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High-volume production, low cost piezoelectric transducer using low-shrink solder of bismuth or antimony alloy

  • US 6,198,207 B1
  • Filed: 08/31/1999
  • Issued: 03/06/2001
  • Est. Priority Date: 09/01/1998
  • Status: Expired due to Term
First Claim
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1. A piezoelectric transducer comprising a housing and a transducer subassembly,said transducer subassembly being secured to an inner wall of said housing in a manner defining at least a first chamber and a second chamber within said housing on opposing sides of said transducer subassembly;

  • said transducer subassembly further comprising a piezoelectric element operatively coupled to a stress/strain-transmitting element;

    wherein said piezoelectric element and said stress/strain transmitting element are affixed in position within said housing by a low-shrink solder whose volume changes less than about 2.5% in cooling from a liquid state to a solid state, said transducer assembly having a passage through said subassembly permitting fluid communication between said first and said second chambers.

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