Accelerometer for implantable medical device

• US 6,216,537 B1
• Filed: 03/31/1999
• Issued: 04/17/2001
• Est. Priority Date: 03/31/1999
• Status: Expired due to Term

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Sleeper, Scott B., Child, Brian S., Hall, David Brian, OʼGara, Joan A., Henschel, Mark E., Inman, Roy L., Ruben, David A., Larson, Lary R., Volmering, James E., Haq, Samuel F., Malone, Patrick F.
• Primary Examiner(s): Kwok, Helen C.
• Application Number:
  US09/282,485
• Time in Patent Office: 748 Days
• Field of Search: 734/93, 734/31, 735/141.5, 735/141.6, 735/142.1, 735/143.6, 735/143.8, 607/17, 607/18, 607/19, 607/21, 607/22, 607/24, 607/27
• US Class Current: 73/493
• CPC Class Codes: A61B 2562/0219 Inertial sensors, e.g. accelerometers, gyroscopes, tilt switches
• CPC Class Codes: A61N 1/36542 controlled by body motion, e.g. acceleration
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers

Abstract

An accelerometer device which can be mounted on a substrate, e.g., a circuit board enclosed in a medical device, includes an accelerometer sensing element having an axis of sensitivity and further includes first and second multilayer end caps. The substrate generally defines a mounting plane. The accelerometer sensing element includes a device body having a longitudinal axis extending between generally parallel first and second ends thereof and further includes a principal surface extending between the first and second ends of the device body parallel to the longitudinal axis. The axis of sensitivity of the sensing element is generally perpendicular to a plane defined by the principal surface. Further, the accelerometer sensing element includes conductive pad regions on each of the first and second ends of the device body. Each of the first and second multilayer end caps includes conductive elements on one side thereof and further includes conductive traces electrically connected to the conductive elements thereof. Each of the conductive traces of the first and second multilayer end caps terminate at a surface mount contact region along at least one edge thereof. The first and second multilayer end caps are attached to the first and second ends of the device body such that, when the accelerometer device is mounted on a substrate, the axis of sensitivity of the accelerometer sensing element is perpendicular to the mounting plane defined thereby.

Claims

1. A method for providing a medical device including an accelerometer, the method comprising the steps of:

providing a medical device having a housing;

providing a substrate, the substrate defining a mounting plane and including two or more surface mount contact pads;

providing an accelerometer device to be mounted on the substrate, wherein providing the accelerometer device includes;

providing an accelerometer sensing element having an axis of sensitivity, wherein the accelerometer sensing element includes a device body having a longitudinal axis extending between generally parallel first and second ends thereof, wherein the accelerometer device further has a first principal surface extending between the first and second ends of the device body parallel to the longitudinal axis, wherein the axis of sensitivity is perpendicular to a plane defined by the first principal surface, and further wherein the accelerometer sensing element includes two or more conductive pad regions on each of the first and second ends of the device body,

providing a first and a second multilayer end cap, wherein each of the first and second multilayer end caps includes two or more conductive elements on one side thereof and further includes two or more conductive traces electrically connected to the two or more conductive elements thereof, each of the two or more conductive traces of each of the first and second multilayer end caps terminating at a surface mount contact regions along at least one edge thereof, and

attaching the first and second multilayer end caps to the first and second ends of the device body, respectively, with the conductive elements of the first and second multilayer end caps in electrical contact with the conductive pad regions of the first and second ends of the device body;

mounting the accelerometer device on the substrate with the surface mount contact regions electrically connected to the two or more surface mount contact pads of the substrate such that the axis of sensitivity of the accelerometer sensing element is perpendicular to the mounting plane defined by the substrate; and

enclosing the substrate having the accelerometer device mounted thereon in the housing of the medical device.

2. The method of claim 1, wherein providing the first and second multilayer end caps includes the step of providing first and second multilayer end caps which each include generally parallel first and second sides extending between first and second edges thereof, wherein at least one of the first and second edges of the multilayer end cap lies in the plane defined by the first principal surface, wherein the first side of each of the first and second multilayer end caps includes the two or more conductive elements for electrical connection to the two or more conductive pad regions on each of the first and second ends of the device body, respectively, wherein the second side of each of the multilayer end caps includes the two or more conductive traces with each conductive trace electrically connected to at least one conductive element on the first side thereof, and further wherein each of the two or more conductive traces on the second side of each of the first and second multilayer end caps terminates in the surface mount contact region along the at least one of the first and second edges lying in the plane defined by the first principal surface.

3. The method of claim 1, wherein the device body includes a second principal surface extending between the first and second ends thereof generally parallel to the principal surface, wherein the axis of sensitivity is perpendicular to a plane defined by the second principal surface, and further wherein each of the two or more conductive traces of each of the first and second multilayer end caps terminate in a surface mount contact region along the first edge of the respective multilayer end cap lying in the plane defined by the principal surface and a surface mount contact region along the second edge of the respective multilayer end cap lying in the plane defined by the second principal surface.

4. The method of claim 1, wherein the accelerometer sensing element is a capacitive sensing element with one or more electrodes lying in corresponding planes generally parallel to the principal surface and perpendicular to the axis of sensitivity.

5. The method of claim 1, wherein the two or more conductive pads on each of the first and second ends of the device body of the accelerometer sensing element are symmetrically distributed relative to the longitudinal axis, and further wherein the two or more conductive elements on the first side of each of the first and second multilayer end caps are positioned for electrical contact with the symmetrically distributed conductive pad regions.

6. The method of claim 1, wherein each surface mount contact region along the at least one edge includes a conductive lined opening having a conductive opening edge lying in the plane defined by the principal surface.

7. The method of claim 1, wherein providing the medical device includes providing a medical device selected from one of a pacemaker, a defibrillator, a brain stimulator, a cardioverter/defibrillator, a pacemaker/cardioverter/defibrillator, a neurostimulator, a muscle stimulator, a gastric stimulator, an implantable monitor, a hemodynamic monitor, and a drug pump.

8. A surface mountable accelerometer device for use in an implantable medical apparatus, the surface mountable accelerometer comprising:

an accelerometer sensing element having an axis of sensitivity, wherein the accelerometer sensing element comprises a device body having a longitudinal axis extending between generally parallel first and second ends thereof, wherein the accelerometer device further has a first principal surface extending between the first and second ends of the device body parallel to the longitudinal axis, wherein the axis of sensitivity is perpendicular to a plane defined by the first principal surface, and further wherein the accelerometer sensing element includes two or more conductive pad regions on each of the first and second ends of the device body; and

a first and a second multilayer end caps, the first multilayer end cap connected to the first end of the device body and the second multilayer end cap connected to the second end of the device body, wherein each of the first and second multilayer end caps includes generally parallel first and second sides extending between first and second edges thereof, wherein at least one of the first and second edges of the multilayer end caps lies in the plane defined by the first principal surface, wherein the first side of each of the first and second multilayer end caps includes two or more conductive elements for electrical connection to the two or more conductive pad regions on each of the first and second ends of the device body, respectively, wherein the second side of each of the multilayer end caps includes two or more conductive traces with each conductive trace electrically connected to at least one conductive element on the first side thereof, and further wherein each of the two or more conductive traces on the second side of each of the first and second multilayer end caps terminates in a surface mount contact region along the at least one of the first and second edges lying in the plane defined by the first principal surface.

9. The device of claim 8, wherein the device body includes a second principal surface extending between the first and second ends thereof generally parallel to the first principal surface, wherein the axis of sensitivity is perpendicular to a plane defined by the second principal surface, and further wherein each of the two or more conductive traces on the second side of each of the first and second multilayer end caps terminate in a surface mount contact region along the first edge of the respective multilayer end cap lying in the plane defined by the first principal surface and a surface mount contact region along the second edge of the respective multilayer end cap lying in the plane defined by the second principal surface.

10. The device of claim 8, wherein the accelerometer sensing element is a capacitive sensing element with one or more electrodes lying in corresponding planes generally parallel to the first principal surface and perpendicular to the axis of sensitivity.

11. The device of claim 8, wherein the two or more conductive pad regions on each of the first and second ends of the device body of the accelerometer sensing element are symmetrically distributed relative to the longitudinal axis, and further wherein the two or more conductive elements on the first side of each of the first and second multilayer end caps are positioned for electrical contact with the symmetrically distributed conductive pad regions.

12. The device of claim 8, wherein each of the surface mount contact regions along the at least one of the first and second edges lying in the plane defined by the first principal surface includes a conductive lined opening having a conductive opening edge lying in the plane defined by the first principal surface.

13. The device of claim 8, wherein the medical apparatus is selected from one of a pacemaker, a defibrillator, a cardioverter/defibrillator, a pacemaker/cardioverter/defibrillator, a brain stimulator, a neurostimulator, a muscle stimulator, a gastric stimulator, an implantable monitor, a hemodynamic monitor, and a drug pump, and further wherein the accelerometer device is hermetically sealed in the medical apparatus.

14. A surface mountable accelerometer device, comprising:

an accelerometer sensing element having an axis of sensitivity, wherein the accelerometer sensing element includes a device body having a longitudinal axis extending between generally parallel first and second ends thereof, wherein the accelerometer sensing element further has at least a first principal surface extending between the first and second ends of the device body parallel to the longitudinal axis, wherein the axis of sensitivity is perpendicular to a plane defined by the first principal surface, and further wherein the accelerometer sensing element includes two or more conductive pad regions on at least one of the first and second ends of the device body; and

at least one multilayer end cap connected to at least one of the first and second ends of the device body, wherein the at least one multilayer end cap includes generally parallel first and second sides extending between first and second edges of the multilayer end cap, wherein at least one of the first and second edges of the at least one multilayer end cap lies in the plane defined by the first principal surface, wherein the first side of the multilayer end cap includes two or more conductive elements for electrical connection to the two or more conductive pad regions on the at least one of the first and second ends of the device body, wherein the second side of the at least one multilayer end cap includes two or more conductive traces with each conductive trace electrically connected to at least one conductive element on the first side of the at least one multilayer end cap, and further wherein each conductive trace on the second side of the at least one multilayer end cap terminates in a surface mount contact region along the at least one of the first and second edges lying in the plane defined by the first principal surface.

15. The device of claim 14, wherein the at least one multilayer end cap includes a first and a second multilayer end cap, the first multilayer end cap connected to the first end of the device body and the second multilayer end cap connected to the second end of the device body, wherein each of the first and second multilayer end caps includes generally parallel first and second sides extending between first and second edges thereof, wherein at least one of the first and second edges of the first and second multilayer end caps lies in the plane defined by the principal surface, wherein the first side of each of the first and second multilayer end caps includes two or more conductive elements for electrical connection to two or more conductive pad regions on each of the first and second ends of the device body, respectively, wherein the second side of each of the multilayer end caps includes two or more conductive traces with each conductive trace electrically connected to at least one conductive element on the first side thereof, and further wherein each of the two or more conductive traces on the second side of each of the first and second multilayer end caps terminates in a surface mount contact region along the at least one of the first and second edges lying in the plane defined by the principal surface.

16. The device of claim 15, wherein the device body includes a second principal surface extending between the first and second ends thereof generally parallel to the first principal surface, wherein the axis of sensitivity is perpendicular to a plane defined by the second principal surface, and further wherein each of the two or more conductive traces on the second side of each of the first and second multilayer end caps terminate in a surface mount contact region along the first edge of the respective multilayer end cap lying in the plane defined by the first principal surface and a surface mount contact region along the second edge of the respective multilayer end cap lying in the plane defined by the second principal surface.

17. The device of claim 15, wherein the two or more conductive pad regions on each of the first and second ends of the device body of the accelerometer sensing element are symmetrically distributed relative to the longitudinal axis, and further wherein the two or more conductive elements on the first side of each of the first and second multilayer end caps are positioned for electrical contact with the symmetrically distributed conductive pad regions.

18. The device of claim 14, wherein the accelerometer sensing element is a capacitive sensing element with one or more electrodes lying in corresponding planes generally parallel to the first principal surface and perpendicular to the axis of sensitivity.

19. The device of claim 14, wherein each of the surface mount contact regions along the at least one of the first and second edges lying in the plane defined by the first principal surface includes a conductive lined opening having a conductive opening edge lying in the plane defined by the first principal surface.

20. An accelerometer assembly for use in a medical device, the accelerometer assembly comprising:

a substrate defining a mounting plane, the substrate including two or more surface mount contact pads;

an accelerometer sensing element having an axis of sensitivity mounted on the substrate, wherein the accelerometer sensing element includes a device body having a longitudinal axis extending between generally parallel first and second ends thereof, wherein the accelerometer assembly further has a first principal surface extending between the first and second ends of the device body parallel to the longitudinal axis and to the mounting plane of the substrate, wherein the axis of sensitivity is perpendicular to a plane defined by the first principal surface, and further wherein the accelerometer sensing element includes two or more conductive pad regions on each of the first and second ends of the device body; and

a first and a second multilayer end cap, the first multilayer end cap connected to the first end of the device body and the second multilayer end cap connected to the second end of the device body, wherein each of the first and second multilayer end caps includes two or more conductive elements on one side thereof for electrical connection to the two or more conductive pad regions on each of the first and second ends of the device body, respectively, and further wherein each of the first and second multilayer end caps includes two or more conductive traces electrically connected to the two or more conductive elements thereof, each of the two or more conductive traces of each of the first and second multilayer end caps terminating at a surface mount contact region along at least one edge thereof, and further wherein the surface mount contact regions are electrically connected to the two or more surface mount contact pads of the substrate such that the axis of sensitivity of the accelerometer sensing element is perpendicular to the mounting plane defined by the substrate.

21. The assembly of claim 20, wherein each of the first and second multilayer end caps includes generally parallel first and second sides extending between first and second edges thereof, wherein at least one of the first and second edges of the multilayer end caps lies in the plane defined by the first principal surface, wherein the first side of each of the first and second multilayer end caps includes the two or more conductive elements for electrical connection to the two or more conductive pad regions on each of the first and second ends of the device body, respectively, wherein the second side of each of the multilayer end caps includes the two or more conductive traces with each conductive trace electrically connected to at least one conductive element on the first side thereof, and further wherein each of the two or more conductive traces on the second side of each of the first and second multilayer end caps terminates in the surface mount contact region along the at least one of the first and second edges lying in the plane defined by the first principal surface.

22. The assembly of claim 21, wherein the device body includes a second principal surface extending between the first and second ends thereof generally parallel to the first principal surface, wherein the axis of sensitivity is perpendicular to a plane defined by the second principal surface, and further wherein each of the two or more conductive traces on the second side of each of the first and second multilayer end caps terminate in a surface mount contact region along the first edge of the respective multilayer end cap lying in the plane defined by the first principal surface and a surface mount contact region along the second edge of the respective multilayer end cap lying in the plane defined by the second principal surface.

23. The assembly of claim 20, wherein the accelerometer sensing element is a capacitive sensing element with one or more electrodes lying in corresponding planes generally parallel to the first principal surface and perpendicular to the axis of sensitivity.

24. The assembly of claim 20, wherein the two or more conductive pad regions on each of the first and second ends of the device body of the accelerometer sensing element are symmetrically distributed relative to the longitudinal axis, and further wherein the two or more conductive elements on the first side of each of the first and second multilayer end caps are positioned for electrical contact with the symmetrically distributed conductive pad regions.

25. The assembly of claim 20, wherein each of the surface mount contact regions along the at least one edge includes a conductive lined opening having a conductive opening edge lying in the plane defined by the first principal surface.

26. The assembly of claim 20, wherein the medical device is selected from one of a pacemaker, a defibrillator, a cardioverter/defibrillator, a pacemaker/cardioverter/defibrillator, a brain stimulator, a neurostimulator, a muscle stimulator, a gastric stimulator, an implantable monitor, a hemodynamic monitor, and a drug pump, and further wherein the accelerometer assembly is enclosed in the medical device.

27. A transducer assembly comprising:

a substrate defining a mounting plane, the substrate including two or more surface mount contact pads;

a sensing element having an axis of sensitivity, wherein the sensing element includes a device body having a longitudinal axis extending between first and second ends thereof, wherein the sensing element further has a first principal surface extending between the first and second ends of the device body parallel to the longitudinal axis and to the mounting plane of the substrate, wherein the axis of sensitivity is perpendicular to a plane defined by the first principal surface, and further wherein the sensing element includes two or more conductive pad regions on at least one of the first and second ends of the device body; and

at least one interposer element connected to at least one of the first and second ends of the device body, wherein the at least one interposer element includes two or more conductive elements along one side thereof for electrical connection to the two or more conductive pad regions on the at least one of the first and second ends of the device body and two or more surface mount contact regions along an edge thereof electrically connected to the two or more conductive elements, each of the two or more surface mount contact regions electrically connected to the two or more surface mount contact pads of the substrate such that the axis of sensitivity of the accelerometer sensing element is perpendicular to the mounting plane defined by the substrate.

28. The assembly of claim 27, wherein the at least one interposer element includes a first and second multilayer end cap, the first multilayer end cap connected to the first end of the device body and the second multilayer end cap connected to the second end of the device body, wherein each of the first and second multilayer end caps includes two or more conductive elements on one side thereof for electrical connection to two or more conductive pad regions on each of the first and second ends of the device body, respectively, and further wherein each of the first and second multilayer end caps includes two or more conductive traces electrically connected to the two or more conductive elements thereof, each of the two or more conductive races of each of the first and second multilayer end caps terminating at a surface mount contact region along at least one edge thereof, and further wherein the surface mount contact regions are electrically connected to the two or more surface mount contact pads of the substrate such that the axis of sensitivity of the accelerometer sensing element is perpendicular to the mounting plane defined by the substrate.

29. The assembly of claim 28, wherein each of the first and second multilayer end caps include generally parallel first and second sides extending between first and second edges thereof, wherein at least one of the first and second edges of the multilayer end caps lies in the plane defined by the principal surface, wherein the first side of each of the first and second multilayer end caps includes the two or more conductive elements for electrical connection to the two or more conductive pad regions on each of the first and second ends of the device body, respectively, wherein the second side of each of the multilayer end caps includes the two or more conductive traces with each conductive trace electrically connected to at least one conductive element on the first side thereof, and further wherein each of the two or more conductive traces on the second side of each of the first and second multilayer end caps terminates in the surface mount contact region along the at least one of the first and second edges lying in the plane defined by the first principal surface.

30. The assembly of claim 28, wherein the device body includes a second principal surface extending between the first and second ends thereof generally parallel to the first principal surface, wherein the axis of sensitivity is perpendicular to a plane defined by the second principal surface, and further wherein each of the two or more conductive traces on the second side of each of the first and second multilayer end caps terminate in a surface mount contact region along the first edge of the respective multilayer end cap lying in the plane defined by the first principal surface and a surface mount contact region along the second edge of the respective multilayer end cap lying in the plane defined by the second principal surface.

31. The assembly of claim 27, wherein the sensing element is an accelerometer sensing element.

32. The assembly of claim 31, wherein the accelerometer sensing element is a capacitive sensing element with one or more electrodes lying in corresponding planes generally parallel to the first principal surface and perpendicular to the axis of sensitivity.

33. The assembly of claim 27, wherein the two or more conductive pad regions on each of the first and second ends of the device body of the sensing element are symmetrically distributed relative to the longitudinal axis, and further wherein the two or more conductive elements of the at least one interposer element are positioned for electrical contact with the symmetrically distributed conductive pad regions.

34. The assembly of claim 27, wherein each of the surface mount contact regions includes a portion lying along the plane defined by the first principal surface.

35. The assembly of claim 34, wherein each of the surface mount contact regions includes a conductive lined opening having a conductive opening edge lying in the plane defined by the first principal surface.

36. A method of providing a transducer assembly, the method comprising the steps of:

providing a substrate defining a mounting plane, the substrate including two or more surface mount contact pads;

providing a transducer device, wherein providing the transducer device includes the steps of;

providing a sensing element having an axis of sensitivity, wherein the sensing element includes a device body having a longitudinal axis extending between first and second ends thereof, wherein the sensing element further includes a first principal surface extending between the first and second ends of the device body parallel to the longitudinal axis, wherein the axis of sensitivity is perpendicular to a plane defined by the first principal surface, and further wherein the sensing element includes two or more conductive pad regions on at least one of the first and second ends of the device body,

providing at least one interposer element, wherein the at least one interposer element includes two or more conductive elements along one side thereof and further includes two or more surface mount contact regions along an edge thereof electrically connected to the two or more conductive elements,

attaching the at least one interposer element to at least one of the first and second ends of the device body with the conductive elements of the at least one interposer element in electrical contact with the conductive pad regions on at least one of the first and second ends of the device body;

mounting the transducer device on the substrate with the two or more surface mount contact regions electrically connected to the two or more surface mount contact pads of the substrate such that the axis of sensitivity of the sensing element is perpendicular to the mounting plane defined by the substrate.

37. The method of claim 36, wherein the at least one interposer element includes a first and a second multilayer end cap, the first multilayer end cap connected to the first end of the device body and the second multilayer end cap connected to the second end of the device body, wherein each of the first and second multilayer end caps includes two or more conductive elements on one side thereof for electrical connection to the two or more conductive pad regions on each of the first and second ends of the device body, respectively, wherein each of the first and second multilayer end caps includes two or more conductive traces electrically connected to the two or more conductive elements thereof, each of the two or more conductive traces of each of the first and second multilayer end caps terminating at a surface mount contact region along at least one edge thereof, and further wherein the surface mount contact regions are electrically connected to the two or more surface mount contact pads of the substrate such that the axis of sensitivity of the sensing element is perpendicular to the mounting plane defined by the substrate.

38. The method of claim 37, where each of the first and second multilayer end caps includes generally parallel first and second sides extending between first and second edges thereof, wherein at least one of the first and second edges of the first and second multilayer end caps lies in the plane defined by the principal surface, wherein the first side of each of the first and second multilayer end caps includes the two or more conductive elements for electrical connection to the two or more conductive pad regions on each of the first and second ends of the device body, respectively, wherein the second side of each of the multilayer end caps includes the two or more conductive traces with each conductive trace electrically connected to at least one conductive element on the first side thereof, and further wherein each of the two or more conductive traces on the second side of each of the first and second multilayer end caps terminates in the surface mount contact region along the at least one of the first and second edges lying in the plane defined by the first principal surface.

39. The method of claim 38, wherein the device body includes a second principal surface extending between the first and second ends thereof generally parallel to the first principal surface, wherein the axis of sensitivity is perpendicular to a plane defined by the second principal surface, and further wherein each of the two or more conductive traces on the second side of each of the first and second multilayer end caps terminate in a surface mount contact region along the first edge of the respective multilayer end cap lying in the plane defined by the first principal surface and a surface mount contact region along the second edge of the respective multilayer end cap lying in the plane defined by the second principal surface.

40. The method of claim 36, wherein the sensing element is an accelerometer sensing element.

41. The method of claim 40, wherein the accelerometer sensing element is a capacitive sensing element with one or more electrodes lying in corresponding planes generally parallel to the first principal surface and perpendicular to the axis of sensitivity.

42. The method of claim 36, wherein the two or more conductive pad regions on each of the first and second ends of the device body of the sensing element are symmetrically distributed relative to the longitudinal axis, and further wherein the two or more conductive elements of the at least one interposer element are positioned for electrical contact with the symmetrically distributed conductive pad regions.

43. The method of claim 36, wherein each of the surface mount contact regions includes a portion lying along the plane defined by the first principal surface.

44. The method of claim 43, wherein each of the surface mount contact regions includes a conductive lined opening having a conductive opening edge lying in the plane defined by the first principal surface.

45. A method for providing an accelerometer device for use in a medical device, the method comprising the steps of:

providing an accelerometer sensing element having an axis of sensitivity, wherein the accelerometer sensing element includes a device body having a longitudinal axis extending between generally parallel first and second ends thereof, wherein the accelerometer sensing element further includes a first principal surface extending between the first and second ends of the device body parallel to the longitudinal axis, wherein the axis of sensitivity is perpendicular to a plane defined by the first principal surface, and further wherein the accelerometer sensing element includes two or more conductive pad regions on each of the first and second ends of the device body;

providing a first and a second multilayer end cap, wherein each of the first and second multilayer end caps includes two or more conductive elements on one side thereof and further includes two or more conductive traces electrically connected to the two or more conductive elements thereof, each of the two or more conductive traces of each of the first and second multilayer end caps terminating at a surface mount contact region along at least one edge thereof; and

attaching the first and second multilayer end caps to the first and second ends of the device body, respectively, the conductive elements of the first and second multilayer end caps in electrical contact with the conductive pad regions of the respective first and second ends of the device body.

46. The method of claim 45, wherein each of the first and second multilayer end caps includes generally parallel first and second sides extending between first and second edges thereof, wherein at least one of the first and second edges of the first and second multilayer end caps lies in the plane defined by the first principal surface, wherein the first side of each of the first and second multilayer end caps includes the two or more conductive elements for electrical connection to the two or more conductive pad regions on each of the first and second ends of the device body, respectively, wherein the second side of each of the multilayer end caps includes the two or more conductive traces with each conductive trace electrically connected to at least one conductive element on the first side thereof, and further wherein each of the two or more conductive traces on the second side of each of the first and second multilayer end caps terminates in a surface mount contact region along the at least one of the first and second edges lying in the plane defined by the first principal surface.

47. The method of claim 46, wherein the device body includes a second principal surface extending between the first and second ends thereof generally parallel to the first principal surface, wherein the axis of sensitivity is perpendicular to a plane defined by the second principal surface, and further wherein each of the two or more conductive traces on the second side of each of the first and second multilayer end caps terminate in a surface mount contact region along the first edge of the respective multilayer end cap lying in the plane defined by the first principal surface and a surface mount contact region along the second edge of the respective multilayer end cap lying in the plane defined by the second principal surface.

48. The method of claim 45, wherein the accelerometer sensing element is a capacitive sensing element with one or more electrodes lying in corresponding planes generally parallel to the first principal surface and perpendicular to the axis of sensitivity.

49. The method of claim 45, wherein the two or more conductive pad regions on each of the first and second ends of the device body of the accelerometer sensing element are symmetrically distributed relative to the longitudinal axis, and further wherein the two or more conductive elements on the first side of each of the first and second multilayer end caps are positioned for electrical contact with the symmetrically distributed conductive pad regions.

50. The method of claim 45, wherein each of the surface mount contact regions along the at least one edge includes a conductive lined opening having a conductive opening edge lying in the plane defined by the first principal surface.

51. The method of claim 45, wherein the medical device includes a medical device selected from one of a pacemaker, a defibrillator, a brain stimulator, a cardioverter/defibrillator, a neurostimulator, a muscle stimulator, a pacemaker/cardioverter/defibrillator, a gastric stimulator, an implantable monitor, a hemodynamic monitor, and a drug pump, and further wherein the method includes enclosing the accelerometer device within a housing of the medical device.

52. A method of providing a transducer device, the method comprising the steps of:

providing a sensing element having an axis of sensitivity, wherein the sensing element includes a device body having a longitudinal axis extending between first and second ends thereof, wherein the sensing element further includes a first principal surface extending between the first and second ends of the device body parallel to the longitudinal axis, wherein the axis of sensitivity is perpendicular to a plane defined by the first principal surface, and further wherein the sensing element includes two or more conductive pad regions on at least one of the first and second ends of the device body;

providing at least one interposer element, wherein the at least one interposer element includes two or more conductive elements along one side thereof and two or more surface mount contact regions along an edge thereof electrically connected to the two or more conductive elements; and

attaching the at least one interposer element to at least one of the first and second ends of the device body with the conductive elements of the at least one interposer element in electrical contact with the conductive pad regions of one of the first and second ends of the device body.

53. The method of claim 52, wherein the at least one interposer element includes a first and second multilayer end cap, the first multilayer end cap connected to the first end of the device body and the second multilayer end cap connected to the second end of the device body, wherein each of the first and second multilayer end caps includes two or more conductive elements on one side thereof for electrical connection to the two or more conductive pad regions on each of the first and second ends of the device body, respectively, and further wherein each of the first and second multilayer end caps includes two or more conductive traces electrically connected to the two or more conductive elements thereof, each of the two or more conductive traces of each of the first and second multilayer end caps terminating at a surface mount contact region along at least one edge thereof.

54. The method of claim 53, where each of the first and second multilayer end caps includes generally parallel first and second sides extending between first and second edges thereof, wherein at least one of the first and second edges of the multilayer end cap lies in the plane defined by the first principal surface, wherein the first side of each of the first and second multilayer end caps includes the two or more conductive elements for electrical connection to the two or more conductive pad regions on each of the first and second ends of the device body, respectively, wherein the second side of each of the multilayer end caps includes the two or more conductive traces with each conductive trace electrically connected to at least one conductive element on the first side thereof, and further wherein each of the two or more conductive traces on the second side of each of the first and second multilayer end caps terminates in a surface mount contact region along the at least one of the first and second edges lying in the plane defined by the first principal surface.

55. The method of claim 54, wherein the device body includes a second principal surface extending between the first and second ends thereof generally parallel to the first principal surface, wherein the axis of sensitivity is perpendicular to a plane defined by the second principal surface, and further wherein each of the two or more conductive traces on the second side of each of the first and second multilayer end caps terminate in a surface mount contact region along the first edge of the respective multilayer end cap lying in the plane defined by the first principal surface and a surface mount contact region along the second edge of the respective multilayer end cap lying in the plane defined by the second principal surface.

56. The method of claim 53, wherein the sensing element is an accelerometer sensing element.

57. The method of claim 56, wherein the accelerometer sensing element is a capacitive sensing element with one or more electrodes lying in corresponding planes generally parallel to the first principal surface and perpendicular to the axis of sensitivity.

58. The method of claim 53, wherein the two or more conductive pad regions on the at least one of the first and second ends of the device body of the sensing element are symmetrically distributed relative to the longitudinal axis, and further wherein the two or more conductive elements of the at least one interposer element are positioned for electrical contact with the symmetrically distributed conductive pad regions.

59. The method of claim 53, wherein each of the surface mount contact regions includes a portion lying along the plane defined by the first principal surface.

60. The method of claim 59, wherein each of the surface mount contact regions includes a conductive lined opening having a conductive opening edge lying in the plane defined by the first principal surface.