Electrically isolated power switching device mounting assembly for EMI reduction

• US 6,219,245 B1
• Filed: 04/18/2000
• Issued: 04/17/2001
• Est. Priority Date: 04/18/2000
• Status: Expired due to Fees

• Current Assignee: GM Global Technology Operations LLC (General Motors Company)
• Original Assignee: General Motors Corporation (Motors Liquidation Co. GUC Trust)
• Inventors: Ward, Terence G., Nagashima, James, Downer, Scott D.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US09/551,249
• Time in Patent Office: 364 Days
• Field of Search: 361/702-719, 361/600, 361/679, 361/686, 361/687-689, 361/701, 361/713-723, 361/816, 361/818, 361/735, 361/736, 361/750, 361/752, 361/753, 361/683, 361/685, 361/804, 165/80.3, 165/80.4, 165/46, 165/146, 165/104.33, 165/185, 174/50-51, 174/50.52, 174/16.3, 174/35.MS, 174/50.54, 174/58, 174/35.R, 174/35.GC, 428/64, 428/65, 428/195, 428/522, 293/900.3, 295/21, 295/05, 295/57, 251/712-718, 251/706-708, 251/746, 251/747, 251/668, 251/684, 251/796, 251/692, 251/687, 318/139, 318/494, 318/504, 318/432-433, 364/424.01, 307/9.1, 307/10.1, 307/147, 307/58, 307/45, 307/82, 363/141
• US Class Current: 361/705
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A power electronics chassis (10) and liquid-cooled heat sink mounting assembly for electric vehicles and other applications that use liquid coolant to cool power electronic devices (20) contained within an electrically conductive housing (12). The power electronics chassis (10) includes an inverter (18) containing power switching devices (20) that are heat sunk using the liquid-cooled mounting assembly. The mounting assembly includes a heat exchanger (22) and a plastic, electrically non-conductive coolant manifold (16) that has an inlet (26) and outlet (28) for passage of liquid coolant into and out of the electronics housing (12). The power switching devices (20) are attached to a mounting surface (40) of the heat exchanger (22) and are thermally coupled to the coolant within the heat exchanger (22) via the mounting surface (40). The inlet (26) and outlet (28) of the plastic coolant manifold (16) are connected to the heat exchanger (22) by conduits (30,32) to thereby permit circulation of liquid coolant into the chassis housing (12), through the heat exchanger (22), and back out of the chassis housing (12) while maintaining electrical isolation between the liquid coolant and chassis housing (12). This configuration significantly reduces the radiated EMI by significantly reducing the parasitic capacitance between the switching devices (20) and chassis housing (12).

Claims

1. A liquid cooled mounting assembly for heat sinking one or more power switching devices within an electrically conductive electronics housing, said mounting assembly comprising:

a heat exchanger having a mounting surface and an internal space for containing a volume of liquid coolant within said heat exchanger, said internal space being defined at least in part by a wall having an inner surface that is thermally coupled to said mounting surface, whereby heat received by said heat exchanger at said mounting surface can be conducted to said internal space;

at least one power switching device supported by and thermally coupled to said mounting surface of said heat exchanger, whereby heat generated by said power switching device is thermally coupled to said internal space within said heat exchanger; and

an electrically non-conductive coolant manifold coupled to said heat exchanger, said coolant manifold having an inlet and outlet for passage of liquid coolant into and out of the electrically conductive electronics housing, said inlet and outlet being in fluidic communication with said internal space of said heat exchanger, whereby said coolant manifold permits circulation of liquid coolant into the conductive electronics housing, through said heat exchanger, and back out of the electronics housing while maintaining electrical isolation between the liquid coolant and electronics housing.

2. A mounting assembly as defined in claim 1, wherein said power switching device is thermally coupled to said mounting surface using a non-electrically insulating thermal grease.

3. A mounting assembly as defined in claim 1, wherein said power switching device is thermally coupled to said mounting surface using a thermally conductive gasket.

4. A mounting assembly as defined in claim 1, further comprising a plurality of power switching devices supported by and thermally coupled to said mounting surface of said heat exchanger.

5. A mounting assembly as defined in claim 1, wherein said heat exchanger includes an electrically conductive path between said mounting surface and said internal space.

6. A power electronics chassis, comprising:

an electrically conductive housing having at least one exterior wall;

a heat exchanger located within said housing and being electrically isolated from said housing;

at least one power switching device supported by and thermally coupled to said heat exchanger within said housing, whereby heat generated by said power switching device is thermally coupled to said heat exchanger; and

an electrically non-conductive coolant manifold mounted at said exterior wall of said electrically conductive housing, said coolant manifold having an inlet and outlet in fluidic communication with said heat exchanger to permit circulation of liquid coolant into said housing, through said heat exchanger, and back out of said housing through said exterior wall, whereby said coolant manifold provides electrical isolation between said housing and said heat exchanger.

7. A power electronics chassis as defined in claim 6, wherein said power switching device is thermally coupled to said heat exchanger using a non-electrically insulating thermal grease.

8. A power electronics chassis as defined in claim 6, wherein said power switching device is thermally coupled to said heat exchanger using a thermally conductive gasket.

9. A power electronics chassis as defined in claim 6, further comprising a plurality of power switching devices supported by and thermally coupled to said heat exchanger.

10. A power electronics chassis as defined in claim 6, wherein said heat exchanger includes a mounting surface and an internal space for containing a volume of liquid coolant within said heat exchanger, said internal space being defined at least in part by a wall having an inner surface that is thermally coupled to said mounting surface, whereby heat received by said heat exchanger at said mounting surface can be conducted to said internal space.

11. A power electronics chassis as defined in claim 10, wherein said inlet and outlet are coupled to said internal space within said heat exchanger such that liquid coolant entering said housing via said inlet can circulate through said internal space and exit said housing via said outlet.

12. A power electronics chassis as defined in claim 10, wherein said heat exchanger includes an electrically conductive path between said mounting surface and said internal space.