Circuit-like metallic foil sheet and the like and processing for producing them

• US 6,214,444 B1
• Filed: 07/22/1997
• Issued: 04/10/2001
• Est. Priority Date: 12/30/1993
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Miyake
• Original Assignee: Kabushiki Kaisha Miyake
• Inventors: Uchibori, Shinya
• Primary Examiner(s): DIXON, MERRICK L
• Application Number:
  US08/898,077
• Time in Patent Office: 1,358 Days
• Field of Search: 340/258, 340/568, 340/572, 361/397, 361/402, 361/410, 428/204, 428/458, 428/422, 428/421, 428/457, 428/461, 428/901, 295/48
• US Class Current: 428/209
• CPC Class Codes: B32B 15/04 comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042
• CPC Class Codes: G06K 19/0672 with resonating marks
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: G08B 13/244 Tag manufacturing, e.g. continuous manufacturing processes
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2203/0108 Male die used for patterning, punching or transferring
• CPC Class Codes: H05K 2203/0528 Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 3/041 by using a die for cutting the conductive material
• CPC Class Codes: H05K 3/046 by selective transfer or selective detachment of a conductive layer
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/3154 Of fluorinated addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
• CPC Class Codes: Y10T 428/31692 Next to addition polymer from unsaturated monomers

Abstract

A resonant tag is provided that comprises a circuit-like metallic foil pattern that is adhered to a dielectric film prepared from a liquid resin by a coating process. The circuit-like metal foil pattern on one side of the dielectric film may be so aligned with the circuit-like metal foil pattern on the other side of the dielectric film as to form a capacitor with the dielectric film. The dielectric film may have openings therein configured similarly to and aligned with openings in the circuit-like metal foil, and the configuration of the circuit-like metal foil pattern and dielectric film may be generally spiral in configuration. An adhesion adhesive may be coated on predetermined portions of a face of a resonant tag base so as to leave uncoated portions between the coated portions, and a release paper is applied to the adhesion adhesive, the width of the uncoated portions being such as to avoid the generation of static electricity when the release paper is peeled from the adhesion adhesive.

Claims

1. A resonant tag in which an adhesion adhesive is coated on predetermined portions of at least one face of a resonant tag base comprising a circuit-like metallic foil adhered to each side of a dielectric film prepared from a solution of a resin dissolved in a solvent by a coating process, the circuit-like metal foil pattern on one side of the dielectric film being aligned with the circuit-like metal foil pattern on the other side of the dielectric film so as to form with the dielectric film a capacitor, said coating of the adhesion adhesive leaving uncoated portions between said coated portions, and a release paper applied on the upper face of the adhesive-coated base, the width of the uncoated portions being such that the generation of static electricity is avoided when the release paper is peeled from the adhesion adhesive.

2. A resonant tag claimed in claim 1, wherein the noncoated portion is in a linear shape or a lattice shape.