Metal-resis bond grindstone and method for manufacturing the same

• US 6,203,589 B1
• Filed: 10/12/1999
• Issued: 03/20/2001
• Est. Priority Date: 03/31/1999
• Status: Expired due to Fees

• Current Assignee: Riken, Rolem
• Original Assignee: Riken
• Inventors: Ishii, Masayuki, Horio, Kenichiro, Karaki-Doy, Toshiro, Uno, Toshiaki, Ohmori, Hitoshi, Kasai, Toshio, Itoh, Nobuhide
• Primary Examiner(s): MARCHESCHI, MICHAEL A
• Application Number:
  US09/415,496
• Time in Patent Office: 525 Days
• Field of Search: 512/95, 512/98, 513/04, 512/93, 513/07
• US Class Current: 51/298
• CPC Class Codes: B24B 53/001 involving the use of electric current
• CPC Class Codes: B24D 18/0009 using moulds or presses
• CPC Class Codes: B24D 3/06 metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
• CPC Class Codes: B24D 3/28 Resins or natural or synthetic macromolecular compounds B24D3/22 takes precedence
• CPC Class Codes: B24D 3/34 characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties

Abstract

The method disclosed here comprises the steps of (a) mixing metal powder, a resin, abrasive grains, and a solid reducing agent at the normal (room) temperature through the melting point of the reducing agent to form a mixture and (b) molding and baking the mixture at the melting point of the reducing agent through that of the metal powder. The solid reducing agent is a fatty acid, preferably stearic acid having a volume ratio of 5 to 20% with respect to the metal powder. With is, it is possible to make metal-resin bond grindstones that give such high-quality mirror surfaces that have conductivity fit for ELID grinding and are not liable to have chippings or scratches and also have an Rmax value of approximately 3 nm or less.

Claims

1. A metal-resin bond conductive grindstones, comprising:

metal powder, a resin, abrasive grains, and a solid reducing agent which reduces said metal powder.

6. A metal-resin bond conductive grindstone according to claim 1, wherein said solid reducing agent is a fatty acid.

7. A metal-resin bond conductive grindstone according to claim 6, wherein said fatty acid is stearic acid.

8. A metal-resin bond conductive grindstone according to claim 1, wherein said solid reducing agent is present in an amount of between 5 and 20% by volume with respect to the metal powder.

9. A metal-resin bond conductive grindstone according to claim 6, wherein said fatty acid is present in an amount of between 5 and 20% by volume with respect to the metal powder.

10. A metal-resin bond conductive grindstone according to claim 6, wherein said grindstone has a resistivity of 0.6 to 3.3 ohm-mm.

11. A metal-resin bond conductive grindstone according to claim 7, wherein said grindstone has a resistivity of 0.6 to 3.3 ohm-mm.

12. A metal-resin bond conductive grindstone according to claim 8, wherein said grindstone has a resistivity of 0.6 to 3.3 ohm-mm.

13. A metal-resin bond conductive grindstone according to claim 9, wherein said grindstone has a resistivity of 0.6 to 3.3 ohm-mm.

2. A method for manufacturing a metal-resin bond grindstone, comprising the steps of:

(a) mixing metal powder, a resin, abrasive grains, and a solid reducing agent at a temperature between about room temperature and a melting point of said reducing agent to form a mixture; and

(b) molding and baking said mixture at a temperature between the melting point of said reducing agent and a melting point of said metal powder.

3. The method of manufacturing a metal-resin bond grindstone according to claim 2, wherein said solid reducing agent is a fatty acid.

4. The method of manufacturing a metal-resin bond grindstone according to claim 3, wherein said fatty acid is stearic acid used in a volume ratio of 5 to 20% with respect to the amount of the metal powder.

5. The method of manufacturing a metal-resin bond grindstone according to claim 2, wherein said molding and baking temperature is 200°

C.

14. A metal-resin bond conductive grindstone, comprising:

metal powder, a resin, abrasive grains, and a solid reducing agent which reduces said metal powder, wherein said grindstone has a resistivity of 0.6 to 3.3 ohm-mm.