Digital vibration coupling stud

• US 6,202,491 B1
• Filed: 10/23/1998
• Issued: 03/20/2001
• Est. Priority Date: 07/22/1997
• Status: Expired due to Term

• Current Assignee: SKF USA Incorporated (SKF)
• Original Assignee: SKF Condition Monitoring Inc
• Inventors: McCarty, William A., Thompson, Stephan L.
• Primary Examiner(s): Williams, Hezron
• Assistant Examiner(s): MILLER, ROSE MARY
• Application Number:
  US09/178,068
• Time in Patent Office: 879 Days
• Field of Search: 736/59, 736/60, 736/61, 735/93, 702/56, 702/77, 340/683
• US Class Current: 73/659
• CPC Class Codes: F16C 19/527 related to vibration and noise
• CPC Class Codes: F16C 2233/00 Monitoring condition, e.g. temperature, load, vibration
• CPC Class Codes: G01D 9/005 Solid-state data loggers
• CPC Class Codes: G01H 1/00 Measuring characteristics of vibrations in solids by using direct conduction to the detector G01H9/00, G01H11/00 take precedence
• CPC Class Codes: G01H 1/003 of rotating machines G01H1/10 takes precedence
• CPC Class Codes: G01M 13/028 Acoustic or vibration analysis
• CPC Class Codes: G01M 13/045 Acoustic or vibration analysis
• CPC Class Codes: G10K 11/18 Methods or devices for transmitting, conducting or directing sound G10K11/02, G10K11/36 take precedence

Abstract

A vibration coupling stud for use in a vibration monitoring system includes digital memory and temperature sensing devices. Data is transferred between the vibration coupling stud and a vibration monitor. Data stored in the stud may include measuring point identification, prior measurement data, machine or bearing part numbers, and alarm limits.

Claims

1. A vibration coupling stud having a body comprising an internal recess, said recess containing an electronic circuit element such that said body substantially surrounds said electronic circuit element, wherein said stud comprises first and second engageable portions which clamp said electronic circuit element in said recess when said portions are engaged.

2. The vibration coupling stud of claim 1, wherein said first engageable portion comprises a vibration monitor coupling point, and wherein said second engageable portion comprises a machine attachment point.

3. The vibration coupling stud of claim 2, wherein said vibration monitor coupling point comprises multiple start threads.

4. The vibration coupling stud of claim 1, wherein said first and second engageable portions are threadably engaged.

5. The vibration coupling stud of claim 1, wherein said electronic circuit element comprises a input/output terminal and a ground terminal.

6. The vibration coupling stud of claim 5, additionally comprising an electrical contact having one end in contact with said input/output terminal and another end extending through said first engageable portion.

7. The vibration coupling stud of claim 6, wherein said second engageable portion is in contact with said ground terminal.

8. The vibration coupling stud of claim 7, wherein said first engageable portion comprises a vibration monitor coupling point, and wherein said second engageable portion comprises a machine attachment point.

9. A vibration coupling stud comprising first and second engaged body portions and an internal recess, said stud additionally comprising an electronic circuit element clamped between said first and second body portions and captured in said internal recess.

10. The vibration coupling stud of claim 9, wherein said first engageable portion comprises a vibration monitor coupling point, and wherein said second engageable portion comprises a machine attachment point.

11. The vibration coupling stud of claim 10, wherein said vibration monitor coupling point comprises multiple start threads.

12. The stud of claim 9, wherein said first and second body portions are threadably engaged.

13. The stud of claim 9, wherein said electronic circuit element comprises a ground terminal, and wherein said ground terminal, said first body portion, and said second body portion are electrically connected.

14. A method of making a vibration coupling stud comprising:

forming a recess in a first body portion;

placing an electronic circuit element in said recess;

engaging a second body portion to said recess over said electronic circuit element such that said electronic circuit element is clamped between said first and second body portions and captured in said internal recess.

15. The method of claim 14, additionally comprising forming a vibration monitor coupling point in said first body portion and forming a machine attachment point in said second body portion.

16. The method of claim 14, additionally comprising forming a longitudinally extending hole in said first body portion, said longitudinally extending hole extending from a first end of said first body portion to said recess.

17. The method of claim 16, additionally comprising:

placing a longitudinally extending electrical contact in an insulating sleeve;

placing said insulating sleeve into said longitudinally extending hole such that said electrical contact touches said electronic circuit element.

18. A vibration coupling stud comprising:

a first body portion having a vibration monitor coupling point formed at a first end and a recess formed at a second end, said first body portion further comprising a hole extending from said vibration monitor coupling point to said recess;

an insulating sleeve mounted in said hole;

an electrical contact extending through said insulating sleeve having a first end proximate said vibration monitor coupling point and a second end proximate said recess;

an electronic circuit element comprising an input/output terminal and a ground terminal, said electronic circuit element being mounted in said recess such that said input/output terminal touches said second end of said electrical contact;

a second body portion engaged with said recess formed in said first body portion such that said second body portion touches said ground terminal of said electronic circuit.

19. The stud of claim 18, wherein said second body portion additionally comprises a machine attachment point.

20. The stud of claim 18, wherein said second body portion is threadably engaged with said first body portion.

21. The stud of claim 18, wherein said electronic circuit element comprises a memory integrated circuit.

22. The stud of claim 18, wherein said electronic circuit element comprises a digital temperature sensor.