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Heating device containing a multi-lamp cone for heating semiconductor wafers

  • US 6,210,484 B1
  • Filed: 09/09/1998
  • Issued: 04/03/2001
  • Est. Priority Date: 09/09/1998
  • Status: Expired due to Fees
First Claim
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1. An apparatus for heat treating semiconductor wafers comprising:

  • a thermal processing chamber adapted to contain a semiconductor wafer, said thermal processing chamber containing at least one sidewall, an upper wall, and a lower wall;

    a heating device in communication with said thermal processing chamber for heating a semiconductor wafer contained in said chamber using electromagnetic energy, said heating device comprising at least one heating cone having an axis perpendicular to said semiconductor wafer, said heating cone including a plurality of light energy sources positioned within a conically-shaped reflector, said conically-shaped reflector gradually decreasing in diameter in a direction towards said semiconductor wafer; and

    a window separating said heating device from said thermal processing chamber, said window being disposed on either said upper wall or said lower wall of said thermal processing chamber.

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