Method and apparatus for reducing EMI in a computer system
First Claim
1. A multilayer printed circuit board disposed for reducing a source of electromagnetic interference (EMI) and having at least two layers, said multilayer printed circuit board comprising:
- a first conductive segment on a first layer;
a second conductive segment on the first layer, said second segment being separated from said first segment by a primary gap; and
a conductive interconnect on a second layer, said interconnect for carrying a high frequency signal therein, the second layer being disposed laterally from and substantially parallel to the first layer, said interconnect further being disposed for crossing over said first segment to said second segment in a cross-over region and wherein said first segment and said second segment are further characterized by a secondary gap in the cross-over region, the secondary gap being less than the primary gap for providing an increased coupling in the cross-over region.
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Accused Products
Abstract
A computer system includes a microprocessor, an an input coupled to provide signal inputs to the microprocessor, a mass storage coupled to the microprocessor, a video controller for coupling the microprocessor to a display, a memory coupled to provide storage to facilitate execution of computer programs by the microprocessor, and a multilayer printed circuit board for mounting the microprocessor thereon. The multilayer printed circuit board provides for reduced electromagnetic interference (EMI) and includes at least two layers. The multilayer printed circuit board further includes a first conductive segment on a first layer, a second conductive segment on the first layer, the second segment being separated from the first segment by a primary gap, and a conductive interconnect on a second layer, the interconnect for carrying a high frequency signal therein. The second layer is disposed laterally from and substantially parallel to the first layer. The interconnect is further disposed for crossing over the first segment to the second segment in a cross-over region and wherein the first segment and the second segment are further characterized by a secondary gap in the cross-over region, the secondary gap being less than the primary gap for providing an increased coupling in the cross-over region. A method for reducing a source of EMI in a multilayer printed circuit board is also disclosed.
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Citations
51 Claims
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1. A multilayer printed circuit board disposed for reducing a source of electromagnetic interference (EMI) and having at least two layers, said multilayer printed circuit board comprising:
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a first conductive segment on a first layer;
a second conductive segment on the first layer, said second segment being separated from said first segment by a primary gap; and
a conductive interconnect on a second layer, said interconnect for carrying a high frequency signal therein, the second layer being disposed laterally from and substantially parallel to the first layer, said interconnect further being disposed for crossing over said first segment to said second segment in a cross-over region and wherein said first segment and said second segment are further characterized by a secondary gap in the cross-over region, the secondary gap being less than the primary gap for providing an increased coupling in the cross-over region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A computer system comprising:
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a microprocessor;
an input coupled to provide signal inputs to said microprocessor;
a mass storage coupled to said microprocessor;
a video controller for coupling said microprocessor to a display;
a memory coupled to provide storage to facilitate execution of computer programs by said microprocessor; and
a multilayer printed circuit board for mounting said microprocessor thereon, said multilayer printed circuit board providing for reduced electromagnetic interference (EMI) and having at least two layers, further including a first conductive segment on a first layer, a second conductive segment on the first layer, the second segment being separated from the first segment by a primary gap, and a conductive interconnect on a second layer, the interconnect for carrying a high frequency signal therein, the second layer being disposed laterally from and substantially parallel to the first layer, the interconnect further being disposed for crossing over the first segment to the second segment in a cross-over region and wherein the first segment and the second segment are further characterized by a secondary gap in the crossover region, the secondary gap being less than the primary gap for providing an increased coupling in the cross-over region. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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35. A method for reducing a source of electromagnetic interference (EMI) in a multilayer printed circuit board, the multilayer printed circuit board having at least two layers, said method comprising the steps of:
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providing a first conductive segment on a first layer;
providing a second conductive segment on the first layer, the second segment being separated from the first segment by a primary gap; and
providing a conductive interconnect on a second layer, the interconnect for carrying a high frequency signal therein, the second layer being disposed laterally from and substantially parallel to the first layer, the interconnect further being disposed for crossing over the first segment to the second segment in a cross-over region and wherein the first segment and the second segment are further characterized by a secondary gap in the cross-over region, the secondary gap being less than the primary gap for providing an increased coupling in the cross-over region. - View Dependent Claims (36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51)
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Specification