Microelectromechanical accelerometer for automotive applications

• US 6,199,874 B1
• Filed: 12/07/1995
• Issued: 03/13/2001
• Est. Priority Date: 05/26/1993
• Status: Expired due to Term

• Current Assignee: Cornell Research Foundation Incorporated (Cornell University), Kionix Incorporated (ROHM Co., Ltd.)
• Original Assignee: Cornell Research Foundation Incorporated (Cornell University), Kionix Incorporated (ROHM Co., Ltd.)
• Inventors: MacDonald, Noel C., Davis, Timothy J., Galvin, Gregory J.
• Primary Examiner(s): Kwok, Helen C.
• Application Number:
  US08/568,845
• Time in Patent Office: 1,923 Days
• Field of Search: 735/141.8, 735/142.4, 735/143.6, 735/143.8, 735/041.6, 361/280, 438/718, 438/719, 280/5.5, 280/5.514, 280/5.515, 280/5.519, 280/5.507, 280/5.508, 280/6.157
• US Class Current: 280/5.514
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2203/051 Translation according to an axis parallel to the substrate
• CPC Class Codes: B81C 1/00619 Forming high aspect ratio structures having deep steep walls
• CPC Class Codes: B81C 2201/0132 Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling
• CPC Class Codes: G01P 1/006 used for thermal compensation
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/131 with electrostatic counterbalancing means
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type
• CPC Class Codes: G01P 2015/0817 for pivoting movement of the mass, e.g. in-plane pendulum

Abstract

A micromechanical capacitive accelerometer is provided from a single silicon wafer. The basic structure of the micromechanical accelerometer is etched in the wafer to form a released portion in the substrate, and the released and remaining portions of the substrate are coated with metal under conditions sufficient to form a micromechanical capacitive accelerometer. The substrate is preferably etched using reactive-ion etching for at least the first etch step in the process that forms the basic structure, although in another preferred embodiment, all etching is reactive-ion etching. The accelerometer also may comprise a signal-conditioned accelerometer wherein signal-conditioning circuitry is provided on the same wafer from which the accelerometer is formed, and VLSI electronics may be integrated on the same wafer from which the accelerometer is formed. The micromechanical capacitive accelerometer can be used for airbag deployment, active suspension control, active steering control, anti-lock braking, and other control systems requiring accelerometers having high sensitivity, extreme accuracy and resistance to out of plane forces.

Claims

1. A micromechanical automotive suspension system in a vehicle comprising:

an accelerometer for producing a continuous output signal in response to sensed acceleration vectors, said accelerometer including at least two capacitively-coupled fingers, at least one of said fingers moves relative to another finger in response to said acceleration vectors to produce a change in capacitance, wherein at least one of said fingers is characterized by an aspect ratio greater than about 4 to 1, said fingers being fabricated from a single silicon substrate by etching the substrate at least partially by reactive ion etching;

means for applying a potential across adjacent capacitively-coupled fingers to generate said output signal upon a change in the capacitance between said adjacent fingers upon relative motion of said adjacent fingers;

a vehicle suspension; and

a suspension positioning unit for receiving the output signal from the accelerometer and for positioning the vehicle suspension in response to said acceleration vectors.

2. The suspension system of claim 1, wherein said accelerometer includes VLSI electronics fabricated on said silicon substrate.

3. The suspension system of claim 1, wherein said accelerometer is a micron-scale micromechanical structure.

4. The suspension system of claim 3, wherein said at least one movable finger is mounted in said substrate and is coplanar with said substrate.

5. The suspension system of claim 4, further including high aspect ratio springs connected between said at least one movable finger and said substrate.

6. The suspension system of claim 5 wherein said at least one movable finger and said springs are fabricated to have an aspect ratio of between about 10:

1 and about 20;

1 to resist out-of-plane motion.