Heat sink retention components and system

• US 6,205,026 B1
• Filed: 01/31/2000
• Issued: 03/20/2001
• Est. Priority Date: 01/31/2000
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Ulen, Neal, Shah, Ketan R., Raza, Ishfaqur, Wong, Thomas J.
• Primary Examiner(s): Tolin, Gerald
• Assistant Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US09/494,807
• Time in Patent Office: 414 Days
• Field of Search: 361/702-704, 361/707, 361/709, 361/690, 361/694, 361/695, 361/697, 361/717-719, 361/722, 165/80.3, 165/185, 257/706, 257/707, 257/712, 257/713, 257/717-719, 257/722, 257/727, 174/16.3, 911/516, 911/522, 911/523, 248/316.7, 248/510, 244/57, 245/20, 244/58, 244/95
• US Class Current: 361/704
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: Y10T 24/44026 for cooperating with aperture in supporting structure or structure-to-be-secured
• CPC Class Codes: Y10T 24/44556 Resilient gripping member

Abstract

An integrated circuit system has an increased reliability when subjected to stress and vibration. The system includes heat sink retention clips that provide support to the retention system when an upward force is applied to a heat sink. An EMI shield can be provided that provides peripheral shielding for the circuit package thermally coupled to the heat sink.

Claims

1. A heat sink system comprising:

a heat sink;

a heat sink retention module located below the heat sink to provide vertical support for the heat sink; and

a heat sink retention clip located above the heat sink and having a first end, a second opposite end and a central region, the heat sink retention clip comprising a first retention window located at the first end and a second retention window located at the second end, the first and second retention windows mechanically couple to first and second retention tabs provided on the heat sink retention module, the heat sink retention clip provides a clamping force on the heat sink to keep the heat sink in contact with the heat sink retention module, the heat sink retention clip further comprises a stop window located in the central region to mechanically engage a third retention tab when an upward force is applied to the heat sink.

2. The heat sink system of claim 1 wherein the heat sink comprises a heat sink base and heat dissipating elements coupled to the heat sink base.

3. The heat sink system of claim 2 wherein the heat sink retention clip engages the heat sink base.

4. The heat sink system of claim 3 wherein the heat sink retention clip further comprises a downwardly extending pedestal tab to fit in a groove provided on a top surface of the heat sink base.

5. The heat sink system of claim 1 wherein the heat sink retention module is connected to a circuit board and the heat sink system further comprises:

an electromagnetic interference frame located between the heat sink and the circuit board, the electromagnetic interference frame surrounds a periphery of a circuit package thermally coupled to a bottom of the heat sink, the electromagnetic interference frame further electrically couples the heat sink to the circuit board.

6. A heat sink system comprising:

an integrated circuit package having a top surface;

a heat sink thermally coupled to the top surface of the integrated circuit package;

a circuit board located below and electrically coupled to the integrated circuit package;

an electromagnetic interference frame located between the heat sink and the circuit board, the electromagnetic interference frame surrounds a periphery of the integrated circuit package, the electromagnetic interference frame further electrically couples the heat sink to the circuit board;

a heat sink retention module coupled to the circuit board and located below the heat sink to provide vertical support for the heat sink; and

a heat sink retention clip located above the heat sink and having a first end, a second opposite end and a central region, the heat sink retention clip comprising a first retention window located at the first end and a second retention window located at the second end, the first and second retention windows mechanically couple to first and second retention tabs provided on the heat sink retention module, the heat sink retention clip provides a clamping force on the heat sink to keep the heat sink in contact with the heat sink retention module, the heat sink retention clip further comprises a stop window located in the central region to mechanically engage a third retention tab when an upward force is applied to the heat sink.

7. The heat sink system of claim 6 wherein the heat sink retention clip further comprises a downwardly extending pedestal tab to fit in a groove provided on a top surface of a heat sink base of the heat sink.

8. A heat sink system comprising:

a heat sink;

a heat sink retention module located below the heat sink to provide vertical support for the heat sink; and

a heat sink retention clip comprising,

a central region,

first and second arm members extending laterally and upwardly in opposite directions from the central region,

a first fastener end downwardly extending from an outward end of the first arm member, the first fastener end comprises a first retention window to mechanically couple to a first retention tab provided on a first side of the heat sink retention module,

a second fastener end downwardly extending from an outward end of the second arm member, the second fastener end comprises a second retention window to mechanically couple to a second retention tab provided on a second side of the heat sink retention module, the heat sink retention clip provides a clamping force on the heat sink to keep the heat sink in contact with the heat sink retention module, and

a stop plate downwardly extending from the central region and having a stop window to mechanically engage a third retention tab when an upward force is applied to the heat sink.

9. The heat sink system of claim 8 wherein the heat sink retention clip further comprises a downwardly extending pedestal tab that fits into an opening provided on a top surface of a heat sink base of the heat sink.

10. The heat sink system of claim 8 wherein the heat sink retention module is connected to a circuit board and the heat sink system further comprises:

an electromagnetic interference frame located between the heat sink and the circuit board, the electromagnetic interference frame surrounds a periphery of a circuit package thermally coupled to a bottom of the heat sink, the electromagnetic interference frame further electrically couples the heat sink to the circuit board.

11. The heat sink system of claim 10 wherein the circuit package comprises a processor circuit.

12. A heat sink system comprising:

an integrated circuit package having a top surface;

a heat sink thermally coupled to the top surface of the integrated circuit package, the heat sink comprises a heat sink base and heat dissipating elements coupled to the heat sink base;

a cooling fan coupled to the heat dissipating elements;

a circuit board located below and electrically coupled to the integrated circuit package;

a plurality of heat sink retention modules coupled to the circuit board and located below the heat sink to provide vertical support for the heat sink;

at least two retention clips coupled to the plurality of heat sink retention modules, the at least two retention clips are connected to the plurality of heat sink retention modules in at least two locations so that the at least two retention clips provide a downward force on the heat sink, the at least two retention clips further comprise a safety catch to prevent damage to the retention clip when an upward force is applied to the heat sink; and

an electromagnetic interference frame located between the heat sink and the circuit board, the electromagnetic interference frame surrounds a periphery of the integrated circuit package, the electromagnetic interference frame further electrically couples the heat sink to the circuit board.

13. The heat sink system of claim 12 further comprising an interconnect socket located between the circuit board and the integrated circuit package.

14. The heat sink system of claim 12 wherein the integrated circuit package comprises a processor circuit.

15. The heat sink system of claim 12 wherein the heat sink retention clip further comprises a downwardly extending pedestal tab that fits into an opening provided on a top surface of the heat sink base.