Thermal printing head, process for producing thermal printing head, recorder, sinter and target

• US 6,201,557 B1
• Filed: 03/16/1999
• Issued: 03/13/2001
• Est. Priority Date: 02/08/1996
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Takamura, Yasuhisa, Kitazawa, Yusuke
• Primary Examiner(s): Le, N.
• Assistant Examiner(s): FEGGINS, KRISTAL J
• Application Number:
  US09/117,827
• Time in Patent Office: 728 Days
• Field of Search: 347/204, 347/201, 347/203
• US Class Current: 347/203
• CPC Class Codes: B41J 2/1601 Production of bubble jet print heads B41J2/1606, B41J2/162 take precedence
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2/3353 Protective layers
• CPC Class Codes: B41J 2/3355 characterised by materials
• CPC Class Codes: B41J 2/3357 Surface type resistors
• CPC Class Codes: B41J 2/3359 Manufacturing processes
• CPC Class Codes: C04B 35/62222 obtaining ceramic coatings coating of mortars, concrete, artificial or natural stone or ceramics C04B41/45; laminated ceramic products B32B18/00; coating metallic materials C23; coating of glass C03C17/00, applying ceramic coatings on silicon for semi-conductor purposes H01L
• CPC Class Codes: C23C 14/3414 Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Abstract

A process for producing a protective layer or a primer layer for a heat-generating resistor for a thermal head by sputtering using a target comprising a sinter of a silicon nitride/silicon dioxide/magnesium oxide powder. By regulating the particle diameter of the powder, the target is prevented from suffering partial peeling during the sputtering.

Claims

1. A thermal printing head, comprising:

a supporting substrate;

a heat-generating resistor disposed on the supporting substrate;

an electrode connected to the heat-generating resistor; and

a protective layer which is formed to cover the heat-generating resistor and the electrode by sputtering with a sinter of powder, which comprises silicon nitride and silicon dioxide as principal components and magnesium oxide having an average particle diameter of 1.0 μ

m or below, used as a target.

2. The thermal printing head according to claim 1, further comprising a glaze glass layer between the supporting substrate and the electrode.

3. The thermal printing head according to claim 1 or 2, wherein the magnesium oxide contained in the powder has an average particle diameter of 0.1 to 0.5 μ

m.

4. The thermal printing head according to claim 1 or 2, wherein the powder has 0.01 to 5.0% by weight of the magnesium oxide.

5. The thermal printing head according to claim 1 or 2, wherein the powder has 0.1 to 0.5% by weight of magnesium oxide.

6. The thermal printing head according to claim 1 or 2, wherein the protective layer has 0.01 to 3.0 atm % of magnesium.

7. The thermal printing head according to claim 1 or 2, wherein the protective layer has a composition represented by:

9. The thermal printing head according to claim 2, wherein the primer layer for the heat-generating resistor has 0.01 to 3.0 atm % of magnesium.

10. The thermal printing head according to claim 2, wherein the primer layer for the heat-generating resistor has a composition represented by:

8. A thermal printing head, comprising:

a supporting substrate;

a glaze glass layer disposed an the supporting substrate;

a primer layer for a heat-generating resistor, which is formed on the glaze glass layer by sputtering with a sinter of powder, which comprises silicon nitride, silicon dioxide and magnesium oxide having an average particle diameter of 1.0 μ

m or below, used as a target;

a heat-generating resistor disposed on the supporting substrate;

an electrode connected to the heat-generating resistor; and

a protective layer which is formed to cover the heat-generating resistor and the electrode by sputtering with a sinter of powder, which comprises silicon nitride and silicon dioxide as principal components and magnesium oxide having an average particle diameter of 1.0 pm or below, used as a target.

11. A process for producing a thermal printing head, comprising:

a step of disposing a heat-generating resistor on a supporting substrate;

a step of connecting an electrode to the heat-generating resistor; and

a step of covering the heat-generating resistor and the electrode by sputtering with a sinter of powder comprising silicon nitride and silicon dioxide as principal components and magnesium oxide having an average particle diameter of 1.0 μ

m or below used as a target.

12. The process for producing a thermal printing head according to claim 11, wherein the magnesium oxide of the powder has an average particle diameter of 0.1 to 0.5 μ

m.

13. The process for producing a thermal printing head according to claim 11, wherein the powder has 0.01 to 5.0% by weight of the magnesium oxide.

14. The process for producing a thermal printing head according to claim 11, wherein the powder has 0.1 to 0.5% by weight of the magnesium oxide.

15. A process for producing a thermal printing head, comprising:

a step of disposing a heat-generating resistor on a supporting substrate with a glaze glass layer intervened therebetween;

a step of connecting an electrode to the heat-generating resistor; and

a step of covering the heat-generating resistor and the electrode by sputtering with a sinter of powder comprising silicon nitride and silicon dioxide as principal components and magnesium oxide having an average particle diameter of 1.0 μ

m or below used as a target.

16. A process for producing a thermal printing head, comprising:

a step of disposing a primer layer for a heat-generating resistor an a supporting substrate with a glaze glass layer intervened therebetween by sputtering with a sinter of powder comprising silicon nitride and silicon dioxide as principal components and magnesium oxide having an average particle diameter of 1.0 μ

m or below used as a target;

a step of disposing a heat-generating resistor on the primer layer for the heat-generating resistor;

a step of connecting an electrode to the heat-generating resistor; and

a step of covering the heat-generating resistor and the electrode by sputtering with a sinter of powder comprising silicon nitride and silicon dioxide as principal components and magnesium oxide having an average particle diameter of 1.0 μ

m or below used as a target.

17. A recorder, comprising a thermal printing head which has a supporting substrate;

a heat-generating resistor disposed on the supporting substrate;

an electrode connected to the heat-generating resistor; and

a protective layer formed to cover the heat-generating resistor and the electrode by sputtering with a sinter of powder comprising silicon nitride and silicon dioxide as principal components and magnesium oxide having an average particle diameter of 1.0 μ

m or below used as a target.

18. The recorder according to claim 17, wherein the thermal printing head further has a glaze glass layer between the supporting substrate and the electrode.

19. A recorder, comprising a thermal printing head which has a supporting substrate:

a glaze glass layer disposed on the supporting substrate;

a primer layer for a heat-generating resistor which is formed on the glaze glass layer by sputtering with a sinter of powder, which comprises silicon nitride and silicon dioxide as principal components and magnesium oxide having an average particle diameter of 1.0 μ

m or below, used as a target;

a heat-generating resistor disposed on the supporting substrate;

an electrode connected to the heat-generating resistor; and

a protective layer which is formed to cover the heat-generating resistor and the electrode by sputtering with a sinter of powder, which comprises silicon nitride and silicon dioxide as principal components and magnesium oxide having an average particle diameter of 1.0 μ

m or below, used as a target.

20. A sinter, which is produced by sintering powder which comprises silicon nitride and silicon dioxide as principal components and magnesium oxide having an average particle diameter of 1.0 μ

m or below.

21. The sinter according to claim 20, wherein the magnesium oxide contained in the powder has an average particle diameter of 0.1 to 0.5 μ

m.

22. The sinter according to claim 20, wherein the powder has 0.01 to 5.0% by weight of the magnesium oxide.

23. The sinter according to claim 20, wherein the powder has 0.1 to 0.5% by weight of the magnesium oxide.

24. A sinter, comprising a composition represented by

25. A target which is produced by sintering powder which comprises silicon nitride and silicon dioxide as principal components and magnesium oxide having an average particle diameter of 1.0 μ

m or below.

26. A target, comprising a composition represented by