Making solder ball mounting pads on substrates

• US 6,201,305 B1
• Filed: 06/09/2000
• Issued: 03/13/2001
• Est. Priority Date: 06/09/2000
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Copia, Alexander W., Miles, Barry M., Darveaux, Robert F.
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US09/591,705
• Time in Patent Office: 277 Days
• Field of Search: 257/780, 257/781, 257/779
• US Class Current: 257/779
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05022 the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05026 the internal layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05567 the external layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/13006 Bump connector larger than the underlying bonding area, e.g. than the under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/13027 the bump connector being offset with respect to the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01327 : Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H05K 1/111 : Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/113 : Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 2201/09381 : Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component notches in edge pads H05K2201/09181
• CPC Class Codes: H05K 2201/0989 : Coating free areas, e.g. areas other than pads or lands free of solder resist
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention discloses a method of making solder ball mounting pads on a substrate that have better ball shear performance, ball thermal cycle reliability, ball attach yield, and ball positional tolerances, than the solder ball mounting pads of the prior art. The method includes providing a sheet of material having a layer of metal thereon, and patterning the layer to define a solder ball mounting pad therein. The pad includes a central pad having at least two spokes radiating outward from it. An insulative mask is formed over the metal layer, and an opening is formed in the mask such that the central pad and an inner portion of each of the spokes is exposed therethrough, and an outer portion of each of the spokes is covered by the mask. In one embodiment, the central pad, spokes, and opening in the mask are shaped and arranged with respect to each other such that the pad and exposed portion of the spokes form a radially symmetrical pattern within the opening.

Claims

1. A substrate of an electronic device for mounting solder balls thereon, the substrate comprising:

a sheet;

a metal layer on a surface of the sheet, the layer having a pattern in it defining a central pad therein, the pad having a plurality of spokes radiating outward therefrom; and

,

a insulative mask over the metal layer, the mask having an opening therein, the opening exposing the pad and a portion of each of the spokes therethrough.

2. The substrate of claim 1, wherein at least one of the spokes comprises a circuit trace.

3. The substrate of claim 1, further comprising a via connected to the central pad through the sheet.

4. The substrate of claim 1, wherein each of the opening in the mask and the pattern of metal exposed by the opening has a centroid, and wherein the centroid of the opening coincides with the centroid of the pattern.

5. The substrate of claim 1, wherein the portions of the spokes exposed by the opening have approximately equal widths.

6. The substrate of claim 5, wherein the central pad, the portion of the spokes exposed by the opening in the mask, and the opening in the mask are shaped and arranged with respect to each other such that the central pad and the exposed portion of the spokes form a radially symmetrical pattern within the opening.

7. The substrate of claim 6, wherein the central pad and the opening in the mask are circular in shape.

8. The substrate of claim 1, further comprising a ball of solder mounted on the central pad and the exposed portion of the spokes.

9. The substrate of claim 1, wherein the sheet comprises fiberglass, a polyimide resin, a ceramic, or an insulative layer on a semiconductor chip.

10. The substrate of claim 1, wherein the metal layer comprises copper, aluminum, gold, silver, nickel, tin, platinum, or a combination of the foregoing.

11. The substrate of claim 1, wherein the mask comprises an acrylic plastic, a polyimide, or an epoxy resin.

12. The substrate of claim 1, wherein at least two distinct fillets are formed by the central pad, the spokes, and the opening in the mask.

13. A solder ball mounting for an electronic device, the mounting, comprising:

a metal layer, including a central pad and at least two spokes radiating outward from the central pad;

a solder ball in a connection with the central pad and an inner portion of the at least two spokes; and

,

an insulative layer surrounding the connection and covering an outer portion of the spokes.

14. The mounting of claim 13, wherein the connection includes at least two distinct fillets defined by the central pad and the spokes.

15. A method for making a solder ball mounting pad on a substrate, the method comprising:

providing, a substrate having, a layer of metal thereon, the layer including a pattern defining a central pad with a plurality of spokes radiating outward therefrom; and

,

covering an outer portion of the spokes with an insulating layer.

16. The method of claim 15, wherein covering an outer portion of the spokes with an insulating layer comprises:

forming an insulative mask over the metal layer; and

,

forming an opening, in the mask that exposes the central pad and an inner end of each of the spokes therethrough.

17. The method of claim 16, wherein each of the opening in the mask and the pattern in the metal layer exposed by the opening has a respective centroid, and further comprising positioning the respective centroids such that they are coincident with each other.

18. A method for mounting a solder ball on an electronic device, the method comprising:

providing an electronic device having a surface with a metal layer thereon, the metal layer including a pattern defining a central pad having a plurality of spokes radiating outward therefrom;

forming an insulative mask over the metal layer, the mask having an opening in it through which the central pad and an inner portion of each of the spokes is exposed; and

,

reflowing a ball of solder on the central pad and the exposed portion of the spokes.