with microstructures. There are several applications in which “large,” microstructure-covered sheets are useful. An apparatus and method are disclosed for forming high aspect ratio microstructures (“HARMs”) on planar and non-planar surfaces, using a modification of the LIGA microfabrication process. A free-standing polymer sheet is lithographically patterned with through-holes. The polymer sheet is then pressed against, clamped to, or otherwise attached to a conductive substrate in such a way that the patterned holes in the sheet are not blocked. Subsequent electroplating produces well-defined HARM structures on the planar or non-planar surface, in shapes that are complementary to the lithographically patterned through-holes in the polymer. The polymer may then be removed (e.g., by melting, dissolution, or burning). Various planar and non-planar surfaces have been covered with microstructures. Where the metal surface is non-planar, the polymer sheet may be heated or otherwise made sufficiently flexible to conform to the metal surface, preferably by heat-shrinking to assure firm contact. The process may be used to electroplate microstructures directly onto metal surfaces generally—not just onto metal surfaces that have been specially prepared for LIGA processes, as has previously been the case.
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Citations
20 Claims
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1. A process for producing microstructures on a metal surface, comprising the steps of:
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(a) heat-shrinking a non-conductive polymer sheet onto the metal surface;
wherein there is no gap or there is a negligible gap between the metal surface and the non-conductive sheet;
wherein the non-conductive sheet contains a plurality of holes;
wherein the holes are formed in the non-conductive sheet at a time when the non-conductive sheet is not in contact with the metal surface; and
wherein the non-conductive sheet is not chemically bonded to the metal surface; and
(b) electroplating metal onto the metal surface with the holes of the non-conductive sheet;
whereby metal microstructures are produced on the metal surface. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A process for producing microstructures on a metal surface, comprising the steps of:
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(a) bonding a polymer sheet to the metal surface with a chemical bonding agent;
wherein there is no gap or there is a negligible gap between the metal surface and the polymer sheet;
wherein the polymer sheet contains an exposed, developable, but undeveloped latent image of a plurality of holes or structures;
wherein the latent image is formed in the polymer sheet at a time when the polymer sheet is not in contact with the metal surface;
(b) developing the latent image to produce a plurality of holes or structures in the polymer sheet, without substantially affecting the chemical bonding between the metal surface and the polymer sheet;
(c) removing the chemical bonding agent from the metal surface within the holes in the polymer sheet, without substantially affecting the chemical bonding between the metal surface and the portions of the polymer sheet that do not correspond to the developed holes or structures; and
(d) electroplating metal onto the metal surface within the holes of the polymer sheet;
whereby metal microstructures are produced on the metal surface. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A process for producing microstructures on a metal surface, comprising the steps of:
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(a) bonding a non-conductive sheet to the metal surface with a chemical bonding agent;
wherein there is no gap or there is a negligible gap between the metal surface and the non-conductive sheet;
wherein portions of the non-conductive sheet are substantially thinner in areas corresponding to a plurality of holes or structures;
(b) etching the non-conductive sheet to produce the plurality of holes or structures in the sheet in the substantially thinner areas, without substantially affecting the chemical bonding between the metal surface and the portions of the sheet that do not correspond to the substantially thinner areas;
(c) removing the chemical bonding agent from the metal surface within the etched holes in the sheet, without substantially affecting the chemical bonding between the metal surface and the portions of the sheet that do not correspond to the holes; and
(d) electroplating metal onto the metal surface within the holes in the sheet;
whereby metal microstructures are produced on the metal surface. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification