Method of making ultrasonically welded, staked of swaged components in an implantable medical device

• US 6,205,358 B1
• Filed: 09/23/1998
• Issued: 03/20/2001
• Est. Priority Date: 08/01/1997
• Status: Expired due to Term

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Haeg, Daniel C., Kelley, James F., Wiklund, Craig L.
• Primary Examiner(s): EVANISKO, GEORGE ROBERT
• Application Number:
  US09/159,119
• Time in Patent Office: 909 Days
• Field of Search: 607/36-38, 298/25, 295/921, 298/54, 298/57
• US Class Current: 607/36
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings
• CPC Class Codes: A61N 1/37512 Pacemakers
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor

Abstract

The present invention generally relates to implantable medical devices and more particularly to various means for ultrasonically welding, swaging or staking various components in an implantable medical device, most preferably by employing appropriately configured covers or lids. Covers or lids are attached to header or connector modules mounted on an hermetically enclosed and sealed enclosure, where the connector or header module and enclosure comprise an implantable medical device. The covers or lids preferably trap or otherwise secure any of a number of various connector or header module components within the header or connector modules. Examples of such trapped or secured components include grommets, set screw connector blocks, seals, feedthrough wires, multi-beam contacts, electrical contacts, antennas, radio-opaque markers, connector ribbons and the like.

Claims

1. A method of securing at least one component within a pre-formed module including a pre-formed header module and a connector module attached to a hermetically sealed enclosure of an implantable medical device, wherein said hermetically sealed enclosure is formed with a plurality of electrical feedthrough, each feedthrough having a feedthrough pin extending through an enclosure wall for attachment with a like plurality of connector components located within a like plurality of component recesses, including making an electrical connection which comprises the steps of:

forming a ribbon connector of a plurality of conductive ribbons and a radiopaque marker joined by bridges, each ribbon having first and second ribbon connector contacts;

attaching each of said first ribbon connector contacts to a terminal of a feedthrough pin;

attaching each of said second ribbon connector contact to one of said connector components; and

severing said bridges to electrically isolate each of said ribbons and said radiopaque marker.

2. The method of claim 1, further including a step of forming a recess cover by shaping an inward facing recess cover to accommodate all of said ribbons and said radiopaque marker separated from contact with one another.

3. The method of claim 2, wherein said connector components comprise multi-beam connectors.

4. The method of claim 1, wherein said connector component comprises a multi-beam connector.

5. The method of claim 1, wherein the preformed module is formed of a thermoplastic material having an outer surface comprising an attachment surface and an exposed module surface and is configured for attachment at said attachment surface to a mating surface of the hermetically sealed enclosure.

6. The method of claim 5 wherein each component recess in the enclosure is formed in the exposed module surface and bounded by a recess outer periphery.

7. The method of claim 6 further including a step of forming a recess cover of thermoplastic material having a cover surface comprising an outward facing surface bounded by a cover peripheral edge and an inward facing surface, said cover peripheral edge being shaped to match the recess outer periphery of the component recess and to position the inward facing surface in overlying relation to the recess outer periphery and to form a first mating surface in overlying relation to the recess outer periphery and to form a first mating surface for mating with a second mating surface formed on the exposed module surface adjacent the recess outer periphery.

8. The method of claim 6 further including a step of isolating a component within a component recess and sealing the recess cover against ingress of body fluids by applying ultrasonic welding energy against the recess cover and the exposed module surface in a region of the first and second mating surfaces thereof for a time period sufficient to effect a melting of the thermoplastic materials and ultrasonic welding of the recess cover to the preformed module upon removal of the ultrasonic energy.