Microelectronic component mounting with deformable shell terminals
First Claim
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1. A connection component for mounting microelectronic devices comprising:
- (a) a dielectric sheet having first and second surfaces and having holes extending between said first and second surfaces; and
(b) an electrically conductive element disposed within each said hole, each said electrically conductive element being exposed at the first surface of the sheet for engagement with a contact of a microelectronic device, each said electrically conductive element including a thin, hollow flexible metallic shell exposed at the second surface of the dielectric sheet and a polymeric material disposed within each said shell.
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Abstract
A microelectronic element assembly such as a semiconductor chip assembly uses a connection component incorporating a dielectric sheet with electrically conductive elements therein. Each electrically conductive element may include a flexible shell. The flexible shells can be formed to assure reliable engagement with mating contact pads.
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Citations
20 Claims
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1. A connection component for mounting microelectronic devices comprising:
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(a) a dielectric sheet having first and second surfaces and having holes extending between said first and second surfaces; and
(b) an electrically conductive element disposed within each said hole, each said electrically conductive element being exposed at the first surface of the sheet for engagement with a contact of a microelectronic device, each said electrically conductive element including a thin, hollow flexible metallic shell exposed at the second surface of the dielectric sheet and a polymeric material disposed within each said shell. - View Dependent Claims (2, 3, 5, 6, 7, 8, 9, 10, 11)
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4. A component as claimed in claim 4 wherein each said shell has interruptions therein.
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12. A connection component for mounting microelectronic devices comprising:
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(a) a dielectric sheet having first and second surfaces and having holes extending between said first and second surfaces; and
(b) an electrically conductive element disposed within each said hole, each said electrically conductive element including a thin, hollow flexible metallic shell exposed at the second surface of the dielectric sheet and protruding from the second surface of the dielectric sheet; and
c) a mass of a soft, electrically conductive material disposed in each said hole adjacent said first surface. - View Dependent Claims (13, 14)
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15. A semiconductor chip assembly comprising:
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(a) a semiconductor chip having a front surface with contacts thereon;
(b) a dielectric sheet separate from said chip, said sheet having first and second surfaces and having holes extending between said first and second surfaces; and
(c) an electrically conductive element disposed within each said hole, each said electrically conductive element including a thin, flexible metallic shell exposed at the second surface of the dielectric sheet, said front surface of said semiconductor chip facing said first surface of said dielectric sheet, said contacts being aligned with said holes and electrically connected to said electrically conductive elements in said holes. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification