Circuit arrangement of modular design, in particular for propulsion off a railroad vehicle

• US 6,218,792 B1
• Filed: 09/07/1999
• Issued: 04/17/2001
• Est. Priority Date: 09/09/1998
• Status: Expired due to Fees

• Current Assignee: DaimlerChrysler Rail Systems GmbH (Bombardier Incorporated)
• Original Assignee: Daimler Chrysler Company LLC (Stellantis NV)
• Inventors: Berth, Matthias, Schifferli, Rolf
• Primary Examiner(s): Nappi, Robert E.
• Assistant Examiner(s): Duda, Rina I.
• Application Number:
  US09/390,676
• Time in Patent Office: 588 Days
• Field of Search: 318/34, 318/38, 318/111, 318/112, 318/113, 105/49, 105/140, 363/65, 361/728, 361/729, 361/733
• US Class Current: 318/38
• CPC Class Codes: B60L 2200/26 Rail vehicles
• CPC Class Codes: B60L 9/28 polyphase motors

Abstract

A circuit arrangement (3) of modular design, in particular for propulsion of a railroad vehicle, having at least two series-connected, power-electronic modules (M₁, M₂, . . . M_n), which each have a DC isolation point. A first (M₁) of these modules is connected to high voltage and a second (M₁) is connected to frame or ground potential. The first module (M₁) has a first power-electronics assembly (4) which is at high voltage and is connected to a power-electronics assembly (4) (which is at a lower potential) of the second or of a third module (M₂). The power-electronics assemblies (4) of each module are arranged in one of several equivalent and dielectric material housings (10), each of which is normally designed in a cuboid shape. The housings (10) are arranged parallel and at a short distance away from one another with regard to their height on a plate (9) which is at frame or ground potential. On its top surface (11), bottom surface (12) and front face (13), each housing (12) has an electrically conductive layer which is connected to frame or ground potential. An electrical connection for a contact (16, 17) of a contact arrangement which produces the series circuit of these two modules (M₁, M₂) is passed through the mutually facing side surfaces (14, 15) of the dielectric material housings (10) of in each case two of the modules (M₁, M₂). The devices (4) and the contact arrangement are thus shielded in a dielectric beneficial manner.

Claims

1. A circuit arrangement of modular design, having at least two series-connected, power-electronic modules, which each have a DC isolation point and of which a first module is connected to high voltage, and a second module is connected to frame potential, in which case the first module has a first power-electronics assembly which is at high voltage and is connected to a lower potential of a power-electronics assembly of at least one of the second and a third module, wherein the power-electronics assemblies of the at least two of the first, second and third modules are each arranged in a dielectric material housing which is in a cuboid shape, the dielectric material housings being of identical design, arranged parallel to one another and, with regard to their height a short distance apart from one another, on a plate which is at frame potential, and each dielectric material housing having an electrically conductive layer which is connected to the frame potential on its top surface and bottom surface as well as on its front face which is terminated at a front of the dielectric material housing, and wherein an electrical connection for a contact of a contact arrangement which produces a series circuit of the at least two modules is in each case passed through mutually facing side surfaces of the dielectric material housing of each of the at least two modules.

2. The circuit arrangement as claimed in claim 1, wherein the modules, are in each case mounted on the plate such that they can be moved vertically with respect to the front face of the dielectric material housing.

3. The circuit arrangement as claimed in claim 2, wherein the contact arrangement can be operated by moving two adjacent modules with respect to one another.

4. The circuit arrangement as claimed in claim 3, wherein the contact of the contact arrangement has a guide surface for a mating contact of the contact arrangement, which guide surface is aligned at an angle with respect to a pushing direction.

5. The circuit arrangement as claimed in claim 1, wherein the bottom surface of at least one of the modules has a guide element which can be moved on the plate.

6. The circuit arrangement as claimed in claim 5, wherein the guide element is designed like a slide.

7. The circuit arrangement as claimed in claim 6, wherein the slide has at least one handle which overhangs at least one of the front face and a rear face of the dielectric material housing.

8. The circuit arrangement as claimed in claim 7, wherein rollers which are supported on guide rails on the plate are mounted on the runners of the slide.

9. The circuit arrangement as claimed in claim 1, in combination with a railroad vehicle propulsion system.

10. The circuit arrangement as claimed in claim 1, wherein said frame potential is at ground potential.