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Thermally conductive interface pads for electronic devices

  • US 6,197,859 B1
  • Filed: 01/30/1998
  • Issued: 03/06/2001
  • Est. Priority Date: 06/14/1993
  • Status: Expired due to Term
First Claim
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1. A thermally conductive interface pad for interposition along a heat dissipating path between a solid state electronic device and a heat sinking surface and comprising a blend of:

  • (a) a thermally stable wax component comprising an alkyl substituted poly (hydro, methyl-siloxane) wax present in the range of from 15% to 35% and with the wax having a melting point between 30 degrees C. and 90 degrees C.;

    (b) a flexibilizer component selected from the group consisting of ethylene vinyl acetate, styrenic thermoplastic elastomers consisting of block copolymers of styrene-ethylene-butylene-styrene and polyvinylbutyral present from 5% to 15%;

    (c) a plasticizer component selected from the group consisting of short chain polystyrene;

    short chain hydrocarbons which are flexible at room temperature and which flow above 65°

    C. and penta-erythritol esters of wood rosin present in an amount ranging up to 10%; and

    (d) a thermally conductive particulate component selected from the group consisting of alumina, boron nitride, graphite, silicon carbide, diamond, metallic powders, and mixtures thereof, with the particulate having an average particle size of up to about 5 microns and present in an amount of from 45% to 76%.

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