Electrical circuit board heat dissipation system

• US 6,212,071 B1
• Filed: 08/20/1999
• Issued: 04/03/2001
• Est. Priority Date: 08/20/1999
• Status: Expired due to Term

• Current Assignee: WSOU Investments, LLC (WSOU Holdings, LLC)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Roessler, Robert Joseph, Woods, Jr., William Lonzo
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US09/378,687
• Time in Patent Office: 592 Days
• Field of Search: 361/688-690, 361/698-700, 361/704, 361/709, 361/720, 361/721, 361/760, 361/767, 257/714, 257/715, 174/15.1, 174/15.2, 165/80.2, 165/80.3, 165/80.4, 165/104.33, 165/185, 428/616
• US Class Current: 361/704
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 7/20509 Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

A cooling system for a circuit board employs a heat-conducing channel within the board. The channel is thermally coupled to an electrical device mounted on the board, and leads to an edge of the board. The edge of the board is coupled to a heat-dissipating can. The use of channels leading to the edges of the board allows a single can to dissipate heat for a plurality of boards and a plurality of devices.

Claims

1. A cooling system for a printed circuit board adapted for mounting electrical devices, the system comprising;

a printed circuit board having a top surface, a bottom surface, and a plurality of edges;

said top surface including circuit paths and a mounting pad for mounting an electrical device;

a heat conductive path disposed between said top surface and said bottom surface of said printed circuit board, said heat conductive path having first and second ends, said first end being thermally coupled to said mounting pad, and said second end extending to one of said printed circuit board edges; and

means for dissipating heat, said heat dissipating means being thermally coupled to said second end of said heat conductive path and disposed adjacent to said one of said printed circuit board edges.

2. The system of claim 1 wherein said means for dissipating heat includes a heat dissipating can.

3. The system of claim 1 wherein said means for dissipating heat includes a metal cooling jacket.

4. The system of claim 1 wherein said heat conductive path includes copper material.

5. The system of claim 1 wherein said second end of said heat conductive path is solder plated for attaching said means for dissipating heat to said heat conductive path.

6. A cooling system for a printed circuit board adapted for mounting electrical devices, the system comprising;

a printed circuit board having a top surface, a bottom surface, and a plurality of edges;

said top surface including circuit paths and a mounting pad for mounting an electrical device;

a copper trace disposed between said top surface and said bottom surface of said printed circuit board, said copper trace having first and second ends, said first end being thermally coupled to said mounting pad, and said second end being solder plated and extending to one of said printed circuit board edges; and

a heat sink thermally coupled to said second end of said heat conductive path and disposed adjacent to said one of said printed circuit board edges.

7. The system of claim 6 wherein said heat sink includes a heat dissipating can.

8. The system of claim 6 wherein said heat sink includes a metal cooling jacket.