Plate-shaped external storage device and method of producing the same

• US 6,201,295 B1
• Filed: 09/18/1997
• Issued: 03/13/2001
• Est. Priority Date: 04/28/1993
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation), Toshiba Corporation
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Iwasaki, Hiroshi
• Primary Examiner(s): LOKE, STEVEN HO YIN
• Application Number:
  US08/933,309
• Time in Patent Office: 1,272 Days
• Field of Search: 257/679, 257/690, 257/693, 257/698, 257/727, 257/730, 257/668, 365/218, 365/226, 365/185.23, 365/185.18, 365/185.33, 365/185.17, 365/52, 365/185.03, 365/238.5, 365/185.22, 428/76, 235/441, 235/486, 361/737, 361/684, 361/686, 361/733, 714/7, 714/8, 714/710, 438/107, 438/552, 438/722, 348/220, 348/232, 348/231, 348/207, 359/152, 711/103, 360/133, 710/62, 710/129, 710/102, 710/113, 710/2
• US Class Current: 257/679
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49805 the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

An external storage device includes a storage medium series element containing at least a non-volatile memory device and external connection terminals connected to input/output terminals of the storage medium series element. An insulator molds the series element and terminals into a plate to form a plate-shaped external storage device. The terminals may be exposed in concavities or in a plane on a peripheral surface of the external storage device.

Claims

1. A plate-shaped external storage device for recording and saving data and for use in combination with an external storage device unit main, the plate-shaped external storage device having a periphery composed of a front side, a back side, and longitudinal sides parallel to an inserting direction of the plate-shaped device into the external storage device unit main, the external storage device comprising:

a non-volatile semiconductor memory device provided with a plurality of input/output terminals;

a plurality of external connection terminals connected to the input/output terminals, the plurality of external connection terminals having end surfaces disposed on each of the longitudinal peripheral sides of the plate-shaped external storage device; and

an insulator coating and sealing the memory device and the external connection terminals unitarily into a molded plate to form a plate-shaped external storage device,

wherein the end surfaces of the plurality of external connection terminals are disposed on each of the longitudinal peripheral sides of the plate-shaped external storage device in concavities so as to permit attachment to and detachment from an engaging section of a connection section on the external storage device unit main,

wherein the plate-shaped external storage device has a cut-off portion at a corner on the back side, the cut-off portion providing an indicating mark for an indication of an insertion direction, and

wherein the plate-shaped external storage device is controlled by a control circuit.

2. An external storage device as claimed in claim 1, wherein the non-volatile semiconductor memory device is a NAND type flash memory device.

3. An external storage device as claimed in claim 1, wherein the insulator is an epoxy resin.