Method for air-wound coil vacuum pick-up, surface mounting, and adjusting

• US 6,205,646 B1
• Filed: 12/21/1998
• Issued: 03/27/2001
• Est. Priority Date: 12/21/1998
• Status: Expired due to Fees

• Current Assignee: Assembleon B.V.
• Original Assignee: Philips Electronics North America Corporation (Koninklijke Philips N.V.)
• Inventors: Thibado, David H.
• Primary Examiner(s): Young, Lee
• Assistant Examiner(s): TRINH, MINH N
• Application Number:
  US09/217,429
• Time in Patent Office: 827 Days
• Field of Search: 296/021, 298/32, 298/40, 297/39, 298/43, 298/25, 296/06, 296/05, 336/192, 336/205, 336/200, 336/225, 336/227, 336/228
• US Class Current: 29/602.1
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H05K 13/0409 Sucking devices
• CPC Class Codes: H05K 2201/10568 Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/082 Suction, e.g. for holding solder balls or components
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49149 by metal fusion bonding

Abstract

An air-wound, coil-type, passive inductor includes a surface which allows the coil to be picked-up using a vacuum probe of a head of a pick-an-place machine and the surface does not interfere with adjusting the spacing between the loops of the coil for tuning the coil after the coil is attached to a circuit board. Terminal ends of the coil are placed on solder paste on interconnection pads on the circuit board, then the board is heated to reflow the solder, and then washed to remove the flux contained in the solder paste. The surface may be adapted to be removed or at least degraded by the heating, or the washing, or afterwards by a mechanical method of removal without damaging the coil.

Claims

1. A method of producing circuit boards, comprising the steps of:

providing at least one coil of loops that are multiple sequential loops;

providing a surface connected to the coil and extending over at least a subsection of a lateral surface of the coil;

feeding a circuit board into a pick-and-place machine;

feeding the coil into the pick-and-place machine;

picking-up the coil by the surface using a vacuum head of the pick-and-place machine;

connecting the terminals of the coil to corresponding terminals of the circuit board including placing the coil on the circuit board to form electrically conductive circuits of the circuit board;

providing a signal in the circuit board and monitoring a resulting output signal of the circuit board;

comparing the output signal with predetermined criteria; and

adjusting the position of the loops of the coil for tuning the coil, if the output signal does not meet the predetermined criteria.

2. The method of claim 1, wherein adjusting the position of the loops includes removing at least a portion of the surface, so that the spacing between the adjacent loops of the coil can be changed to tune the coil.

3. The method of claim 1 in which the surface does not extend onto all of the loops and adjusting the position of the loops includes bending the loops, that the surface does not extend over, for tuning the coil.

4. The method of claim 1 in which the surface is sufficiently weak or flexible so that the loops on which the surface extends can be bent for adjusting the position of the loops without otherwise damaging the coil.

5. The method of claim 1 in which adjusting the position includes degrading the surface by exposing the surface to a solvent after the coil is connected to the circuit board, whereby the loops can be bent for adjusting the position of the loops.

6. The method of claim 5 in which adjusting the position o f the loops includes degrading the surface by exposing the surface to water and at least a portion of a material of the surface is removed by washing in water without damaging the coils.

7. The method of claim 1 in which adjusting the position of the loops includes degrading the surface by heating the circuit board after connecting the coil to the circuit board after which the loops may be bent for adjusting the position of the loops.

8. The method of claim 7 in which a material of the surface flows when exposed to soldering temperature of eutectic Pb/Sn alloy so that after heating the circuit board to reflow the solder at least some of the coils become mechanically bendable to allow adjusting the position of the loops.

9. The method of claim 7 in which a material of the surface sublimates when exposed to soldering temperature of eutectic Pb/Sn alloy so that after reflow soldering the circuit board at least some of the coils become mechanically bendable for adjusting the position of the loops.

10. The method of claim 4 in which the surface is capable of being cut between adjacent loops of the coil using a tool without damaging the coil and then the position of the loops can be adjusted to tune the coil.

11. The method of claim 1, further comprising placing a metal soldering alloy onto the terminals of the circuit board and heating the circuit board to reflow solder the terminals of the coil onto the terminals of the circuit board.

12. The method of claim 1 in which:

at least a portion of the surface is removable from the coil without damaging the coil and adjusting the position includes removing that portion of the surface so that the position of the loops can be adjusted to tune the coil;

the surface does not extend onto all of the loops of the coil and adjusting the position includes bending the loops, that the surface does not extend over, for tuning the coil;

the surface is sufficiently weak or flexible so that the loops over which the surface extends can be easily bent for adjusting the position of the loops sufficient for tuning the coil without otherwise damaging the coil;

adjusting the position includes degrading the surface by exposing the surface to a solvent after the coil is connected to the circuit board whereby the loops can be bent to adjust the position of the loops for tuning the coil;

adjusting the position includes degrading the surface by exposing the surface to water and at least a portion of a material of the surface can be removed by washing in water without damaging the coil;

adjusting the position includes degrading the surface by heating the circuit board after which the position of the loops can be changed by bending the loops for tuning the coil;

the material of the surface flows when exposed to soldering temperature of eutectic Pb/Sn alloy so that after heating the circuit board to reflow the solder at least some of the coils become mechanically bendable to allow adjusting the position for tuning the coil;

the material of the surface sublimates when exposed to soldering temperature of eutectic Pb/Sn alloy so that after reflow soldering the circuit board at least some of the coils become mechanically bendable for adjusting the position for tuning the coil;

the surface is sufficiently soft and arranged so that it can be easily cut using a tool without damaging the coil for adjusting the positron of the loops for tuning the coil;

a material of the surface is a water soluble material;

the terminals are straight sections of wire extending tangentially to the loops of wire at each end of the coil of wire;

the coil is an air coil without any core;

the wire is between 0.05 mm and 1 mm in diameter;

the loops are spaced between 1.1 and 20 times the diameter of the wire;

the diameter of the loops is between 10 and 100 times the diameter of the wire;

the position of the loops is adjusted to exceed a manufacturing tolerances of the coil; and

the method further comprises placing connecting material onto terminals of the circuit board;

the terminals of the circuit board are flat conductive pads; and

the connecting material includes a metal soldering alloy and the method further comprises heating the circuit board to reflow solder the terminals of the coil onto the pads.

14. The method of claim 1 in which the loops are spaced between 2 and 10 times the diameter of the wire.

13. A method of producing circuit boards comprising the steps of:

providing at least one air-core coil comprising multiple sequential loops;

providing a surface connected to the coil and extending over at least a subsection of the coil;

picking-up the coil by the surface using a vacuum head of a pick-and-place machine;

placing the coil on a circuit board using the vacuum head;

electrically connecting the coil to the circuit board and

adjusting the position of the loops of the coil to tune the coil.