Deposition apparatus and related method with controllable edge exclusion

• US 6,206,976 B1
• Filed: 08/27/1999
• Issued: 03/27/2001
• Est. Priority Date: 08/27/1999
• Status: Expired due to Fees

• Current Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Gould-Choquette, Adrienne, Crevasse, Annette Margaret
• Primary Examiner(s): LUND, JEFFRIE ROBERT
• Application Number:
  US09/383,829
• Time in Patent Office: 578 Days
• Field of Search: 118/715, 118/720, 118/721, 118/724, 118/725, 118/728, 118/729, 118/730, 118/500, 118/504, 156/345, 204/298.07, 204/298.11, 204/298.15
• US Class Current: 118/720
• CPC Class Codes: C23C 16/45521 the gas, other than thermal contact gas, being introduced the rear of the substrate to flow around its periphery
• CPC Class Codes: C23C 16/4585 Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
• CPC Class Codes: H01L 21/68735 characterised by edge profile or support profile

Abstract

A deposition apparatus includes a controllable edge exclusion assembly for controllably excluding deposition adjacent a peripheral edge of a wafer within a deposition chamber and based upon fluid flow. The controllable edge exclusion assembly includes a ring-shaped body extending inwardly from the peripheral edge of the wafer and spaced above an adjacent front surface of the wafer. The ring-shaped body has fluid passageways so that fluid flow from adjacent a back surface of the wafer passes over the peripheral edge of the wafer and through the fluid passageways to thereby exclude deposition adjacent the peripheral edge of the wafer. The assembly also includes a flow controller associated with the fluid passageways for controlling fluid flow therethrough. The flow controller may include a control body having a plurality of fluid passageways therein, and which is relatively movable with respect to the ring-shaped body. This relative movement provides a selectable amount of alignment between the fluid passageways of the control body and the ring-shaped body to thereby control fluid flow. In another embodiment, the flow controller includes respective iris diaphragms for the fluid passageways.

Claims

1. A deposition apparatus comprising:

a deposition chamber;

a support for supporting a wafer in the deposition chamber;

a controllable edge exclusion assembly for excluding deposition adjacent a peripheral edge of the wafer based upon fluid flow and comprising

a ring-shaped body extending inwardly from the peripheral edge of the wafer and spaced above an adjacent front surface of the wafer, the ring-shaped body having a plurality of fluid passageways extending therethrough so that fluid flow from adjacent a back surface of the wafer passes over the peripheral edge of the wafer and through the fluid passageways to thereby exclude deposition adjacent the peripheral edge of the wafer, and

a flow controller adjacent the fluid passageways of said ring-shaped body for controlling fluid flow therethrough.

2. A deposition apparatus according to claim 1 wherein said flow controller comprises a control body having a plurality of fluid passageways therein;

and wherein said control body is relatively movable with respect to the ring-shaped body to provide a selectable amount of alignment between the fluid passageways of said control body and said ring-shaped body to thereby control fluid flow.

3. A deposition apparatus according to claim 2 wherein said control body and said ring-shaped body are relatively rotatable.

4. A deposition apparatus according to claim 3 wherein said ring-shaped body is fixed relative to said wafer support, and said control body is rotatable relative to said ring-shaped body.

5. A deposition apparatus according to claim 2 wherein said control body is positioned adjacent an upper surface of said ring-shaped body opposite the wafer.

6. A deposition apparatus according to claim 2 wherein the fluid passageways of said control body have a substantially same cross-sectional area as the fluid passageways of said ring-shaped body.

7. A deposition apparatus according to claim 2 wherein at least one of said control body and said ring-shaped body has a plurality of sets of fluid passageways therein of different cross-sectional areas.

8. A deposition apparatus according to claim 2 wherein said flow controller comprises a drive device for relatively moving said control body and said ring-shaped body responsive to control signals generated externally from said deposition chamber.

9. A deposition apparatus according to claim 2 wherein said control body has a ring shape.

10. A deposition apparatus according to claim 1 wherein said flow controller comprises respective iris diaphragms for the fluid passageways.

11. A deposition apparatus according to claim 10 wherein said flow controller comprises a drive device for operating said iris diaphragms responsive to control signals generated externally from said deposition chamber.

12. A deposition apparatus according to claim 1 wherein the fluid passageways of said ring-shaped body are angled upwardly and radially outwardly from the wafer.

13. A controllable edge exclusion assembly for controllably excluding deposition adjacent a peripheral edge of a wafer within a deposition chamber and based upon fluid flow, the controllable edge exclusion assembly comprising:

a ring-shaped body extending inwardly from the peripheral edge of the wafer and spaced above an adjacent front surface of the wafer, the ring-shaped body having a plurality of fluid passageways extending therethrough so that fluid flow from adjacent a back surface of the wafer passes over the peripheral edge of the wafer and through the fluid passageways to thereby exclude deposition adjacent the peripheral edge of the wafer; and

a flow controller adjacent the fluid passageways of said ring-shaped body for controlling fluid flow therethrough.

14. A controllable edge exclusion assembly according to claim 13 wherein said flow controller comprises a control body having a plurality of fluid passageways therein;

and wherein said control body is relatively movable with respect to the ring-shaped body to provide a selectable amount of alignment between the fluid passageways of said control body and said ring-shaped body to thereby control fluid flow.

15. A controllable edge exclusion assembly according to claim 14 wherein said control body and said ring-shaped body are relatively rotatable.

16. A controllable edge exclusion assembly according to claim 15 wherein said ring-shaped body is fixed relative to said wafer support, and said control body is rotatable relative to said ring-shaped body.

17. A controllable edge exclusion assembly according to claim 14 wherein said flow controller comprises respective iris diaphragms for the fluid passageways.

18. A controllable edge exclusion assembly according to claim 14 wherein said flow controller comprises a drive device for controlling fluid flow responsive to control signals.

19. A controllable edge exclusion assembly for controllably excluding deposition adjacent a peripheral edge of a wafer within a deposition chamber and based upon fluid flow, the controllable edge exclusion assembly comprising:

a ring-shaped body extending inwardly from the peripheral edge of the wafer and spaced above an adjacent front surface of the wafer, the ring-shaped body having a plurality of fluid passageways extending therethrough so that fluid flow from adjacent a back surface of the wafer passes over the peripheral edge of the wafer and through the fluid passageways to thereby exclude deposition adjacent the peripheral edge of the wafer, and

a control body having a plurality of fluid passageways therein and being relatively movable with respect to said ring-shaped body.

20. A controllable edge exclusion assembly according to claim 19 wherein said control body and said ring-shaped body are relatively rotatable.

21. A controllable edge exclusion assembly according to claim 19 wherein said control body is positioned adjacent an upper surface of said ring-shaped body opposite the wafer.

22. A controllable edge exclusion assembly according to claim 19 wherein the fluid passageways of said control body have a substantially same cross-sectional area as the fluid passageways of said ring-shaped body.

23. A controllable edge exclusion assembly according to claim 19 wherein a least one of said control body and said ring-shaped body has a plurality of sets of fluid passageways therein of different cross-sectional areas.

24. A controllable edge exclusion assembly according to claim 19 wherein said flow controller comprises a drive device for relatively moving said control body and said ring-shaped body responsive to control signals.

25. A controllable edge exclusion assembly according to claim 19 wherein said control body has a ring shape.

26. A controllable edge exclusion assembly according to claim 19 wherein the fluid passageways of said ring-shaped body are angled upwardly and radially outwardly from the wafer.

27. A controllable edge exclusion assembly for controllably excluding deposition adjacent a peripheral edge of a wafer within a deposition chamber and based upon fluid flow, the controllable edge exclusion assembly comprising:

a ring-shaped body extending inwardly from the peripheral edge of the wafer and spaced above an adjacent front surface of the wafer, the ring-shaped body having a plurality of fluid passageways extending therethrough so that fluid flow from adjacent a back surface of the wafer passes over the peripheral edge of the wafer and through the fluid passageways to thereby exclude deposition adjacent the peripheral edge of the wafer; and

an iris diaphragm associated with each of the fluid passageways of said ring-shaped body for controlling fluid flow therethrough.

28. A controllable edge exclusion assembly according to claim 27 wherein said flow controller comprises a drive device for operating said iris diaphragms responsive to control signals.

29. A controllable edge exclusion assembly according to claim 27 wherein the fluid passageways of said ring-shaped body are angled upwardly and radially outwardly from the wafer.

30. A method for deposition exclusion adjacent a peripheral edge of a wafer within a deposition chamber and based upon fluid flow, the method comprising the steps of:

positioning a ring-shaped body extending inwardly from the peripheral edge of the wafer and spaced above an adjacent front surface of the wafer, the ring-shaped body having a plurality of fluid passageways extending therethrough;

setting a flow controller adjacent the fluid passageways of the ring-shaped body for a desired fluid flow therethrough; and

generating a fluid flow from adjacent a back surface of the wafer to pass over the peripheral edge of the wafer and through the fluid passageways of the ring-shaped body to thereby exclude deposition adjacent the peripheral edge of the wafer.

31. A method according to claim 30 wherein the flow controller comprises a control body having a plurality of fluid passageways therein and being relatively movable with respect to the ring-shaped body;

and wherein the step of setting the flow controller comprises relatively moving the control body to provide a selected amount of alignment between the fluid passageways of the control body and the ring-shaped body to thereby control fluid flow.

32. A method according to claim 31 wherein the control body and the ring-shaped body are relatively rotatable.

33. A method according to claim 31 wherein the fluid passageways of the control body have a substantially same cross-sectional area as the fluid passageways of the ring-shaped body.

34. A method according to claim 31 wherein at least one of the control body and the ring-shaped body has a plurality of sets of fluid passageways therein of different cross-sectional areas.

35. A method according to claim 30 wherein the flow controller comprises respective iris diaphragms for the fluid passageways;

and wherein the step of setting the flow control device comprises setting the iris diaphragms to a desired cross-sectional area.

36. A method according to claim 30 wherein the step of setting the control device comprises setting the control device responsive to control signals from outside the deposition chamber.