Method of manufacturing an enclosed transceiver

• US 6,220,516 B1
• Filed: 01/16/1998
• Issued: 04/24/2001
• Est. Priority Date: 06/17/1992
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Tuttle, John R., Tuttle, Mark E., Lake, Rickie C.
• Primary Examiner(s): TREMBLAY, MARK STEPHEN
• Application Number:
  US09/008,215
• Time in Patent Office: 1,194 Days
• Field of Search: 235/380, 235/382.5, 235/492
• US Class Current: 235/492
• CPC Class Codes: G01S 13/758 using a signal generator powered by the interrogation signal
• CPC Class Codes: G01S 13/767 Responders; Transponders teaching or practice apparatus for gun-aiming or gun-laying using reflecting targets or active targets F41G3/26
• CPC Class Codes: G06K 19/0702 the arrangement including a battery
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/073 Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/2402 Laminated, e.g. MCM-L type
• CPC Class Codes: H01L 2224/24051 Conformal with the semiconductor or solid-state device
• CPC Class Codes: H01L 2224/24225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/22 : by structural association with other equipment or articles
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 9/28 : Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines waveguide horns or mouths H01Q13/00; slot antennas H01Q13/00
• CPC Class Codes: H01Q 9/285 : Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407
• CPC Class Codes: H04L 2101/604 : Address structures or formats
• CPC Class Codes: H04L 2101/622 : Layer-2 addresses, e.g. medium access control [MAC] addresses
• CPC Class Codes: H04L 61/35 : involving non-standard use of addresses for implementing network functionalities, e.g. coding subscription information within the address or functional addressing, i.e. assigning an address to a function
• CPC Class Codes: H04L 61/5038 : for local use, e.g. in LAN or USB networks, or in a controller area network [CAN]
• CPC Class Codes: H04L 61/5046 : Resolving address allocation conflicts; Testing of addresses testing when self-assigning an address H04L61/5092
• CPC Class Codes: H04L 61/5084 : Providing for device mobility network addressing or numbering for mobility support in wireless networks H04W8/26; mobile IP H04W80/04
• CPC Class Codes: H04L 61/5092 : by self-assignment, e.g. picking addresses at random and testing if they are already in use
• CPC Class Codes: Y10T 156/103 : Encasing or enveloping the configured lamina
• CPC Class Codes: Y10T 29/49171 : with encapsulating

Abstract

The present invention teaches a method of manufacturing an enclosed transceiver, such as a radio frequency identification (“RFID”) tag. Structurally, in one embodiment, the tag comprises an integrated circuit (IC) chip, and an RF antenna mounted on a thin film substrate powered by a thin film battery. A variety of antenna geometries are compatible with the above tag construction. These include monopole antennas, dipole antennas, dual dipole antennas, a combination of dipole and loop antennas. Further, in another embodiment, the antennas are positioned either within the plane of the thin film battery or superjacent to the thin film battery.

Claims

1. A data storing device comprising:

a housing including first and second opposed major portions that are connected together;

an integrated circuit mounted to the first portion of the housing, the integrated circuit including a microprocessor and a random access memory, the random access memory being configured to store data;

a battery supported by the first portion of the housing and having first and second terminals, the first terminal being coupled to the integrated circuit; and

connection circuitry coupling the second terminal of the battery to the integrated circuit to complete a circuit, the connection circuitry including a conductor supported by the second portion of the housing and movable with the second portion of the housing.

2. A data storing device in accordance with claim 1 wherein the battery is a thin film battery.

21. A data storing device according to claim 1, wherein the conductor completes a circuit and supplies electrical power to the memory when the first and second portions of the housing are hermetically sealed together and does not complete the circuit or supply electrical power to the memory when the first and second portions are not hermetically sealed together.

22. A data storing device according to claim 1, wherein the conductor completes a circuit and supplies electrical power to the memory when the first and second portions of the housing are sealed together and does not complete the circuit or supply electrical power to the memory when the first and second portions are not sealed together.

23. A data storing device according to claim 1, wherein the first and second portions of the housing hermetically seal the integrated circuit and the battery.

24. A data storing device according to claim 1, wherein the first and second portions of the housing hermetically seal the integrated circuit and the battery when the first and second portions of the housing are mated together, and wherein the conductor completes a circuit and supplies electrical power to the memory when the first and second portions of the housing are mated together and does not complete the circuit or supply electrical power to the memory when the first and second portions are not mated together.

3. A data storing device comprising:

a housing defined by first and second housing portions, the second housing portion being movable relative to the first housing portion between mated and open positions;

a random access memory configured to store data, the random access memory being supported by the first housing portion;

a battery in the housing; and

a conductor supported by and movable with the second housing portion, the conductor connecting the battery to the random access memory when the second housing portion is in the mated position.

4. A data storing device in accordance with claim 3 wherein the random access memory comprises a static random access memory.

5. A data storing device in accordance with claim 3 and further comprising an integrated circuit including the memory, and a microprocessor, and wherein the conductor connects the battery to the integrated circuit.

6. A data storing device in accordance with claim 3 and further comprising an integrated circuit including the memory, and including a microprocessor, wherein the memory is a static random access memory, and wherein the conductor connects the battery to the integrated circuit so that the integrated circuit is powered by the battery, thereby resulting in the static random access memory being powered by the battery.

7. A data storing device in accordance with claim 3 wherein the battery comprises a thin film battery.

8. A data storing device in accordance with claim 3 wherein the housing has a thickness of about 0.03 inches.

9. A data storing device in accordance with claim 3 and further comprising an integrated circuit including the memory, including an RF transmitter, and including a microprocessor, wherein the memory is a static random access memory, and wherein the conductor connects the battery to the integrated circuit so that the integrated circuit is powered by the battery, thereby resulting in the static random access memory being powered by the battery.

10. A data storing device in accordance with claim 3 and further comprising an integrated circuit including the memory, including a microwave transmitter, including a microwave receiver, and including a microprocessor, wherein the memory is a static random access memory, and wherein the conductor connects the battery to the integrated circuit so that the integrated circuit is powered by the battery, thereby resulting in the static random access memory being powered by the battery.

11. A data storing device in accordance with claim 3 and further comprising conductive epoxy coupling the battery to the random access memory.

25. A data storing device according to claim 3, wherein the first and second housing portions enclose and hermetically seal the integrated circuit and the battery when the first and second housing portions are in the mated position.

26. A data storing device according to claim 3, wherein the conductor does not supply electrical power to the memory when the first and second housing portions are not in the mated position.

27. A data storing device according to claim 3, wherein the conductor completes a circuit and supplies electrical power to the memory when the first and second portions of the housing are sealed together and does not complete the circuit or supply electrical power to the memory when the first and second portions are not sealed together.

12. A portable data storing device comprising:

a housing defined by first and second housing portions;

an integrated circuit including a random access memory random access memory for storing the data, the integrated circuit being supported by the first housing portion;

a battery in the housing; and

a conductor supported by and movable with the second housing portion and coupling the battery to the integrated circuit.

13. A portable data storing device in accordance with claim 12 wherein the battery comprises a thin film battery.

14. A portable data storing device in accordance with claim 12 wherein the housing has a thickness of about 0.03 inches.

15. A portable data storing device in accordance with claim 12 wherein the integrated circuit comprises a microprocessor, and an RF transmitter controlled by the microprocessor.

16. A portable data storing device method in accordance with claim 12 wherein the integrated circuit comprises a microprocessor, a spread spectrum radio frequency transmitter controlled by the microprocessor, a receiver controlled by the microprocessor, and the random access memory, and wherein the random access memory is a static random access memory.

17. A portable data storing device method in accordance with claim 12 and further comprising conductive epoxy electrically coupling the integrated circuit to the battery.

28. A data storing device according to claim 12, wherein the first and second housing portions are configured to be mated and to enclose and hermetically seal the integrated circuit and the battery when the first and second housing portions are mated.

29. A data storing device according to claim 28, wherein the conductor couples the battery to the integrated circuit when the first and second housing portions are mated and does not couple the battery to the integrated circuit when the first and second housing portions are not mated.

18. A portable data storing device comprising:

a housing defined by first and second housing portions each including planar surfaces;

an integrated circuit supported from the first housing portion, the integrated circuit including a microprocessor, including a spread spectrum RF transmitter controlled by the microprocessor, including an RF receiver controlled by the microprocessor, and including a static random access memory configured to store the data;

a thin film battery in the housing; and

a conductor supported by and movable with the second housing portion, the conductor connecting the battery to the integrated circuit so that the integrated circuit is powered by the battery, thereby resulting in the static random access memory being powered by the battery.

19. A portable data storing device in accordance with claim 18 wherein the housing has a thickness of about 0.03 inches.

20. A portable data storing device in accordance with claim 18 and further comprising conductive epoxy electrically connecting the battery to the microprocessor.

30. A portable data storage device comprising:

a first housing member;

an antenna formed on the first housing member;

a second housing member configured to be mated to the first housing member;

a first battery disposed between the first and second housing members, a first electrode of the first battery contacting a first power conductor on the first housing member;

a second battery disposed between the first and second housing members, a first electrode of the second battery contacting a second power conductor on the first housing member;

an integrated circuit disposed on a side of the first housing member configured to be mated to the second housing member, the integrated circuit including a microprocessor, a RF transmitter controlled by the microprocessor, an RF receiver controlled by the microprocessor and a static random access memory coupled to the microprocessor and configured to store the data, the RF transmitter and RF receiver being operatively coupled to the antenna; and

a conductor formed on the second housing member, the conductor coupling the first and second batteries in series and supplying electrical power to the integrated circuit when the second housing member is mated to the first housing member and not coupling the first and second batteries in series or supplying electrical power to the integrated circuit when the second housing member is not mated to the first housing member.