Sensor device and method of forming a sensor device

• US 6,214,634 B1
• Filed: 02/07/2000
• Issued: 04/10/2001
• Est. Priority Date: 05/28/1997
• Status: Expired due to Fees

• Current Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Osajda, Marc, Perraud, Eric
• Primary Examiner(s): Bowers, Charles
• Assistant Examiner(s): SARKAR, ASOK K
• Application Number:
  US09/424,125
• Time in Patent Office: 428 Days
• Field of Search: 737/06, 737/15, 737/23, 737/25, 737/26, 737/27, 737/56, 737/54, 338/4, 338/12, 600/485-488, 438/50
• US Class Current: 438/50
• CPC Class Codes: G01L 19/0645 using isolation membranes, specially adapted for protection
• CPC Class Codes: G01L 19/141 Monolithic housings, e.g. molded or one-piece housings
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 Shape

Abstract

A sensor device (20) comprises a sensor package (22) having a cavity (24) formed therein, a sensor die (26) mounted on a bottom surface (28) of the cavity (24) and a protective coating (30) formed over the sensor die in the cavity. The protective coating (30) is formed from a material, preferably a polymer material, which is arranged to have a graduated cross-linking density such that the material at the top of the cavity (24) has a high density of cross-linking and the material at the bottom of the cavity (24), which material is in contact with the sensor die, has a low density of cross-linking.

Claims

1. A sensor device comprising:

sensor packaging means having a cavity formed therein;

a sensor die mounted on a bottom surface of the cavity; and

a protective coating formed over the sensor die in the cavity, wherein the protective coating is formed from a material having a graduated cross-linking density such that the material at the top of the cavity has a high density of cross-linking and the material at the bottom of the cavity, which material is in contact with the sensor die, has a low density of cross-linking.

2. A sensor device according to claim 1 wherein the material is a polymer material.

3. A sensor device comprising:

sensor packaging means having a cavity formed therein;

a sensor die mounted on a bottom surface of the cavity; and

a protective coating formed over the sensor die in the cavity, wherein the protective coating comprises;

a bottom layer formed over the die, the bottom layer being formed of uncured polymer material; and

a top layer formed over the bottom layer, the top layer being formed of cured polymer material.

4. A sensor device according to claim 3 further comprising a groove formed in an inside wall of the cavity and wherein part of the top layer extends into the groove.

5. A sensor device according to claim 3 or 4 wherein the top layer has a thickness which varies across the cavity such that the top layer is thinner at the centre of the cavity than at the edges.

6. A sensor device according to claim 3 or 4 wherein the top layer has a thickness which is in the range of 0.6 mm to 1.0 mm.

7. A sensor device according to claim 3, 4, 5 or 6 wherein the polymer material is a polymer selected from one of the following:

urethane, vynil ether, and acryllated epoxy.

8. A method of forming a sensor device comprising the steps of:

providing sensor packaging means having a cavity formed therein;

mounting a sensor die on a bottom surface of the cavity;

introducing a liquid comprising a material into the cavity such that it covers the sensor die; and

exposing a surface of the liquid to a source of energy for a predetermined time until the material has a graduated cross-linking density with the material at the top of the cavity having a high density of cross-linking and the material at the bottom of the cavity, which material is in contact with the sensor die, having a low density of cross-linking, wherein the graduated material provides a protective coating over the sensor die in the cavity.

9. A method according to claim 8 wherein the level of the cross-linking density of the material varies from the top of the cavity to the bottom of the cavity according to the predetermined time and the level of energy of the energy source.

10. A method according to claim 8 or 9 wherein the material is a polymer material.

15. A method according to claim 8, 9, 10, 11, 12, 13, or 14 wherein the source of energy is a source of radiation.

16. A method according to claim 15 wherein the source of radiation provides radiation having a wavelength which is not in the visible spectrum.

17. A method according to claim 8, 9, 10, 11, 12, 13, 14, 15 or 16 wherein the source of energy is a source of UV radiation.

18. A method according to claim 17 wherein the introducing step comprises introducing into the cavity a liquid comprising polymer material and a photo initiator, the photo initiator comprising a material which generates free radicals in the presence of UV radiation.

19. A method according to claim 17 further comprising the step of forming a layer of photo initiator over the liquid, the photo initiator layer being formed of a material which generates free radicals in the presence of UV radiation and wherein the exposing step comprises exposing the photo initiator layer to the UV radiation.

11. A method of forming a sensor device comprising the steps of:

providing sensor packaging means having a cavity formed therein;

mounting a sensor die on a bottom surface of the cavity;

introducing a liquid comprising a polymer material into the cavity such that it covers the sensor die; and

exposing a surface of the liquid to a source of energy for a predetermined time so as to cure a portion of the polymer material, wherein a protective coating is formed over the sensor die in the cavity comprising;

a bottom layer formed over the sensor die and being formed of uncured polymer material; and

a top layer formed over the bottom layer and being formed of cured polymer material.

12. A method according to claim 11 wherein the top layer has a thickness which depends on the predetermined time and the level of energy of the energy source.

13. A method according to claim 12 wherein the thickness varies across the cavity such that the top layer is thinner at the centre of the cavity than at the edges.

14. A method according to claim 12 wherein the thickness of the top layer is in the range of 0.6 mm to 1.0 mm.

20. A method according to claim 11 wherein the polymer material is a polymer selected from one of the following:

urethane, vinyl ether, and acrylated epoxy.