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Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe

  • US 6,211,488 B1
  • Filed: 01/29/1999
  • Issued: 04/03/2001
  • Est. Priority Date: 12/01/1998
  • Status: Expired due to Fees
First Claim
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1. A method for separating a non-metallic substrate having an upper surface and a lower surface, the method comprising:

  • forming a crack in the substrate between the upper surface and the lower surface that does not extend vertically to either the upper surface or the lower surface;

    propagating the crack, including directing a scribe beam of coherent radiation onto the substrate and applying a stream of coolant onto the substrate; and

    separating the substrate.

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