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Wafer support system

  • US 6,203,622 B1
  • Filed: 01/11/2000
  • Issued: 03/20/2001
  • Est. Priority Date: 09/01/1995
  • Status: Expired due to Term
First Claim
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1. An apparatus for processing semiconductor wafers at elevated temperatures comprising:

  • a susceptor formed of at least two independent sections to be positioned in a high temperature processing chamber for supporting a wafer to be processed;

    said susceptor including a substantially disc-shaped lower section and a substantially disc-shaped upper section having a lower surface in engagement with an upper surface of said lower section;

    the engaging surfaces of said sections defining one or more gas channels therebetween;

    a plurality of gas inlets in said lower section opening to its lower surface and said channels;

    one or more gas outlets in said upper section opening to the upper surface of said upper section in an area beneath that in which a wafer to be processed is to be positioned, said outlets being open to said channels and thus connected to said inlets;

    whereby when a wafer is placed on the susceptor and a gas is supplied through said plurality of gas inlets to said one or more gas channels and out said one or more gas outlets a flow of gas is provided under the water and out around the outer edge of the wafer; and

    a shaft in communication with the susceptor for rotating said shaft together with said susceptor.

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