Removal of dielectric oxides

• US 6,200,891 B1
• Filed: 08/13/1998
• Issued: 03/13/2001
• Est. Priority Date: 08/13/1998
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Rath, David L., Jagannathan, Rangarajan, Pope, Keith R., McCullough, Kenneth J., Madden, Karen P., Okorn-Schmidt, Harald F.
• Primary Examiner(s): Zarabian, Amir
• Assistant Examiner(s): LEBENTRITT, MICHAEL
• Application Number:
  US09/133,537
• Time in Patent Office: 943 Days
• Field of Search: 438/724, 438/744, 438/723, 438/743, 438/740, 438/586, 438/622, 438/625, 438/637, 438/627
• US Class Current: 438/622
• CPC Class Codes: H01L 21/31111 by chemical means

Abstract

Oxides such as those commonly used in interlevel dielectrics may be removed employing a liquid composition containing a fluoride-containing compound and an organic solvent. Preferred compositions are substantially nonaqueous and include an anhydride. Improved methods for selective removal of oxides, especially for removal of silicon oxides where pre-exposed (or conductive metal - containing) features are present, where metal (conductive metal - contaimg) features are to be exposed by the desired oxide removal, or where the silcon oxide otherwise contacts metal (or conductive metal - containing) features are provided.

Claims

1. A method for removing exposed oxide from an article wherein said article contains at least one feature selected from the group consisting of (i) a metal or conductive metal-containing structure contacting said oxide, and (ii) a metal or conductive metal-containing structure having an exposed surface, which method comprises contacting said article with a liquid composition containing about 0.5 to about 15 molar of a fluoride-containing compound and an organic solvent wherein said organic solvent is selected from the group consisting of propylene carbonate, N-methyI pyrrolidone, gamma butyrolactone, methylene chloride benzyl alcohol, N-formyl morpholine, N-formyl piperidine, cyclohexanone, cyclopentanon, methyl benzoate, diglyme, 2-methyl tetrahydrofuran, methyl and ethyl esters of acid selected from the group consisting of phthalic acid, isophthalic acid and terephthalic acid, to thereby selectively remove at least a portion of said exposed oxide.

2. The method of claim 1 wherein said exposed oxide forms part of an interlevel dielectric.

3. The method of claim 1 wherein said liquid composition contains about 20 mole % or less of water based on moles of said fluoride-containing compound.

4. The method of claim 3 wherein said liquid composition contains about 3 mole % or less of water based on moles of said fluoride-containing compound.

5. The method of claim 1 wherein said oxide is a silicon-containing oxide selected from the group consisting of silicon oxide, boron silicate, phosphorus silicate, boron phosphorus silicate or combination thereof.

6. The method of claim 1 wherein said organic solvent is selected from the group consisting of propylene carbonate, N-methyl pyrrolidone and gamma butyrolactone.

7. The method of claim 1 wherein said solvent is propylene carbonate.

8. The method of claim 1 wherein said fluoride-containing compound is selected from the group consisting of hydrofluoric acid, ammonium fluoride, fluoroborates, tetrabutylammonium tetrafluoroborate, fluoroboric acid, aluminum hexafluoride, tin bifluoride, antimony fluoride and fluoride salt of an aliphatic primary, secondary or tertiary amine.

9. The method of claim 1 wherein said fluoride containing compound is hydrofluoric acid or ammonium fluoride.

10. The method of claim 1 wherein said fluoride containing compound is hydrofluoric acid.

11. The method of claim 1 wherein an anhydride is added to said liquid composition before said contacting step.

12. The method of claim 1 wherein said liquid composition is free from water.

13. The method of claim 1 wherein said composition contains about 2 to about 10 molar of said fluoride-containing compound.

14. The method of claim 1 wherein said composition contains about 5 to about 7 molar of said fluoride-containing compound.

15. The method of claim 1 wherein the contacting with said composition is carried out at a temperature of about 20°

C. to about 90°

C.

16. The method of claim 1 wherein the contacting with said composition is carried out at a temperature of about 30°

C. to about 70°

C.

17. The method of claim 1 wherein said metal or metal-containing structure contains a material selected from the group consisting of Al, Cu, AlCu alloys, W, Ti, Ta, TaN and TiN.

18. The method of claim 1 wherein said oxide is silicon oxide.

19. The method of claim 11 wherein said anhydride is an alkyl anhydride or aryl anhydride.

20. The method of claim 11 wherein said anhydride is acetic anhydride.

21. A method for removing exposed oxide from an article wherein said article contains at least one feature selected from the group consisting of (i) a metal or conductive metal-containing structure contacting said oxide, and (ii) a metal or conductive metal-containing structure having an exposed surface, which method comprises contacting said article with a liquid composition containing about 0.5 to about 15 molar of a fluoride-containing compound and an organic solvent, and wherein said composition also contains a tertiary amine, to thereby selectively remove at least a portion of said exposed oxide.

22. The method of claim 21 wherein said tertiary amine is N,N,N′

,N′

tetramethyl ethylenediamine.

23. The method of claim 21 wherein said organic solvent is selected from the group consisting of oxolanes, sulfolanes, esters, ketones, aldehydes, lactones, halogenated hydrocarbons, alcohols, amines and imides.

24. The method of claim 21 wherein said organic solvent is selected from the group consisting of propylene carbonate, N-methyl pyrrolidone and gamma butyrolactone.

25. The method of claim 21 wherein said solvent is propylene carbonate.

26. A method for removing exposed oxide from an article wherein said article contains at least one feature seslected from the group consisting of (i) a metal or conductive metal-containing structure contacting said oxide, and (ii) a metal or conductive metal-containing structure having an exposed surface, which method comprises contacting said article with a liquid composition containing about 0.5 to about 15 molar of a fluoride-containing compound and an organic solvent,

wherein an anhydride is added to said liquid composition before said contacting step, and

wherein said composition contains free water prior to the addition of said anhydride and the amount of said anhydride added provides at least 10 mole % more anhydride groups than moles of free water present prior to the anhydride addition, to thereby selectively remove at least a portion of said exposed oxide.

27. The method of claim 26 wherein said organic solvent is selected from the group consisting of oxolanes, sulfolanes, esters, ketones, aldehydes, lactones, halogenated hydrocarbons, alcohols, amines and imides.

28. The method of claim 26 wherein said organic solvent is selected from the group consisting of propylene carbonate, N-methyl pyrrolidone and gamma butyrolactone.

29. The method of claim 26 wherein said solvent is propylene carbonate.