Leadframe for use in manufacturing a resin-molded semiconductor device

• US 6,208,020 B1
• Filed: 11/03/1999
• Issued: 03/27/2001
• Est. Priority Date: 02/24/1999
• Status: Expired due to Term

• Current Assignee: Tessera Advanced Technologies Inc (Adeia Inc.)
• Original Assignee: Matsushita Electronics Corp (Panasonic Holdings Corporation)
• Inventors: Matsuo, Takahiro, Minamio, Masanori, Yamada, Yuichiro, Takemura, Kunikazu, Ito, Fumito
• Primary Examiner(s): Williams, Alexander O.
• Application Number:
  US09/432,216
• Time in Patent Office: 510 Days
• Field of Search: 257/797, 257/712, 257/713, 257/646, 257/676, 257/675, 257/720, 257/704, 257/730-733, 257/699, 257/693, 257/692
• US Class Current: 257/684
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/29007 Layer connector smaller than the underlying bonding area
• CPC Class Codes: H01L 2224/32014 the layer connector being smaller than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32055 being circular or elliptic
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

A resin-molded semiconductor device includes: signal leads; a die pad with a central portion elevated above a peripheral portion thereof; support leads, each including a raised portion higher in level than the other portions; and DB paste for use in die bonding. All of these members are encapsulated within a resin encapsulant. The lower part of each of these signal leads protrudes downward out of the resin encapsulant and functions as an external electrode. Each of the support leads is provided with two bent portions to cushion the deforming force. By forming a half-blanked portion in the die pad, the central portion is elevated above the peripheral portion, thus preventing the semiconductor chip from being hampered by the support leads. Accordingly, the size of the semiconductor chip mounted can be selected from a broader range and the humidity resistance of the device can also be improved.

Claims

1. A leadframe for use in manufacturing a resin-molded semiconductor device, the leadframe comprising:

an outer rail surrounding an opening, in which a semiconductor chip will be mounted;

a die pad provided inside the opening;

a plurality of support leads for supporting the die pad; and

a plurality of signal leads, which are connected to the outer rail around the periphery of the opening and extend toward the die pad,

wherein each said support lead is provided with a raised intermediate portion higher in level than the other portion thereof, and

wherein a central portion of the die pad, which is smaller in area than the semiconductor chip mounted on the central portion of the die pad, is elevated above a peripheral portion thereof to support the semiconductor chip thereon, the peripheral portion surrounding the central portion.

2. The leadframe of claim 1, wherein the central portion of the die pad is elevated above the peripheral portion via a half-blanked portion.

3. The leadframe of claim 1, wherein the upper surface of the die pad at the central portion is higher in level than the uppermost surface of the support leads at the raised portion.

4. The leadframe of claim 1, wherein the die pad is partially punched between the central and peripheral portions thereof.

5. A resin-molded semiconductor device comprising:

a die pad, a central portion of the die pad being elevated above a peripheral portion thereof surrounding the central portion;

a semiconductor chip mounted on the central portion of the die pad, being larger in area than the central portion of the die pad;

a plurality of support leads for supporting the die pad;

a plurality of signal leads extending toward the die pad;

a plurality of metal fine wires for electrically connecting the semiconductor chip to the signal leads; and

a resin encapsulant for encapsulating the semiconductor chip, the die pad, the support leads, the metal fine wires and the signal leads such that the lower and outer side faces of each said signal lead are exposed as an external terminal and that a lower part of the signal lead protrudes downward,

wherein each said support lead extends from the die pad to reach an associated side face of the resin encapsulant and is provided with a raised intermediate portion higher in level than the other portion of the support lead.

6. The device of claim 5, wherein the lower surface of the semiconductor chip is higher in level than the uppermost surface of each said support lead.

7. The device of claim 5, wherein the raised portion of each said support lead is sloped in such a manner as to reduce its height from a portion closest to the die pad toward the associated side face of the resin encapsulant.

8. The device of claim 5, wherein the die pad is partially punched between the central and peripheral portions thereof, and

wherein a region under the central portion of the die pad is also filled in with the resin encapsulant.

9. The device of claim 5, wherein a closed-loop groove is formed in the lower surface of the die pad at the peripheral portion.

10. A resin-molded semiconductor device comprising:

a die pad, a central portion of the die pad being elevated above a peripheral portion thereof surrounding the central portion;

a semiconductor chip mounted on the central portion of the die pad, being larger in area than the central portion of the die pad;

a plurality of support leads for supporting the die pad;

a plurality of signal leads extending toward the die pad;

a plurality of metal fine wires for electrically connecting the semiconductor chip to the signal leads; and

a resin encapsulant for encapsulating the semiconductor chip, the die pad, the support leads, the metal fine wires and the signal leads such that the lower and outer side faces of each said signal lead are exposed as an external terminal and that a lower part of the signal lead protrudes downward,

wherein each said support lead extends from the die pad to reach an associated side face of the resin encapsulant and is provided with a raised intermediate portion higher in level than the other portion of the support lead, and

wherein the semiconductor chip is supported by the raised portions of the support leads.

11. The device of claim 10, wherein a closed-loop groove is formed in the lower surface of the die pad at the peripheral portion.

12. A resin-molded semiconductor device comprising:

a die pad, a central portion of the die pad being elevated above a peripheral portion thereof surrounding the central portion;

a semiconductor chip mounted n the central portion of the die pad, being larger in area than the central portion of the die pad;

a plurality of support leads for supporting the die pad;

a plurality of signal leads extending toward the die pad;

a plurality of metal fine wires for electrically connecting the semiconductor chip to the signal leads; and

a resin encapsulant for encapsulating the semiconductor chip, the die pad, the support leads, the metal fine wires and the signal leads such that the lower and outer side faces of each said signal lead are exposed as an external terminal and that a lower portion of the signal lead protrudes downward,

wherein part of the resin encapsulant is interposed between the upper surface of the die pad at the peripheral portion and the backside of the semiconductor chip, and

wherein a groove is provided in the upper surface of the die pad at the peripheral portion so as to surround the central portion.

13. The device of claim 12, wherein the central portion is elevated by pressworking and half-blanking the die pad, and has a substantially circular planar shape.

14. The device of claim 12, wherein a plurality of the grooves are provided.

15. The device of claim 12, wherein each said support lead extends from the die pad to reach an associated side face of the resin encapsulant and is provided with a raised intermediate portion higher in level than the other portion of the support lead.