Microelectronic component mounting with deformable shell terminals

• US 6,204,455 B1
• Filed: 06/30/1999
• Issued: 03/20/2001
• Est. Priority Date: 07/31/1995
• Status: Expired due to Term

• Current Assignee: Tessera, Inc. (Adeia, Inc.)
• Original Assignee: Tessera, Inc. (Adeia, Inc.)
• Inventors: Gilleo, Kenneth B., Karavakis, Konstantine
• Primary Examiner(s): Gaffin, Jeffrey
• Assistant Examiner(s): NORRIS, JEREMY C
• Application Number:
  US09/345,548
• Time in Patent Office: 629 Days
• Field of Search: 174/261, 174/262, 174/263, 174/265, 174/266, 361/772, 361/773, 361/774, 361/760, 361/803
• US Class Current: 174/261
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

A microelectronic element assembly such as a semiconductor chip assembly uses a connection component incorporating a dielectric sheet with electrically conductive elements therein. Each electrically conductive element may include a flexible shell. The flexible shells can be formed to assure reliable engagement with mating contact pads.

Claims

1. A connection component for mounting microelectronic devices comprising:

(a) a dielectric sheet having first and second surfaces and having holes extending between said first and second surfaces; and

(b) an electrically conductive element disposed within each said hole, each said electrically conductive element being exposed at the first surface of the sheet for engagement with a contact of a microelectronic device, each said electrically conductive element including a thin, hollow flexible metallic shell exposed at the second surface of the dielectric sheet and a polymeric material disposed within each said shell.

2. A component as claimed in claim 1 wherein each said shell is spheroidal.

3. A component as claimed in claim 2 wherein each said shell is exposed at the first surface of the dielectric sheet.

5. A component as claimed in claim 2 wherein said polymeric material within each shell is in the form of a hollow spheroidal body.

6. A component as claimed in claim 1 wherein said polymeric material is selected from the group consisting of elastomers and flexible epoxies.

7. A component as claimed in claim 1 wherein each said shell includes a layer of metallic material overlying the polymeric material and wherein each said shell is less than about 10 microns thick.

8. A component as claimed in claim 1 wherein each said shell is formed from a metal selected from the group consisting of gold, nickel, copper, titanium and alloys and combinations thereof.

9. A component as claimed in claim 1 wherein each said shell is formed from a shape memory alloy.

10. A component as claimed in claim 1 further comprising an electrically conductive bonding material disposed on each said shell.

11. A component as claimed in claim 1 wherein each said shell protrudes from the second surface of the dielectric sheet.

4. A component as claimed in claim 4 wherein each said shell has interruptions therein.

12. A connection component for mounting microelectronic devices comprising:

(a) a dielectric sheet having first and second surfaces and having holes extending between said first and second surfaces; and

(b) an electrically conductive element disposed within each said hole, each said electrically conductive element including a thin, hollow flexible metallic shell exposed at the second surface of the dielectric sheet and protruding from the second surface of the dielectric sheet; and

c) a mass of a soft, electrically conductive material disposed in each said hole adjacent said first surface.

13. A component as claimed in claim 12 wherein said soft material includes a polymeric material.

14. A component as claimed in claim 12 wherein each said shell is an open shell having a convex side facing out of the hole at said second surface of the sheet and a concave side facing into the hole, the soft conductive material filling the interior of the shell.

15. A semiconductor chip assembly comprising:

(a) a semiconductor chip having a front surface with contacts thereon;

(b) a dielectric sheet separate from said chip, said sheet having first and second surfaces and having holes extending between said first and second surfaces; and

(c) an electrically conductive element disposed within each said hole, each said electrically conductive element including a thin, flexible metallic shell exposed at the second surface of the dielectric sheet, said front surface of said semiconductor chip facing said first surface of said dielectric sheet, said contacts being aligned with said holes and electrically connected to said electrically conductive elements in said holes.

16. An assembly as claimed in claim 15 further comprising a substrate having contact pads thereon, said substrate facing said second surface of said dielectric sheet, contact pads being engaged with said shells of said electrically conductive elements and electrically connected through said electrically conductive elements to said contacts of said semiconductor chip.

17. An assembly as claimed in claim 16 wherein each said shell is engaged between a contact on the semiconductor chip and a contact on the substrate.

18. An assembly as claimed in claim 17 wherein each said shell is spheroidal and wherein each shell is bonded to a contact on the semiconductor chip and to a contact pad on the substrate.

19. An assembly as claimed in claim 16 wherein each said conductive element includes a mass of a soft, electrically conductive material disposed in each said hole adjacent said first surface.

20. An assembly as claimed in claim 19 wherein each said shell is an open shell having a convex side facing out of the hole at said second surface of the sheet and a concave side facing into the hole, the soft conductive material filling the interior of the shell and contacting one said contact on said semiconductor chip.