Electrical interconnect system and method for integrating a bussed electrical distribution center with a printed circuit board

• US 6,220,876 B1
• Filed: 11/24/1999
• Issued: 04/24/2001
• Est. Priority Date: 09/29/1998
• Status: Expired due to Term

• Current Assignee: Aptiv Technologies Limited (Aptiv PLC)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Natoli, Richard Alan, Vess, David Jay, Carano, Dominic, Hawes, Kevin Joseph, Avila, Andres Eduardo, Gladd, Joseph Howard
• Primary Examiner(s): Vu, Hien
• Assistant Examiner(s): NGUYEN, TRUC T
• Application Number:
  US09/448,752
• Time in Patent Office: 517 Days
• Field of Search: 439/66, 439/76.2, 439/700, 439/824, 439/83, 439/949, 439/775, 439/78, 439/34
• US Class Current: 439/76.2
• CPC Class Codes: H01R 2201/26 for vehicles
• CPC Class Codes: H01R 9/2466 using a planar conductive structure, e.g. printed circuit board

Abstract

An integrated BEDC and PCB provided through a low cost, highly reliable interconnect system. The upper and/or lower half of the main insulation assembly of a BEDC is provided with a recess for accommodating at least an edge portion of the substrate of a PCB. The PCB is provided with apertures such as holes for receiving therethrough a bus wire and/or terminal slots through which terminals having wire slots are fixedly staked. The apertures on the PCB are arranged in a predetermined pattern so as to align with corresponding respective apertures in the form of corresponding holes and/or terminal slots on the BEDC at the recess thereof. Accordingly, with the PCB seated in the recess, as the bus wires are laid, they will pass through the holes in the PCB and/or pass through the wire slots of the terminals and thereby provide interconnection therebetween when the two halves of the main insulation assembly are united and the PCB is sandwiched therebetween. Additionally, the electrical interconnect system includes a flexible strain relief bend formed on the bus wire to provide a flexible connection.

Claims

1. An interconnect system for connecting a printed circuit board to a bussed electrical distribution center, said system comprising:

a bussed electrical distribution center having a main assembly and at least one bus wire;

a printed circuit board having a substrate and a conductive path fabricated thereon; and

an electrical interconnect connecting said at least one bus wire on said bussed electrical distribution center with said conductive path on said printed circuit board, said electrical interconnect having a flexible bend located between the bussed electrical distribution center and the printed circuit board to provide a flexible interconnection, wherein said electrical interconnect comprises a strain relief loop.

2. The interconnect system as defined in claim 1, wherein said flexible bend is formed by forcing one end of said wire relative to the opposite end of said wire.

3. The interconnect system as defined in claim 1, wherein said flexible bend is formed against the surface of a support member.

4. The interconnect system as defined in claim 1, wherein said bussed electrically distribution center further comprises a main insulation assembly having a plurality of apertures and a plurality of wiring channels selectively intersecting the plurality of apertures, with said at least one bus wire resident in said plurality of wiring channels, and said main insulation assembly having a recess intersecting a selected number of apertures in the plurality of apertures.

5. The interconnect system as defined in claim 1, wherein said substrate of said printed circuit board has an aperture intersecting said conductive path and the bus wire extends into said aperture.

6. The interconnect system as defined in claim 1, wherein said interconnect system is employed for use in an automotive vehicle.

7. The interconnect system as defined in claim 6, wherein said interconnect system is employed in an instrument panel of said automotive vehicle.

8. An interconnect system for directly connecting a printed circuit board to a bussed electrical distribution center, said system comprising:

a bussed electrical distribution center having a main assembly and at least one bus wire;

a printed circuit board having a substrate, a conductive path, and an aperture intersecting the conductive path for receiving the at least one bus wire; and

an electrical interconnect directly connecting said at least one bus wire on said bussed electrical distribution center with said conductive path on said printed circuit board and including a solder joint formed at the connection, said electrical interconnect having a flexible strain relief bend located between the bussed electrical distribution center and printed circuit board to provide a flexible strain relieved interconnection, wherein said electrical interconnect comprises a strain relief loop.

9. The interconnect system as defined in claim 8, wherein said interconnect system is employed for use in an automotive vehicle.