Cluster tool apparatus using plasma immersion ion implantation
First Claim
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1. An apparatus for processing substrates, said apparatus comprising:
- a transfer chamber comprising a robot therein;
a plasma immersion ion implantation chamber (“
PIII”
) coupled to said transfer chamber;
a controlled cleaving process (CCP) chamber adapted to provide energy to a selected region of a substrate to initiate a controlled cleaving action, the CCP chamber adapted to provide energy from a thermal source or sink, a mechanical source, a chemical source, or an electrical source, and at least a third chamber coupled to said transfer chamber, whereby the transfer chamber permits a plurality of process steps on a plurality of wafers in the other chambers without breaking vacuum.
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Abstract
A cluster tool assembly 10, 200, 300 using plasma immersion ion implantation chamber. In some embodiments, the cluster tool assembly also includes a controlled cleaving process chamber, as well as others.
218 Citations
18 Claims
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1. An apparatus for processing substrates, said apparatus comprising:
-
a transfer chamber comprising a robot therein;
a plasma immersion ion implantation chamber (“
PIII”
) coupled to said transfer chamber;
a controlled cleaving process (CCP) chamber adapted to provide energy to a selected region of a substrate to initiate a controlled cleaving action, the CCP chamber adapted to provide energy from a thermal source or sink, a mechanical source, a chemical source, or an electrical source, and at least a third chamber coupled to said transfer chamber, whereby the transfer chamber permits a plurality of process steps on a plurality of wafers in the other chambers without breaking vacuum. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification