Rapid thermal processing susceptor

• US 6,214,122 B1
• Filed: 03/17/1997
• Issued: 04/10/2001
• Est. Priority Date: 03/17/1997
• Status: Expired due to Fees

• Current Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Dauksher, William J., Melnick, Bradley M., Thompson, Danny L.
• Primary Examiner(s): Jones, Deborah
• Assistant Examiner(s): Miranda, Lymarie
• Application Number:
  US08/819,162
• Time in Patent Office: 1,485 Days
• Field of Search: 118/724, 118/500, 118/725, 118/728, 118/729, 302/418, 432/253, 432/259
• US Class Current: 118/729
• CPC Class Codes: H01L 21/67103 mainly by conduction

Abstract

A rapid thermal processing susceptor including a base having a planar surface and an upright sidewall extending around a periphery thereof and encircling a working portion of the planar surface. The working portion and the sidewall define a cavity. A plurality of minimum contact points extend from the working portion into the cavity and are positioned to receive thereon a semiconductor wafer. A cover is receivable by the sidewall for enclosing the cavity.

Claims

1. A rapid thermal processing susceptor comprising:

a base including a planar surface and an upright sidewall extending around a periphery thereof and encircling a working portion of the planar surface, the working portion and the sidewall defining a cavity;

a plurality of minimum contact points extending from the working portion into the cavity and positioned to receive thereon a semiconductor wafer, the plurality of minimum contact points being positioned in one of concentric circles about a center of the working position, or at least two sets of three contact points each; and

a cover receivable by the sidewall for enclosing the cavity.

2. A rapid thermal processing susceptor as claimed in claim 1 wherein the minimum contact points have a base with a diameter of not greater than 0.025 inches.

3. A rapid thermal processing susceptor as claimed in claim 2 wherein the minimum contact points are one of cylinders, cones and bumps.

4. A rapid thermal processing susceptor as claimed in claim 3 wherein the minimum contact points are 45 degree cones.

5. A rapid thermal processing susceptor as claimed in claim 1 wherein the minimum contact points are positioned in a plurality of groups arranged to receive a plurality of wafer sizes.

6. A rapid thermal processing susceptor as claimed in claim 1 wherein the minimum contact points are positioned in a plurality of groups arranged so as to be able to receive a plurality of wafers of different diameters.

7. A rapid thermal processing susceptor as claimed in claim 5 wherein each of the plurality of groups includes a minimum of three minimum contact points.

8. A rapid thermal processing susceptor comprising:

a base having a planar surface;

an upright sidewall extending from the periphery of the base and encircling a working portion of the planar surface, the working portion and the sidewall defining a cavity;

a plurality of minimum contact points extending from the working portion into the cavity and positioned to receive thereon a semiconductor wafer, the minimum contact points are positioned in a plurality of groups of at least three, and arranged to receive a plurality of wafer sizes, the plurality of minimum contact points also being positioned in concentric circles about a center of the working position; and

a cover receivable by the sidewall for enclosing the cavity.

9. A rapid thermal processing susceptor as claimed in claim 8 wherein the minimum contact points have a base with a diameter of not greater than 0.025 inches.

10. A rapid thermal processing susceptor as claimed in claim 9 wherein the minimum contact points are one of cylinders, cones and bumps.

11. A rapid thermal processing susceptor as claimed in claim 11 wherein the minimum contact points are 45 degree cones.

12. A rapid thermal processing susceptor for use in an automated rapid thermal processing tool, the susceptor comprising:

a base including an upright sidewall extending around the periphery thereof and defining a cavity, a plurality of lift mechanism receiving openings formed through the base, and a plug positioned in the cavity and having an upper surface;

an insert having a cut-out and an upper surface, the insert being movable between a raised position and a lowered position, in the lowered position the insert being positioned in the cavity with the plug received in the cut-out with the upper surface of the plug and the upper surface of the insert defining a planar surface within the cavity;

a plurality of minimum contact points extending from the upper surface of the insert and positioned to receive thereon a semiconductor wafer; and

a cover receivable by the sidewall for enclosing the cavity, whereas the semiconductor wafer is positioned substantially halfway between the upper surface and the cover.

13. A rapid thermal processing susceptor for use in an automated rapid thermal processing tool as claimed in claim 12, wherein a first group of the lift mechanism receiving openings are formed through the base in communication with the cavity for communication with the insert and a second group of the lift mechanism receiving openings are formed through the base and extend through the sidewall for communication with the cover.

14. A rapid thermal processing susceptor for use in an automated rapid thermal processing tool as claimed in claim 13 wherein the minimum contact points have a base with a diameter of not greater than 0.025 inches.

15. A rapid thermal processing susceptor for use in an automated rapid thermal processing tool as claimed in claim 14 wherein the minimum contact points are one of cylinders, cones and bumps.

16. A rapid thermal processing susceptor for use in an automated rapid thermal processing tool as claimed in claim 15 wherein the minimum contact points are 45 degree cones.

17. A rapid thermal processing susceptor for use in an automated rapid thermal processing tool as claimed in claim 16 wherein the minimum contact points are positioned in concentric circles about a center of the working portion.