In-line sputter deposition system

• US 6,217,272 B1
• Filed: 09/23/1999
• Issued: 04/17/2001
• Est. Priority Date: 10/01/1998
• Status: Expired due to Term

• Current Assignee: Tel Nexx, Inc. (Tokyo Electron Limited)
• Original Assignee: Applied Science and Technology, Inc. (MKS Instruments Incorporated)
• Inventors: Felsenthal, David, Lee, Chunghsin, Sferlazzo, Piero
• Primary Examiner(s): Bratlie, Steven A.
• Application Number:
  US09/404,516
• Time in Patent Office: 572 Days
• Field of Search: 414/217, 414/939, 414/935, 414/941
• US Class Current: 414/217
• CPC Class Codes: C23C 14/027 Graded interfaces
• CPC Class Codes: C23C 14/3407 Cathode assembly for sputtering apparatus, e.g. Target
• CPC Class Codes: C23C 14/35 by application of a magnetic field, e.g. magnetron sputtering C23C14/3457 takes precedence
• CPC Class Codes: C23C 14/352 using more than one target C23C14/56 takes precedence
• CPC Class Codes: C23C 14/566 using a load-lock chamber
• CPC Class Codes: C23C 14/568 Transferring the substrates through a series of coating stations C23C14/562 takes precedence
• CPC Class Codes: H01J 37/3405 Magnetron sputtering
• CPC Class Codes: H01J 37/3429 Plural materials
• CPC Class Codes: Y10S 414/135 Associated with semiconductor wafer handling
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber
• CPC Class Codes: Y10S 414/141 includes means for gripping wafer

Abstract

An apparatus for simultaneously transporting and processing substrates is described. The apparatus includes a load lock that stores at least one substrate prior to processing and that stores at least one substrate after processing. A first transport mechanism transports at least one substrate into and out of the load lock. A multi-stage elevator is adapted to receive the first transport mechanism. A first process chamber is vertically disposed from the multi-stage elevator. The multi-stage elevator vertically transports at least one substrate into and out of the first process chamber. A second process chamber may be coupled to the multi-stage elevator. A second transport mechanism transports at least one substrate between the multi-stage elevator and the second process chamber.

Claims

1. An apparatus for simultaneously transporting and processing substrates, the apparatus comprising:

a) a load lock that stores at least one substrate prior to processing and that stores at least one substrate after processing;

b) a first transport mechanism that transports at least one substrate into and out of the load lock;

c) a multi-stage elevator that is adapted to receive the first transport mechanism; and

d) a first process chamber vertically disposed from the multi-stage elevator,

wherein the multi-stage elevator vertically transports at least one substrate into and out of the first process chamber.

2. The apparatus of claim 1 wherein the load lock comprises a vacuum load lock.

3. The apparatus of claim 1 wherein the load lock comprises a first valve that defines a first end of the load lock and a second valve that defines a second end of the load lock, the second end of the load lock being adjacent to the multi-stage elevator.

4. The apparatus of claim 1 further comprising:

a) a second process chamber coupled to the multi-stage elevator; and

b) a second transport mechanism that transports at least one substrate between the multi-stage elevator and the second process chamber.

5. The apparatus of claim 4 wherein the apparatus simultaneously transports at least one substrate into or out of the load lock while processing at least one substrate in at least one of the first process chamber and the second process chamber.

6. The apparatus of claim 4 wherein the apparatus simultaneously processes at least one substrate in both the first process chamber and the second process chamber.

7. The apparatus of claim 4 wherein at least one of the first process chamber and the second process chamber comprises a sputter cleaning chamber.

8. The apparatus of claim 4 wherein at least one of the first process chamber and the second process chamber comprises a sputter deposition chamber.

9. The apparatus of claim 4 wherein at least one of the first transport mechanism and the second transport mechanism comprises a plurality of substantially solid members.

10. The apparatus of claim 4 wherein at least one of the first transport mechanism and the second transport mechanism comprises a plurality of tubes.

11. The apparatus of claim 4 wherein the second process chamber further comprises:

a) a plurality of magnetrons mounted on a rotatable member, wherein a predetermined one of the plurality of magnetron is positionable proximate to a substrate in the second process chamber; and

b) a transport mechanism that transports the substrate proximate to the predetermined one of the plurality of magnetron in a first and a second direction.

12. The apparatus of claim 11 wherein the rotatable member defines an aperture.

13. The apparatus of claim 11 wherein the second direction is substantially opposite to the first direction.

14. The apparatus of claim 1 wherein the multi-stage elevator comprises:

a) a first elevator stage adapted to support at least one substrate;

b) a second elevator stage adapted to support at least one substrate, the second elevator stage being vertically aligned and separated from the first elevator stage,

wherein the first elevator stage and the second elevator stage are adapted to accept the first transport mechanism.

15. The apparatus of claim 1 further comprising a robot arm that loads at least one substrate into and out of the first end of the load lock.

16. The apparatus of claim 15 wherein the robot arm is positioned in an atmospheric pressure environment.

17. The apparatus of claim 1 wherein at least one substrate comprises a semiconductor wafer.

18. The apparatus of claim 1 wherein at least one substrate is positioned on a pallet.

19. A method of simultaneously transporting a batch of substrates in an apparatus while processing a batch of substrates in at least one process chamber of the apparatus, the method comprising the steps of:

a) transporting a first batch of substrates from a substrate carrier into a load lock;

b) transporting the first batch of substrates from the load lock to a first stage of a multi-stage elevator;

c) positioning the first stage of the multi-stage elevator supporting the first batch of substrates into a first chamber;

d) processing the first batch of substrates in the first chamber with a first process;

e) positioning the first stage of the multi-stage elevator supporting the first batch of processed substrates adjacent to a second chamber;

f) transporting the first batch of processed substrates from the first stage of the multi-stage elevator to the second chamber; and

g) transporting a second batch of substrates from a substrate carrier into the load lock.

20. The method of claim 19 further comprising the steps of:

a) transporting the second batch of substrates from the load lock to the first stage of the multi-stage elevator; and

b) positioning the first stage of the multi-stage elevator supporting the second batch of substrates into the first chamber.

21. The method of claim 20 further comprising the step of simultaneously processing the first batch of substrates in the second chamber with a second process and the second batch of substrates in the first chamber with the first process.

22. The method of claim 21 further comprising the steps of:

a) transporting the first batch of processed substrates from the second chamber to a second stage of the multi-stage elevator; and

b) positioning the first stage of the multi-stage elevator with the second batch of substrates adjacent to the second process chamber.

23. The method of claim 22 further comprising the step of transporting the second batch of processed substrates from the first stage of the multi-stage elevator to the second process chamber.

24. The method of claim 23 further comprising the steps of:

a) transporting a third batch of substrates from a substrate carrier into the load lock;

b) transporting the third batch of substrates from the load lock to the first stage of the multi-stage elevator; and

c) positioning the first stage of the multi-stage elevator with the third batch of substrates in the first process chamber.

25. The method of claim 24 further comprising the step of simultaneously processing the second batch of substrates in the second chamber with a second process and the third batch of substrates in the first chamber with the first process.

26. The method of claim 25 further comprising the steps of:

a) transporting the first batch of substrates from the second stage of the multi-stage elevator to the load lock; and

b) transporting the first batch of substrates from the load lock to the substrate carrier.

27. The method of claim 26 wherein the following steps occur simultaneously:

a) transporting the first batch of substrates from the second stage of the multi-stage elevator to the load lock;

b) transporting the first batch of substrates from the load lock to the substrate carrier; and

c) simultaneously processing the second batch of substrates in the second chamber with a second process and the third batch of substrates in the first chamber with the first process.