Protection of an integrated circuit with voltage variable materials
First Claim
1. An electrical device for providing protection against EOS transients, the device comprising:
- an integrated circuit die;
a plurality of conductive input/output pads disposed on the integrated circuit die;
a first conductive guard rail disposed on the integrated circuit die adjacent the plurality of conductive input/output pads forming a gap between the conductive guard rail and each one of the conductive input/output pads;
a voltage variable material disposed in the gaps and forming a path between each one of the plurality of conductive input/output pads and the first conductive guard ring; and
a plurality of electrical leads electrically connected to a respective one of the plurality of conductive input/output pads.
1 Assignment
0 Petitions
Accused Products
Abstract
An integrated circuit die having on board protection against electrical overstress (EOS) transients. A device having an integrated circuit die with an outer periphery and a functional die area. A plurality of conductive input/output pads are formed on the integrated circuit die. A first conductive guard rail is disposed on the integrated circuit die and forms a gap between each one of the input/output pads. A voltage variable material is disposed in the gaps between the conductive guard rail and the input/output pads. A plurality of electrical leads are electrically connected to a respective one of the plurality of conductive input/output pads. At normal operating voltages, the voltage variable material is non-conductive. However, in response to an EOS transient, the voltage variable material switches to a low resistance state, providing a conductive path between the conductive guard rail and the input/output pads.
115 Citations
18 Claims
-
1. An electrical device for providing protection against EOS transients, the device comprising:
-
an integrated circuit die;
a plurality of conductive input/output pads disposed on the integrated circuit die;
a first conductive guard rail disposed on the integrated circuit die adjacent the plurality of conductive input/output pads forming a gap between the conductive guard rail and each one of the conductive input/output pads;
a voltage variable material disposed in the gaps and forming a path between each one of the plurality of conductive input/output pads and the first conductive guard ring; and
a plurality of electrical leads electrically connected to a respective one of the plurality of conductive input/output pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. An electrical device comprising:
-
an integrated circuit die having an outer periphery and a functional die area;
a first conductive guard rail disposed on the integrated circuit die;
a second conductive guard rail disposed on the integrated circuit die;
a plurality of conductive input/output pads disposed on the integrated circuit die forming gaps between the input/output pads and the first and second guard rails;
a plurality of electrical leads electrically connected to a respective one of the plurality of conductive input/output pads;
a voltage variable material disposed on the integrated circuit die filling the gaps between the input/output pads and the first and second conductive guard rails, the voltage variable material electrically connecting the plurality of conductive input/output pads to the first and second conductive guard rails in response to an EOS transient energy; and
a protective housing covering the integrated circuit die, the plurality of electrical leads extending outwardly from the protective housing. - View Dependent Claims (12, 13, 14, 15, 16, 17)
-
-
18. An integrated circuit comprising:
-
an electrically insulating substrate having at least one microelectronic device formed thereon;
a conductive input/output pad formed on the substrate;
a conductive guard rail formed on the substrate;
a voltage variable material disposed on the substrate between the microelectronic device and the input/output pad and forming a path between the conductive input/output pad and the conductive guard rail, the voltage variable material exhibiting non-conductive behavior at normal circuit operating voltages and electrically connecting the input/output pad to the conductive guard rail when an EOS transient is introduced into the circuit.
-
Specification