Integrated flow controller module

• US 6,206,022 B1
• Filed: 01/11/2000
• Issued: 03/27/2001
• Est. Priority Date: 10/30/1998
• Status: Expired due to Fees

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Jang, Ruei-Hung, Ke, Chun-Hsu, Huang, Raey-Shing, Wan, Yue-Min, Tsai, Ming-Jye, Wu, Ching-Yi, Peng, Cheng-Jien
• Primary Examiner(s): Michalsky, Gerald A.
• Application Number:
  US09/480,997
• Time in Patent Office: 441 Days
• Field of Search: 137/486, 137/15.18, 251/11
• US Class Current: 137/15.18
• CPC Class Codes: G05D 7/0694 by action on throttling means or flow sources of very small size, e.g. microfluidics microvalves F16K99/0001; microstructural devices per se B81B
• CPC Class Codes: Y10T 137/0491 Valve or valve element assembling, disassembling, or replacing
• CPC Class Codes: Y10T 137/7759 Responsive to change in rate of fluid flow
• CPC Class Codes: Y10T 137/7761 Electrically actuated valve

Abstract

A flow controller module comprising at least one micro flow sensor and a microvalve, integrated in a micro flow channel, is disclosed. The micro flow sensor comprises a pressure sensitive flow sensor. At the position of the micro flow sensor, the micro flow channel is provided with an orifice so that pressure of a flow may be enlarged to facilitate measurement of the flow speed. The microvalve comprises a silicon microbridge with a mesa structure and is driven by a voltage. The microvalve may operate under a normally closed mode or a normally open mode. Disclosed in this invention is also a flow sensor suited in the integrated flow controller module. Methods for preparing the flow sensor and the flow controller module are also disclosed.

Claims

1. A method for preparing an integrated flow controller module comprising the steps of:

preparing a substrate;

etching said substrate to form a fluid inlet, a fluid outlet and at least one fluid channel section;

forming a middle layer on said substrate;

etching said middle layer to form at least a fluid channel section, at least one fluid stopper and a mesa;

forming an elastic wall layer on said middle layer;

fixing a number of electrodes on said elastic wall layer at positions including a position adjacent to said mesa;

fixing resistors of the same number as the number of said electrodes on said elastic wall layer at positions fixed with said resistors before said resistors are fixed, such that said electrodes overlap at least partially with said resistors, respectively;

forming an upper layer on said elastic wall layer, wherein said upper layer is provided with cavities of the same number as the number of said electrodes; and

providing said cavities with electrodes inside said cavities opposite to positions corresponding to said electrodes on said elastic wall layer.

2. The method according to claim 1 wherein said step of forming said upper layer comprises:

forming an upper layer;

forming a number of sacrificial areas on said upper layer to define said cavities;

etching said upper layer to form said cavities; and

coating said cavities.

3. The method according to claim 1 wherein said step of forming said upper layer comprises:

forming an upper layer;

etching said upper layer to form said cavities; and

bonding said upper layer with said elastic wall layer such that said cavities are positioned on said electrodes respectively.

4. The method according to claim 1 further comprising a step of forming a thermally insulator in said elastic wall layer.