Metal bus bar and tab application method

• US 6,213,602 B1
• Filed: 04/30/1998
• Issued: 04/10/2001
• Est. Priority Date: 04/30/1998
• Status: Expired due to Term

• Current Assignee: PPG Industries Incorporated (Nouryon BV)
• Original Assignee: PPG Industries Ohio Incorporated (Nouryon BV)
• Inventors: Smarto, John E.
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US09/070,308
• Time in Patent Office: 1,076 Days
• Field of Search: 351/159, 351/177, 359/245, 359/266
• US Class Current: 351/159
• CPC Class Codes: B32B 17/10486 photochromic
• CPC Class Codes: G02F 1/153 Constructional details
• CPC Class Codes: G02F 1/155 Electrodes
• CPC Class Codes: H05B 2203/016 Heaters using particular connecting means
• CPC Class Codes: H05B 3/84 Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields

Abstract

A method for applying a conductive metal bus bar/tab system to the peripheral edge region of a substrate, such as an ophthalmic lens, is disclosed. The method involves: 1) applying conductive metal bus bar to said substrate; and 2) attaching a tab to said bus bar so as to ensure electrical contact between the tab and bus bar. Related devices are also disclosed.

Claims

1. A substrate containing a conductive metal bus bar and an electrically conductive tab attached to said bus bar using a conductive bonding agent, wherein said conductive bonding agent is in electrical contact with said tab and bus bar.

2. The substrate of claim 1, wherein said tab has a connecting portion which is embedded in said conductive bonding agent.

3. The substrate of claim 1, wherein said tab is a wire.

4. The substrate of claim 2, wherein said tab is a wire.

5. The substrate of claim 1, wherein said conductive bonding agent is a conductive epoxy.

6. The substrate of claim 5, wherein said tab has a connecting portion which is embedded in said conductive epoxy.

7. The substrate of claim 6, wherein said tab is a wire.

8. The substrate of claim 1, wherein said substrate comprises a component of an electrooptic device.

9. The substrate of claim 8, wherein said component is an optical lens.

10. A substrate containing a conductive metal bus bar and an electrically conductive tab attached to said bus bar using solder, wherein said tab and bus bar are in electrical contact.

11. The substrate of claim 10, wherein said tab is a wire.

12. The substrate of claim 10, wherein said substrate comprises a component of an electrooptic device.

13. The substrate of claim 12, wherein said component is an optical lens.

14. A substrate containing a conductive metal bus bar which is applied to said substrate, and an electrically conductive tab attached to a portion of said bus bar using a non-conductive bonding agent, wherein a conductive intermediate is applied over at least a connecting portion of said tab and at least a portion of said conductive metal bus bar so as to establish electrical contact between said tab and said bus bar.

15. The substrate of claim 14, wherein said non-conductive bonding agent is an epoxy bonding agent.

16. The substrate of claim 14, wherein said conductive intermediate is a conductive epoxy.

17. The substrate of claim 15, wherein said conductive intermediate is a conductive epoxy.

18. The substrate of claim 14, wherein said tab is a wire.

19. The substrate of claim 17, wherein said tab is a wire.

20. The substrate of claim 14, wherein said substrate comprises a component of an electrooptic device.

21. The substrate of claim 20, wherein said component is an optical lens.

22. The substrate of claim 14, further comprising an electroconductive film disposed on said substrate and over at least a portion of said conductive metal bus bar.

23. The substrate of claim 16, further comprising an electroconductive film disposed on said substrate and over at least a portion of said conductive bus bar.

24. A substrate having an electrically conductive tab which is attached to said substrate using a bonding agent, and a conductive metal bus bar applied over said electrically conductive tab, wherein said tab and bus bar are in electrical contact.

25. The substrate of claim 24, wherein said bonding agent is an epoxy.

26. The substrate of claim 25, wherein said epoxy in a non-conducting epoxy.

27. The substrate of claim 24, further including an electroconductive film disposed on said substrate and over at least a portion of said conductive metal bus bar.

28. The substrate of claim 25, further including an electroconductive film disposed on said substrate and over at least a portion of said conductive metal bus bar.

29. The substrate of claim 24, wherein said substrate comprises a component of an electrooptic device.

30. The substrate of claim 29, wherein said component is an optical lens.

31. A substrate having an electrically conductive tab which is attached to said substrate using a bonding agent, wherein a conductive material is disposed over at least a connecting portion of said tab so as to connect a portion of said tab to said substrate, and a conductive metal bus bar wherein said bus bar is applied over said conductive material.