Flip-chip micromachine package fabrication method

• US 6,214,644 B1
• Filed: 06/30/2000
• Issued: 04/10/2001
• Est. Priority Date: 06/30/2000
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P.
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): Zarneke, David A.
• Application Number:
  US09/608,502
• Time in Patent Office: 284 Days
• Field of Search: 438/108, 438/119, 438/124, 438/126, 438/127, 438/14, 438/15, 438/107, 438/110, 438/113, 438/25, 438/26, 438/51, 438/55, 438/64
• US Class Current: 438/108
• CPC Class Codes: B81B 7/0077 Other packages not provided for in groups B81B7/0035 - B81B7/0074
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA

Abstract

To fabricate a flip-chip micromachine package, a micromachine chip is mounted as a flip chip to a substrate. The micromachine chip is attached such that a micromachine area on a first surface of the micromachine chip faces the substrate. A limited flow liquid encapsulant is dispensed around the micromachine chip and cured to form a package body. The micromachine chip, the package body, and the substrate define a sealed cavity. The micromachine area is located within the sealed cavity and protected from the ambient environment.

Claims

1. A method comprising:

attaching a micromachine chip to a substrate, said micromachine chip having a micromachine area on a first surface of said micromachine chip;

dispensing a material around said micromachine chip; and

curing said material to form a package body, wherein said micromachine chip, said package body, and said substrate define a cavity, said micromachine area being located within said cavity.

2. The method of claim 1 wherein said attaching comprises attaching a bond pad on said first surface of said micromachine chip to a trace on a first surface of said substrate.

3. The method of claim 2 wherein said attaching comprises reflowing a bump between said bond pad and said trace.

4. The method of claim 2 wherein said bond pad is attached to said trace by a bump formed of an electrically conductive epoxy paste or film.

5. The method of claim 2 wherein said bond pad is attached to said trace by a gold bump.

6. The method of claim 1 wherein said substrate is one of a plurality of substrates integrally connected together in an array format, said method further comprising singulating said plurality of substrates.

7. The method of claim 1 further comprising testing said micromachine chip prior to said attaching.

8. A method comprising:

aligning a bond pad on a first surface of a micromachine chip with a trace on a first surface of a substrate, said micromachine chip having a micromachine area on said first surface of said micromachine chip; and

electrically connecting said bond pad to said trace with a bump.

9. The method of claim 8 wherein said micromachine chip is mounted as a flip chip to said substrate.

10. The method of claim 8 further comprising forming a package body extending between said first surface of said micromachine chip and said first surface of said substrate.

11. The method of claim 10 wherein said micromachine chip, said package body, and said substrate define a cavity, said micromachine area being located within said cavity.