Apparatus and method for curing materials with radiation

• US 6,200,134 B1
• Filed: 01/20/1998
• Issued: 03/13/2001
• Est. Priority Date: 01/20/1998
• Status: Expired due to Term

• Current Assignee: Kerr Corporation (Envista Holdings Corporation)
• Original Assignee: Kerr Corporation (Envista Holdings Corporation)
• Inventors: Kovac, Jozef, Knox, Raymond L.
• Primary Examiner(s): Lewis, Ralph A.
• Application Number:
  US09/009,205
• Time in Patent Office: 1,148 Days
• Field of Search: 433/29, 433/215, 606/1, 606/13, 606/16, 607/88, 362/800
• US Class Current: 433/29
• CPC Class Codes: A61C 19/004 Hand-held apparatus, e.g. guns
• CPC Class Codes: A61C 2204/002 using batteries
• CPC Class Codes: A61N 2005/0652 Arrays of diodes
• CPC Class Codes: B29C 2035/0833 using actinic light
• CPC Class Codes: B29C 35/08 by wave energy or particle radiation B29C64/00, B29C71/04 take precedence
• CPC Class Codes: G02B 6/4298 coupling with non-coherent light sources and/or radiation detectors, e.g. lamps, incandescent bulbs, scintillation chambers
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A hand held dental instrument for curing light-curable compounds comprises a housing and an array of solid state, light emitting junctions or dies for generating light having wavelengths within a narrow band of wavelengths (e.g. 400-500 nm). Preferably, a peak wavelength of 470 nm is generated. The device further comprises an optical fiber light pipe for capturing the light and transmitting a beam of the light to a work surface containing a light-curable compound. An optical lens or lenses may be used for focusing the light into the light pipe.

Claims

1. An assembly for dental work in the mouth of a patient comprising:

a light-curable dental compound adapted to be located in the mouth of a patient, the compound being curable with light of a specified wavelength;

a hand-held dental instrument including a housing with an operator grippable section and a light emitting section, the light emitting section configured for being positionable within the mouth of a patient proximate the light-curable compound;

a plurality of individual solid state, unpackaged, light-emitting dies, the dies being individually mounted on a substrate supported by the housing to form a collective array on said substrate in the housing, the individual dies each being a semiconductor junction free of an integral package and lens, the array of dies operable for collectively emitting light having wavelengths within a narrow band of wavelengths, said narrow band of wavelengths including said specified wavelength at which the light-curable dental compound is curable;

said substrate having electrically conductive elements positioned thereon, said individual dies each being electrically coupled to at least one of said elements for coupling to a power supply to illuminate the dies;

a heat sink coupled to the substrate for dissipating heat from the array;

a forced air device for directing air to the heat sink for further heat dissipation;

a light transmitting device for capturing said light from the array of dies and transmitting a beam of the light out of the housing to the dental compound;

whereby the beam may be used to cure the light-curable dental compound in the mouth of a patient.

2. The assembly of claim 1 wherein said solid narrow wavelength band includes a blue light wavelength.

3. The assembly of claim 1 wherein said narrow wavelength band includes a wavelength of approximately 470 nanometers.

4. The assembly of claim 1 wherein said light transmitting device comprises at least one fiber optic element.

5. The assembly of claim 1 wherein said light transmitting device comprises a plurality of fiber optic elements operably coupled together for directing said beam.

6. The assembly of claim 1 further comprising an optical focusing device for focusing said light before it is captured by said light transmitting device.

7. The assembly of claim 6 wherein said optical focusing device comprises an optical lens.

8. The assembly of claim 1 wherein said light transmitting device has a receiving end and a transmission end, the transmission end being dimensioned smaller than said receiving end for narrowing the light beam captured by said light transmitting device.

9. The assembly of claim 1 wherein said dies are mounted on a ceramic substrate.

10. The assembly of claim 9 wherein said narrow spectrum radiation comprises predominantly a single wavelength.

11. The assembly of claim 10 wherein said single wavelength radiation is blue radiation.

12. The assembly of claim 1 further comprising a layer positioned over at least one of said dies, the layer forming a microlens over said at least one die to focus light generated by said at least one die.

13. A method for curing light-curable dental compounds in the mouth of a patient comprising:

positioning a light-curable dental compound in the mouth of a patient which is curable with light of a specified wavelength;

generating light having wavelengths within a narrow band of wavelengths using a plurality of individual solid state, unpackaged light-emitting dies, the dies being individually mounted on a substrate to form a collective array on said substrate, the individual dies each being a semiconductor junction free of an integral package and lens and collectively generating light wherein the narrow band of wavelengths includes said specified wavelength;

coupling a heat sink to the substrate and directing air onto the heat sink for dissipation of heat from the array of dies;

capturing said light with a light transmitting device and transmitting a beam of the light;

directing the light beam onto the light-curable compound in the mouth of a patient for curing the compound.

14. The method of claim 13 wherein said narrow wavelength band includes a blue light wavelength.

15. The method of claim 13 wherein said narrow wavelength band includes a wavelength of approximately 470 nanometers.

16. The method of claim 13 wherein said light is captured with at least one fiber optic element.

17. The method of claim 13 wherein said light is captured with a plurality of fiber optic elements operably coupled together for transmitting said light as a beam.

18. The method of claim 13 further comprising focusing said light before it is transmitted.

19. The method of claim 18 wherein said focusing of the light is accomplished with an optical lens.

20. The method of claim 13 further comprising mounting said dies onto a ceramic substrate to form said array.

21. The method of claim 13 further comprising positioning a layer of material over at least one of said dies in the array to form a microlens over said at least one die.

22. The method of claim 13 further comprising shaping said array to generally correspond to the shape of an end of the light transmitting device.

23. An assembly for dental work in the mouth of a patient comprising:

a light-curable dental compound adapted to be located in the mouth of a patient which is curable with light of a specified wavelength;

a hand-held dental instrument including a housing with an operator grippable section and a light emitting section, the light emitting section including a forwardmost tip section configured for being positionable within the mouth proximate the light-curable compound;

a plurality of individual solid state, unpackaged, light-emitting dies, the dies being individually mounted on a substrate to form a collective array on said substrate, the individual dies each being a semiconductor junction free of an integral package and lens, the array of dies operable for collectively emitting light having wavelengths within a narrow band of wavelengths, said narrow band of wavelengths including said specified wavelength at which the light-curable dental compound is curable;

the array of dies being positioned at the tip section of said housing for being positioned in a patient'"'"'s mouth for directly emitting light from the array of individual dies onto said dental compound to cure the compound;

whereby the light more directly cures the light-curable dental compound in the mouth of a patient.

24. The assembly of claim 23 further comprising a rechargable power supply coupled to the array of dies to power the dies.