Process for improving the adhesion between metal and plastic in containment structures for electronic semiconductor devices

• US 6,221,696 B1
• Filed: 09/16/1999
• Issued: 04/24/2001
• Est. Priority Date: 09/17/1998
• Status: Expired due to Term

• Current Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Inventors: Crema, Paolo, Passagrilli, Carlo Alberto
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): Dang, Phuc T.
• Application Number:
  US09/397,488
• Time in Patent Office: 586 Days
• Field of Search: 438/127, 438/398, 438/15, 438/118, 437/7, 437/8, 437/209, 257/58-68, 257/72, 257/75
• US Class Current: 438/127
• CPC Class Codes: H01L 21/4821 Flat leads, e.g. lead frames with or without insulating supports
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A process comprises the following operations: forming a structure of metal elements with functions of support and electrical connection, these metal elements having a high degree of surface finish; fixing a chip of semiconductor material, containing active parts and contact pads, to an area of a metal element of the structure acting as a support; electrically connecting the contact pads of the chip to predetermined metal elements of the structure acting as terminal conductors; and incorporating in plastic the chip of semiconductor material and part of the structure of metal elements. To improve the adhesion between the structure and the plastic, at least part of the surface of the metal elements is roughened by irradiation with a laser light beam.

Claims

1. A process for the manufacture of a semiconductor device, comprising the following operations:

a. providing a chip of semiconductor material containing active parts and contact pads;

b. forming a structure of metal elements including a first metal element for support of the chip and second metal elements for electrical connection of the contact pads to an external electrical circuit, these metal elements having a high degree of surface finish;

c. fixing the chip of semiconductor material to an area of the first metal element;

d. electrically connecting the contact pads of the chip to the second metal elements;

e. roughening part of a surface of the metal elements by irradiation with a laser light beam;

f. incorporating in plastic the chip of semiconductor material and part of the structure of metal elements, the plastic contacting the part of the surface that was roughened.

2. The process according to claim 1, in which the laser light has a predetermined wavelength of between 200 and 1000 nm.

4. The process according to claim 1, in which the laser light is pulsed.

5. The process according to claim 4, in which the duration of the laser light pulses has a predetermined value of between 6 and 8 ns.

8. A semiconductor device made according to the process of claim 1, wherein the structure of metal elements is, at least partially, made from nickel-plated copper.

3. A process for the manufacture of a semiconductor device, comprising the following operations:

a. forming a structure of metal elements with functions of support and electrical connection, these metal elements having a high degree of surface finish,

b. fixing a chip of semiconductor material, containing active parts and contact pads, to an area of a metal element of the structure acting as a support,

c. electrically connecting the contact pads of the chip to predetermined metal elements of the structure acting as terminal conductors,

d. incorporating in plastic the chip of semiconductor material and part of the structure of metal elements,

wherein operation a. comprises a phase of roughening at least part of the surface of the metal elements by irradiation with a laser light beam and wherein the laser light has a wavelength of approximately 532 nm and is obtained by doubling the frequency of the radiation emitted by a laser of the neodymium YAG type.

6. A process for the manufacture of a semiconductor device, comprising the following operations:

a. forming a structure of metal elements with functions of support and electrical connection, these metal elements having a high degree of surface finish,

b. fixing a chip of semiconductor material, containing active parts and contact pads, to an area of a metal element of the structure acting as a support,

c. electrically connecting the contact pads of the chip to predetermined metal elements of the structure acting as terminal conductors,

d. incorporating in plastic the chip of semiconductor material and part of the structure of metal elements,

wherein operation a. comprises a phase of roughening at least part of the surface of the metal elements by irradiation with a laser light beam that is pulsed, wherein in each pulse the beam strikes the surface subjected to roughening on an elementary area and in which the beam is directed in such a way that the surface is struck by the beam along a predetermined path of elementary areas, the elementary areas of successive pulsed beams being made to overlap partially.

7. A process for the manufacture of a semiconductor device, comprising the following operations:

a. forming a structure of metal elements with functions of support and electrical connection, these metal elements having a high degree of surface finish,

b. fixing a chip of semiconductor material, containing active parts and contact pads, to an area of a metal element of the structure acting as a support,

c. electrically connecting the contact pads of the chip to predetermined metal elements of the structure acting as terminal conductors,

d. incorporating in plastic the chip of semiconductor material and part of the structure of metal elements,

wherein operation a. comprises a phase of roughening at least part of the surface of the metal elements by irradiation with a laser light beam and wherein the area of a metal element of the structure on which the chip of semiconductor material is fixed is not subjected to the roughening phase.

9. A process for manufacturing a semiconductor device, comprising:

fixing a chip of semiconductor material, containing active parts and contact pads, to a central area of a front face of a metal plate, the front face also having a peripheral edge surrounding the central area;

mechanically coupling a metal lead frame to the metal plate, the metal lead frame including terminal conductors with end portions fixed adjacent to the metal plate;

electrically coupling the end portions of the terminal conductors to the contact pads of the chip;

roughening the end portions of the terminal conductor and a peripheral edge of the metal plate by irradiation with a laser light beam; and

incorporating in plastic the chip, metal plate, and end portions of the terminal conductors, wherein the roughened end portions of the terminal conductor and peripheral edge of the metal plate.

10. The process according to claim 9 wherein the laser light has a predetermined wavelength of between 200 and 1000 nm.

12. The process according to claim 9, in which the laser light is pulsed.

13. The process according to claim 12, in which the duration of the laser light pulses has a predetermined value of between 6 and 8 ns.

11. A process for manufacturing a semiconductor device, comprising:

fixing a chip of semiconductor material, containing active parts and contact pads, to a central area of a front face of a metal plate, the front face also having a peripheral edge surrounding the central area;

mechanically coupling a metal lead frame to the metal plate, the metal lead frame including terminal conductors with end portions fixed adjacent to the metal plate;

electrically coupling the end portions of the terminal conductors to the contact pads of the chip; and

incorporating in plastic the chip, metal plate, and end portions of the terminal conductors, wherein the end portions of the terminal conductor and peripheral edge of the metal plate are roughened by irradiation with a laser light beam having a wavelength of approximately 532 nm and which is obtained by doubling the frequency of the radiation emitted by a laser of the neodymium YAG type.

14. A process for manufacturing a semiconductor device, comprising:

fixing a chip of semiconductor material, containing active parts and contact pads, to a central area of a front face of a metal plate, the front face also having a peripheral edge surrounding the central area;

mechanically coupling a metal lead frame to the metal plate, the metal lead frame including terminal conductors with end portions fixed adjacent to the metal plate;

electrically coupling the end portions of the terminal conductors to the contact pads of the chip; and

incorporating in plastic the chip, metal plate, and end portions of the terminal conductors, wherein the end portions of the terminal conductor and peripheral edge of the metal plate are roughened by irradiation with a laser light beam that is pulsed, wherein in each pulse the beam strikes the surfaces subjected to roughening on an elementary area and in which the beam is directed in such a way that the surface is struck by the beam along a predetermined path of elementary areas, the elementary areas of successive pulsed beams being made to overlap partially.

15. A process for manufacturing a semiconductor device, comprising:

fixing a chip of semiconductor material, containing active parts and contact pads, to a central area of a front face of a metal plate, the front face also having a peripheral edge surrounding the central area;

mechanically coupling a metal lead frame to the metal plate, the metal lead frame including terminal conductors with end portions fixed adjacent to the metal plate;

electrically coupling the end portions of the terminal conductors to the contact pads of the chip; and

incorporating in plastic the chip, metal plate, and end portions of the terminal conductors, wherein the end portions of the terminal conductor and peripheral edge of the metal plate are roughened by irradiation with a laser light beam, wherein the step of roughening the peripheral edge of the front face of the metal plate includes selectively roughening the front face so that the peripheral edge is roughened without roughening the central area.

16. A process for manufacturing a semiconductor device, comprising:

fixing a chip of semiconductor material, containing active parts and contact pads, to a central area of a front face of a metal plate, the front face also having a peripheral edge surrounding the central area;

mechanically coupling a metal lead frame to the metal plate, the metal lead frame including terminal conductors with end portions fixed adjacent to the metal plate;

electrically coupling the end portions of the terminal conductors to the contact pads of the chip; and

incorporating in plastic the chip, metal plate, and end portions of the terminal conductors, wherein the end portions of the terminal conductor and peripheral edge of the metal plate are roughened by irradiation with a laser light beam, wherein the peripheral edge of the metal plate and the end portions of the terminal conductors are roughened before the terminal conductors and chip are mechanically coupled to the metal plate.