Method for fabricating an infrared radiation detector

• US 6,198,100 B1
• Filed: 11/22/1989
• Issued: 03/06/2001
• Est. Priority Date: 08/05/1987
• Status: Expired due to Fees

• Current Assignee: Lockheed Martin Tactical Systems, Inc. (Martin Marietta Corporation)
• Original Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Inventors: Schimert, Thomas R., Eden, Dayton D.
• Primary Examiner(s): Hellner, Mark
• Application Number:
  US07/451,712
• Time in Patent Office: 4,122 Days
• Field of Search: 250/338.4
• US Class Current: 250/338.4
• CPC Class Codes: G01J 5/08 Optical arrangements
• CPC Class Codes: G01J 5/0837 Microantennas, e.g. bow-tie
• CPC Class Codes: G01J 5/10 using electric radiation detectors
• CPC Class Codes: H01L 27/14669 Infrared imagers
• CPC Class Codes: H01L 31/0224 Electrodes
• CPC Class Codes: H01L 31/09 Devices sensitive to infrared, visible or ultraviolet radiation H01L31/101 takes precedence
• CPC Class Codes: H01Q 21/062 using dipole aerials; H01Q21/067, H01Q21/068 take precedence
• CPC Class Codes: H01Q 9/16 with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole H01Q9/44 takes precedence

Abstract

A method for fabricating an infrared radiation detector is disclosed. The detector utilizes photosensitive segments which are included within elongate members disposed on surface of a dielectric substrate. The elongate members comprise photosensitive detector segments which are located between and contact non-photosensitive segments and the entirety of each elongate member is electrically conductive. The elongate members are preferably offset from each other by less than the wavelength of the radiation and the photosensitive segments within the strips are also preferably spaced apart by less than the wavelength of the radiation. A reflective plane, typically an aluminum layer, is offset from the plane of the detector segments by less than the wavelength of the radiation. Incident radiation is captured by the overall detector structure which includes the reflective plane and the elongate members which include both photosensitive and non-photosensitive segments. The radiation power is transferred to the photosensitive detector segments to produce a detection signal. The detection signals are combined along the length of the elongate members and conveyed through electrical conductors at the ends of the members to produce a composite radiation detection signal. A plurality of detectors can be combined to produce an infrared imager.

Claims

1. A method for fabricating a device for detecting infrared radiation, comprising the steps of:

forming a plurality of groups of photosensitive segments in a planar array, said photosensitive segments being sensitive to said infrared radiation and said photosensitive segments having a thickness less than the wavelength of said infrared radiation, said photosensitive segments comprising a plurality of groups, each group having a plurality of said photosensitive segments positioned in an elongate pattern, the photosensitive segments in each group being offset from each other by less than said wavelength, and the lateral dimensions of each said photosensitive segments being less than said wavelength,

forming a plurality of electrically conductive segments for interconnecting adjacent ones of said photosensitive segments in each of said groups, said electrically conductive segments not being photosensitive to said infrared radiation, whereby each group of said photosensitive segments together with the corresponding conductive segments is electrically conductive along its length,

forming a plane which is reflective to said infrared radiation,

said planar array of photosensitive segments and said infrared reflective plane being offset from each other by less than said wavelength, and

electrically connecting a plurality of said groups of photosensitive segments in parallel to provide a conduction path for detection signals produced by said photosensitive segments in response to said infrared radiation.

2. A method for fabricating a device for detecting infrared radiation as recited in claim 1 wherein said electrically conductive segments are positioned in a plane parallel to but offset from the plane of said photosensitive segments.

3. A method for fabricating a device for detecting infrared radiation as recited in claim 1 wherein said electrically conductive segments are positioned in a plane coplanar with the plane of said photosensitive segments.

4. A method for fabricating a device for detecting infrared radiation as recited in claim 1 including the step of forming a heterojunction at each interface between said photosensitive segments and said electrically conductive segments.

5. A method for fabricating a device for detecting infrared radiation as recited in claim 1 including the step of fabricating insulating material for separating said reflective plane from said photosensitive segments, said insulating material in contact with said photosensitive segments.

6. A method for fabricating a device for detecting infrared radiation as recited in claim 5 further including the step of forming a blocking junction at each interface between said photosensitive segments and said insulating material.

7. A method for fabricating a device for detecting infrared radiation as recited in claim 1 wherein the step of forming a reflecting plane comprises forming an aluminum layer.

8. A method for fabricating a device for detecting infrared radiation, comprising the steps of:

forming a conductive layer on a substrate,

forming a photosensitive layer on said conductive layer, said photosensitive layer having a thickness less than the wavelength of said infrared radiation,

forming an insulating layer on said photosensitive layer,

etching said insulating layer to form an array of insulating blocks spaced apart by less than said wavelength,

etching said photosensitive layer to form respective photosensitive segments positioned vertically with respect to each of said insulating blocks,

etching said conductive layer to form electrically conducting segments for respectively connecting pairs of said photosensitive segments, and forming a reflecting plane for reflecting said infrared radiation, said reflecting plane being parallel to the plane of said photosensitive segments and offset therefrom by less than said wavelength.

9. A method for fabricating a device for detecting infrared radiation as recited in claim 8 including the step of performing a precision etching operation on said insulating layer to reduce said insulating layer to a predetermined thickness.

10. A method for fabricating a device for detecting infrared radiation as recited in claim 8 including the step of forming a heterojunction at each interface between said photosensitive segments and said electrically conductive segments.

11. A method for fabricating a device for detecting infrared radiation as recited in claim 8 further including the step of forming a blocking junction at each interface between said photosensitive segments and said insulating blocks.

12. A method for fabricating a device for detecting infrared radiation as recited in claim 8 wherein the step of forming a reflecting plane comprises forming an aluminum layer.

13. A method for fabricating a device for detecting infrared radiation, comprising the steps of:

forming a first layer, comprising a material which is electrically conductive, but is not photosensitive to said infrared radiation, on the surface of a substrate,

forming a second layer, comprising a material which is electrically conductive and is photosensitive to said infrared radiation, on the surface of said first layer,

forming a third layer, comprising a material which is electrically insulating, on the surface of said second layer,

etching said second and third layers to form stacked segments of said electrically insulating material and said photosensitive material which comprise respective insulating segments and photosensitive segments,

filling the open regions between said stacked segments with a nonconductive filler material,

forming a reflective plane, which is reflective to said radiation, on the surface of said stacked segments and said filler material,

applying a superstrate to said reflective plane, removing said substrate to expose said first layer,

etching said first layer to form bridging segments extending across pairs of said photosensitive segments,

forming a passivating layer on the surface of said device subsequent to the formation of said bridging segments, and

forming electrical contacts through said passivating layer to provide a path for extracting a detection signal from said device.

14. A method for fabricating a device for detecting infrared radiation as recited in claim 13 including the step of forming a heterojunction at each interface between said photosensitive segments and said electrically conductive segments.

15. A method for fabricating a device for detecting infrared radiation as recited in claim 13 further including the step of forming a blocking junction at each interface between said photosensitive segments and said insulating material.

16. A method for fabricating a device for detecting infrared radiation as recited in claim 13 wherein the step of forming a reflective plane comprises forming an aluminum layer.

17. A method for fabricating a device for detecting infrared radiation, comprising the steps of:

forming a first layer, which comprises a first material that is electrically conductive, on the surface of a substrate,

forming a second layer, which comprises a second material that is electrically insulating, on the surface of said first layer,

forming a reflective plane, which is reflective to said radiation, on the surface of said second layer,

applying a nonconducting superstrate to the surface of said reflective plane,

removing said substrate to expose said first layer,

etching said first layer to form a plurality of discrete first segments comprising said first material and arranged in a plurality of groups,

applying a third material to the surface of said second layer to form a plurality of second segments wherein said second segments are positioned to electrically interconnect alternate ones of said first segments in each of said groups wherein each group of first and second segments forms an electrically conductive chain, and

wherein one of said first and third materials is photosensitive to said infrared radiation and the other of said first and third materials is not photosensitive to said infrared radiation but is electrically conductive.

18. A method for fabricating a device for detecting infrared radiation as recited in claim 17 including the step of thinning said second layer to have a predetermined thickness prior to the step of forming said reflective plane.

19. A method for fabricating a device for detecting infrared radiation as recited in claim 17 including the step of forming a heterojunction at each interface between said photosensitive segments and said electrically conductive segments.

20. A method for fabricating a device for detecting infrared radiation as recited in claim 17 further including the step of forming a blocking junction at each interface between said photosensitive segments and said insulating material.

21. A method for fabricating a device for detecting infrared radiation as recited in claim 17 wherein said the step of forming a first layer comprises growing a layer of mercury cadmium telluride on the surface of said substrate.