Smart microsensor arrays with silicon-on-insulator readouts for damage control

• US 6,218,687 B1
• Filed: 12/21/1998
• Issued: 04/17/2001
• Est. Priority Date: 12/21/1998
• Status: Expired due to Fees

• Current Assignee: General Atomics, Inc.
• Original Assignee: General Atomics, Inc.
• Inventors: Ziegler, John Paul
• Primary Examiner(s): MINTEL, WILLIAM A
• Application Number:
  US09/217,497
• Time in Patent Office: 848 Days
• Field of Search: 257/252, 257/253, 257/254, 257/414, 257/415, 257/417, 257/420, 257/418, 438/49, 438/50, 438/52, 438/54, 737/27, 737/23, 737/20, 737/18, 735/141.6, 204/430, 204/431
• US Class Current: 257/253
• CPC Class Codes: H01L 29/66 Types of semiconductor device ; Multistep manufacturing processes therefor
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A microsensor for identifying a change in a characteristic of an environment having temperatures of up to approximately five hundred degrees Centigrade includes a substantially flat insulator layer made of silicon oxide. A base layer made of silicon is integrally attached to one side of the insulator layer and a support layer is integrally attached to the other side of the insulator layer. Together the base layer and the support layer stabilize the support layer which is only about one thousand angstroms thick. A sensor element is mounted on the exposed surface of the support layer, and opposite the insulator layer, to generate a signal in response to the change in the environmental characteristic. Additionally, there is an electronic element which is processed into the support layer. This electronic element is electrically connected directly with the sensor element to process the signal and indicate an appropriate response.

Claims

1. A microsensor for identifying a change in a characteristic of an environment having temperatures below approximately five hundred degrees Centigrade which comprises:

a substantially flat insulator layer, said insulator layer having a first surface and a second surface;

a base layer integrally attached to said insulator layer to cover said second surface thereof to stabilize said insulator layer;

a support layer integrally attached to said insulator layer to cover said first surface thereof, said support layer having an exposed surface;

a plurality of sensor elements processed into said exposed surface of said support layer to generate a respective plurality of signals in response to the change in the environment characteristic; and

a plurality of electronic elements, each said electronic element being connected directly with at least one said sensor element to collectively process said signals.

2. A microsensor as recited in claim 1 wherein said support layer is silicon, said insulator layer is silicon oxide, and said base layer is silicon.

3. A microsensor as recited in claim 1 wherein said electronic element is processed into the support layer.

4. A microsensor as recited in claim 1 wherein said sensor element is a cermet.

5. A microsensor as recited in claim 1 wherein said sensor element is a ring oscillator.

6. A microsensor as recited in claim 1 wherein said sensor is a metal oxide.

7. A microsensor as recited in claim 1 wherein said support layer has a thickness between said first layer of said insulator layer and said exposed layer of said support layer, said thickness being approximately one thousand angstroms.

8. A microsensor for identifying a change in a characteristic of an environment having temperatures below approximately five hundred degrees Centigrade which comprises:

a support layer made of silicon having a first surface and a second surface with an edge therebetween, said support layer being substantially flat and having a thickness between said first surface and said second surface of less than approximately two thousand angstroms;

a plurality of sensor elements mounted on said first surface of said support layer to generate a respective plurality of signals in response to the change in the environment characteristic; and

a plurality of electronic elements, each said electronic element being connected directly with at least one said sensor element to collectively process said signals.

9. A microsensor as recited in claim 8 further comprising a substantially flat insulator layer made of silicon oxide attached to said support layer to cover said second surface thereof.

10. A microsensor as recited in claim 9 further comprising a base layer integrally attached to said insulator layer opposite said support layer thereon to cover said insulator layer for stabilizing said insulator layer.

11. A microsensor as recited in claim 8 wherein said electronic element is processed into the support layer.

12. A microsensor as recited in claim 8 wherein said sensor element is a cermet.

13. A microsensor as recited in claim 8 wherein said sensor element is a ring oscillator.

14. A microsensor as recited in claim 8 wherein said sensor is a metal oxide.