Thermally conductive interface pads for electronic devices

• US 6,197,859 B1
• Filed: 01/30/1998
• Issued: 03/06/2001
• Est. Priority Date: 06/14/1993
• Status: Expired due to Term

• Current Assignee: Henkel IP & Holding GmbH (Henkel AG & Co KGaA)
• Original Assignee: Berquist Company The (Henkel AG & Co KGaA)
• Inventors: Green, Kevin L., Misra, Sanjay
• Primary Examiner(s): HENDERSON JR, CHRISTOPHER A
• Application Number:
  US09/016,768
• Time in Patent Office: 1,131 Days
• Field of Search: 524/77, 524/80, 524/270, 524/271, 524/272, 524/404, 524/424, 524/430, 524/524
• US Class Current: 524/270
• CPC Class Codes: C08G 77/12 containing silicon bound to hydrogen C08G77/045 takes precedence
• CPC Class Codes: C08L 2666/04 Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
• CPC Class Codes: C08L 2666/34 Oxygen-containing compounds, including ammonium and metal salts
• CPC Class Codes: C08L 2666/54 Inorganic substances
• CPC Class Codes: C08L 83/04 Polysiloxanes

Abstract

An interface material for use in forming a coating interposed along a heat dissipating path between a solid state electronic device and a heat sinking surface. The coating consists of a formulation of a thermally stable wax which is formed as an alkyl substituted poly (hydro, methyl-siloxane) wax polymer wherein the alkyl substituted group has a chain length of between 18 and 22 carbon atoms, and being blended with a plasticizer and a solid particulate consisting of alumina, boron nitride, among others. The wax has a melting point of between 30 degrees C. and 90 degrees C., and preferably about 65 degrees C.

Claims

1. A thermally conductive interface pad for interposition along a heat dissipating path between a solid state electronic device and a heat sinking surface and comprising a blend of:

(a) a thermally stable wax component comprising an alkyl substituted poly (hydro, methyl-siloxane) wax present in the range of from 15% to 35% and with the wax having a melting point between 30 degrees C. and 90 degrees C.;

(b) a flexibilizer component selected from the group consisting of ethylene vinyl acetate, styrenic thermoplastic elastomers consisting of block copolymers of styrene-ethylene-butylene-styrene and polyvinylbutyral present from 5% to 15%;

(c) a plasticizer component selected from the group consisting of short chain polystyrene;

short chain hydrocarbons which are flexible at room temperature and which flow above 65°

C. and penta-erythritol esters of wood rosin present in an amount ranging up to 10%; and

(d) a thermally conductive particulate component selected from the group consisting of alumina, boron nitride, graphite, silicon carbide, diamond, metallic powders, and mixtures thereof, with the particulate having an average particle size of up to about 5 microns and present in an amount of from 45% to 76%.

2. The interface pad of claim 1 being particularly characterized in that the substituted alkyl group for the poly (hydro, methyl-siloxane) wax component has a chain length of from 18 to 22 carbon atoms.

3. The interface pad of claim 1 being particularly characterized in that the flexibilizer component is ethylene vinyl acetate.

4. The interface pad of claim 1 being particularly characterized in that the particulate component is alumina having an average particle size of about 5 microns.