Separating feeder for chip components

• US 6,220,481 B1
• Filed: 01/22/1999
• Issued: 04/24/2001
• Est. Priority Date: 01/27/1998
• Status: Expired due to Fees

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Miyamoto, Masayuki
• Primary Examiner(s): Noland, Kenneth W.
• Application Number:
  US09/235,835
• Time in Patent Office: 823 Days
• Field of Search: 221/277, 221/278, 221/217, 221/156, 221/167, 221/266
• US Class Current: 221/167
• CPC Class Codes: H05K 13/028 Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields

Abstract

A chip component feeder which has high feeding efficiency feeds chip components individually in stable orientations. The separating feeder of the present invention includes a scattering disk disposed so that the top surface thereof is inclined with respect to a horizontal plane, a transferring groove formed on the scattering disk and a cavity formed at an outer peripheral end portion of the scattering disk. When the scattering disk is rotated, chip components are dropped into the transferring groove and are aligned in a predetermined direction. After the chip components are accommodated in the cavity by gravitational force (i.e., by upward rotation of the transferring groove), separation of the chip component in the cavity from the chip components in the transferring groove can be achieved.

Claims

1. A separating feeder for chip components, comprising:

a scattering disk which is inclined with respect to a horizontal plane;

driving means for rotationally driving said scattering disk;

at least one transferring groove formed on said scattering disk and extending toward an outer periphery of said disk, wherein said at least one transferring groove aligns the chip components when the chips components are disposed therein; and

a cavity, which is associated with said at least one transferring groove and formed at an outer peripheral end portion thereof, for holding one chip component;

wherein a bottom surface of said cavity is recessed with respect to a bottom surface of said groove;

wherein chip components are separated by selectively holding the one chip component in said cavity.

2. A separating feeder according to claim 1, further comprising an outer-guide disposed at a peripheral portion of said scattering disk for preventing chip components on said scattering disk from being ejected from said scattering disk.

3. A separating feeder according to claim 2, further comprising an air-blowing nozzle disposed at a peripheral portion of said scattering disk for urging chip components in said transferring groove, except for the one chip component in said cavity, in a radially inward direction.

4. A separating feeder according to claim 1, further comprising a guide ring disposed on a top surface of said scattering disk forming a gate entrance, wherein only components which are aligned in a predetermined orientation in said groove are allowed to pass through said entrance.

5. A separating feeder according to claim 4, further comprising an inner-ring disposed on the top surface of said scattering disk, said guide ring and said inner-ring forming an annular space for accommodating a number of chip components between said inner-ring and said guide ring.

6. A separating feeder according to claim 5, further comprising an air-blowing nozzle disposed at said inner-ring for urging chip components in said transferring groove in a radially outward direction.

7. A separating feeder according to claim 1, further comprising an air-suction port disposed at said cavity of said scattering disk for holding a chip component in said cavity.

8. A separating feeder according to claim 1, wherein said scattering disk includes a plurality of transferring grooves having cavities at their respective radially distal ends.

9. A separating feeder according to claim 1, wherein said cavity is closed off at its radially distal end.

10. A separating feeder according to claim 1, wherein said transferring groove radially extends from an inner diameter of said scattering disk to an outer diameter of said scattering disk.

11. A separating feeder for chip components, comprising:

a scattering disk which is inclined with respect to a horizontal plane;

driving means for rotationally driving said scattering disk;

at least one transferring groove formed on said scattering disk and extending toward an outer periphery of said disk, wherein said at least one transferring groove aligns the chip components when the chips components are disposed therein; and

a cavity, which is associated with said at least one transferring groove and formed at an outer peripheral end portion thereof, for holding one chip component;

wherein said cavity has a concave extension in the direction of the circumference of said scattering disk;

wherein chip components are separated by selectively holding the one chip component in said cavity.

12. A method for separating chip components in a separating feeder comprising a scattering disk which is inclined with respect to a horizontal plane, at least one transferring groove which is formed on said scattering disk and extends in a radially outward direction and a cavity which is formed at an outer peripheral end portion of said at least one transferring groove, said method comprising the steps of:

dropping chip components on said scattering disk;

rotating said scattering disk;

aligning, as a result of said rotating step, chip components within said at least one transferring groove;

receiving one chip component from said at least one transferring groove into said cavity; and

holding, with said cavity, said one chip component;

wherein other chip components are separated from said one chip component held in said cavity.

13. The method according to claim 12, wherein said other chip components are separated from said one chip by air-blowing said other chip components in a direction away from said cavity.

14. The method according to claim 12, wherein said one chip is held in said cavity by air suction.

15. The method according to claim 12, further comprising the step of:

providing an outer-guide which is disposed in a peripheral portion of said scattering disk for preventing chip components on said scattering disk from being ejected from said scattering disk.

16. The method according to claim 12, further comprising the step of:

providing a gate entrance for allowing only chip components aligned in said at least one transferring groove in a predetermined orientation to move in an outward peripheral direction on said scattering disk, and said step of receiving comprises receiving chip components through said gate entrance.

17. The method according to claim 12, further comprising the step of:

urging chip components in the at least one transferring groove to move in a radially outward direction by blowing air on said components.